JPS5369034A - Liquid stacking method - Google Patents

Liquid stacking method

Info

Publication number
JPS5369034A
JPS5369034A JP14378577A JP14378577A JPS5369034A JP S5369034 A JPS5369034 A JP S5369034A JP 14378577 A JP14378577 A JP 14378577A JP 14378577 A JP14378577 A JP 14378577A JP S5369034 A JPS5369034 A JP S5369034A
Authority
JP
Japan
Prior art keywords
stacking method
liquid stacking
liquid
stacking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14378577A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5537738B2 (en, 2012
Inventor
Guren Fuitsukusu Maikeru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JPS5369034A publication Critical patent/JPS5369034A/ja
Publication of JPS5537738B2 publication Critical patent/JPS5537738B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0038—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving application of liquid to the layers prior to lamination, e.g. wet laminating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/136—Coating process making radiation sensitive element

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Formation Of Insulating Films (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
JP14378577A 1976-11-29 1977-11-29 Liquid stacking method Granted JPS5369034A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/745,680 US4069076A (en) 1976-11-29 1976-11-29 Liquid lamination process

Publications (2)

Publication Number Publication Date
JPS5369034A true JPS5369034A (en) 1978-06-20
JPS5537738B2 JPS5537738B2 (en, 2012) 1980-09-30

Family

ID=24997776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14378577A Granted JPS5369034A (en) 1976-11-29 1977-11-29 Liquid stacking method

Country Status (7)

Country Link
US (1) US4069076A (en, 2012)
JP (1) JPS5369034A (en, 2012)
BE (1) BE861301A (en, 2012)
DE (1) DE2752900C2 (en, 2012)
FR (1) FR2372456A1 (en, 2012)
GB (1) GB1546290A (en, 2012)
NL (1) NL174993C (en, 2012)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6374051A (ja) * 1986-09-12 1988-04-04 イー・アイ・デュポン・ド・ネモアース・アンド・コンパニー 光重合性フイルムの積層法
JPS63153131A (ja) * 1986-09-12 1988-06-25 イー・アイ・デユポン・ド・ネモアース・アンド・コンパニー 光重合性フイルムの積層方法

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4201581A (en) * 1978-03-13 1980-05-06 Eastman Kodak Company Method of providing close contact for contact printing
US4226933A (en) * 1978-11-28 1980-10-07 Toppan Printing Co., Ltd. Method of manufacturing a decorative panel
JPS5676531A (en) * 1979-11-28 1981-06-24 Fujitsu Ltd Manufacture of semiconductor device
BR8103186A (pt) * 1980-05-27 1982-02-09 Du Pont Processo para laminar uma camada fotossensivel sobre suporte a uma superficie de substrato atraves de pressao
US4378264A (en) * 1980-05-27 1983-03-29 E. I. Du Pont De Nemours And Company Integrated laminating process
US4405394A (en) * 1980-05-27 1983-09-20 E. I. Du Pont De Nemours And Company Laminating process
DE3067682D1 (en) * 1980-06-30 1984-06-07 Ibm A process for forming microcircuits
DE3125564C2 (de) * 1981-06-29 1984-08-30 Du Pont de Nemours (Deutschland) GmbH, 4000 Düsseldorf Verfahren zur Verbesserung der Druckqualität von Hochdruckformen
US4732829A (en) * 1982-04-01 1988-03-22 Donald Sullivan Polymer printing
EP0141868A1 (en) * 1982-04-01 1985-05-22 Inc. M & T Chemicals High resolution phototransparency image forming with photopolymers
KR910005880B1 (ko) * 1984-10-29 1991-08-06 아메리칸 텔리폰 앤드 텔레그라프 캄파니 석판화 기술을 이용한 장치 및 그 제조방법
US4886727A (en) * 1985-11-25 1989-12-12 International Business Machines Corporation Method for developing negative photoresists
US4976817A (en) * 1988-12-09 1990-12-11 Morton International, Inc. Wet lamination process and apparatus
US4927733A (en) * 1988-12-23 1990-05-22 E. I. Du Pont De Nemours And Company Conformation of vacuum - laminated solder mask coated printed circuit boards by fluid pressurizing
US4971894A (en) * 1989-02-13 1990-11-20 International Business Machines Corporation Method and structure for preventing wet etchant penetration at the interface between a resist mask and an underlying metal layer
JPH0651360B2 (ja) * 1989-06-04 1994-07-06 ソマール株式会社 薄膜の張付方法及びその装置
SG63582A1 (en) * 1989-06-14 1999-03-30 Hewlett Packard Co Method for improving deposit of photoresist on wafers
US4971931A (en) * 1990-02-12 1990-11-20 Eastman Kodak Company Diffuser features for spin-coated films
US5240817A (en) * 1991-12-20 1993-08-31 E. I. Du Pont De Nemours And Company Lamination of a photopolymerizable solder mask layer to a substate containing holes using an intermediate photopolymerizable liquid layer
US5372670A (en) * 1994-02-02 1994-12-13 International Business Machines Corporation System for wet application of a dry film to a panel
US6002322A (en) * 1998-05-05 1999-12-14 Littelfuse, Inc. Chip protector surface-mounted fuse device
US6608757B1 (en) 2002-03-18 2003-08-19 International Business Machines Corporation Method for making a printed wiring board
US7247269B2 (en) * 2003-07-21 2007-07-24 Biosense Webster, Inc. Method for making a spiral array ultrasound transducer
WO2005088665A2 (en) * 2004-03-05 2005-09-22 Littelfuse, Inc. Low profile automotive fuse
TWI241001B (en) * 2004-03-26 2005-10-01 Advanced Semiconductor Eng Method of improving adhesive characteristic between photoresist layer and substrate, and bumping process
US7465343B2 (en) * 2005-05-13 2008-12-16 Hewlett-Packard Development Company, L.P. Inkjet ink for use on polymeric substrate
USD559203S1 (en) 2006-11-14 2008-01-08 Littelfuse, Inc. Indicator for a fuse
US8153019B2 (en) 2007-08-06 2012-04-10 Micron Technology, Inc. Methods for substantially equalizing rates at which material is removed over an area of a structure or film that includes recesses or crevices
CN101430507A (zh) * 2007-08-27 2009-05-13 E.I.内穆尔杜邦公司 基片上的可光聚合干膜的湿层叠以及与湿层叠有关的组合物
US20090087774A1 (en) * 2007-08-27 2009-04-02 E.I. Du Pont De Nemours And Company Compositions and methods for wet lamination of photopolymerizable dry films onto substrates
USD575746S1 (en) 2008-01-14 2008-08-26 Littelfuse, Inc. Blade fuse and fuse element therefore
USD575745S1 (en) 2008-01-14 2008-08-26 Littelfuse, Inc. Blade fuse and fuse element therefore
US8077007B2 (en) * 2008-01-14 2011-12-13 Littlelfuse, Inc. Blade fuse
CN102256446A (zh) * 2011-07-29 2011-11-23 江西鑫力华数码科技有限公司 柔性线路板的压膜方法
US9865490B2 (en) 2014-01-07 2018-01-09 Brewer Science Inc. Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3714007A (en) * 1969-12-17 1973-01-30 Progil Process for photopolymerizing unsaturated polyester resins in contact with immiscible liquids
JPS5163702A (en, 2012) * 1974-10-08 1976-06-02 Du Pont
JPS51108577A (en, 2012) * 1975-03-19 1976-09-25 Kogyo Gijutsuin

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB898871A (en) * 1959-07-20 1962-06-14 Koch Processes Ltd Improvements in or relating to printing
US3402087A (en) * 1964-12-23 1968-09-17 Eastman Kodak Co Coating non-planar surfaces
US3617411A (en) * 1969-01-14 1971-11-02 Ibm Process for etching a pattern of closely spaced conducting lines in an integrated circuit
US3629036A (en) * 1969-02-14 1971-12-21 Shipley Co The method coating of photoresist on circuit boards
DE2106574A1 (de) * 1970-03-03 1971-09-23 Shpley Co Inc Lichtempfindliches Laminat
DE2332799A1 (de) * 1973-06-28 1975-01-16 Kalle Ag Lichtempfindliches kopiermaterial und verfahren zur herstellung von siebdruckschablonen
US3976524A (en) * 1974-06-17 1976-08-24 Ibm Corporation Planarization of integrated circuit surfaces through selective photoresist masking

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3714007A (en) * 1969-12-17 1973-01-30 Progil Process for photopolymerizing unsaturated polyester resins in contact with immiscible liquids
JPS5163702A (en, 2012) * 1974-10-08 1976-06-02 Du Pont
JPS51108577A (en, 2012) * 1975-03-19 1976-09-25 Kogyo Gijutsuin

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6374051A (ja) * 1986-09-12 1988-04-04 イー・アイ・デュポン・ド・ネモアース・アンド・コンパニー 光重合性フイルムの積層法
JPS63153131A (ja) * 1986-09-12 1988-06-25 イー・アイ・デユポン・ド・ネモアース・アンド・コンパニー 光重合性フイルムの積層方法

Also Published As

Publication number Publication date
JPS5537738B2 (en, 2012) 1980-09-30
DE2752900C2 (de) 1982-09-30
FR2372456B1 (en, 2012) 1985-04-26
NL174993C (nl) 1984-09-03
US4069076A (en) 1978-01-17
NL174993B (nl) 1984-04-02
FR2372456A1 (fr) 1978-06-23
BE861301A (fr) 1978-05-29
GB1546290A (en) 1979-05-23
NL7713063A (nl) 1978-05-31
DE2752900A1 (de) 1978-06-01

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