JPS5363978A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5363978A
JPS5363978A JP14002076A JP14002076A JPS5363978A JP S5363978 A JPS5363978 A JP S5363978A JP 14002076 A JP14002076 A JP 14002076A JP 14002076 A JP14002076 A JP 14002076A JP S5363978 A JPS5363978 A JP S5363978A
Authority
JP
Japan
Prior art keywords
semiconductor device
pads
avert
equalize
temperatures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14002076A
Other languages
Japanese (ja)
Inventor
Matsuzo Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14002076A priority Critical patent/JPS5363978A/en
Publication of JPS5363978A publication Critical patent/JPS5363978A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
    • H01L2224/10125—Reinforcing structures
    • H01L2224/10126—Bump collar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To avert the concentration of large current only at the junctions near pads and equalize the temperatures on chip surface by positioning the bonding pads on the semiconductor chip near the side closes to an outside mounting heat sink.
COPYRIGHT: (C)1978,JPO&Japio
JP14002076A 1976-11-19 1976-11-19 Semiconductor device Pending JPS5363978A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14002076A JPS5363978A (en) 1976-11-19 1976-11-19 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14002076A JPS5363978A (en) 1976-11-19 1976-11-19 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5363978A true JPS5363978A (en) 1978-06-07

Family

ID=15259063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14002076A Pending JPS5363978A (en) 1976-11-19 1976-11-19 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5363978A (en)

Similar Documents

Publication Publication Date Title
JPS5239378A (en) Silicon-gated mos type semiconductor device
JPS5363978A (en) Semiconductor device
JPS53144695A (en) Semiconductor laser device
JPS5382168A (en) Lead frame for semiconductor device
JPS53135579A (en) Liquid sealing semiconductor device
JPS5378768A (en) Wire bonding method of semiconductor element
JPS5236980A (en) Heat sink for semiconductor devices
JPS5394885A (en) Mount structure for semiconductor laser element
JPS53126275A (en) Semiconductor device
JPS5411690A (en) Semiconductor laser unit
JPS52122090A (en) Semiconductor integrated circuit device
JPS5295973A (en) Manufacture of semiconductor unit with heat sink
JPS52125272A (en) Substrate to which semiconductor device is mounted
JPS5372488A (en) Photo semiconductor device
JPS5329082A (en) Semiconductor device
JPS5385160A (en) Production of semiconductor device
JPS542069A (en) Semiconductor device
JPS5286064A (en) Semiconductor device
JPS53141575A (en) Semiconductor device
JPS52129292A (en) Semiconductor laser device
JPS53147479A (en) Production of semiconductor device
JPS5379461A (en) Semiconductor device and its manufacturing process
JPS5493964A (en) Vessel for semiconductor device
JPS538058A (en) Production of semiconductor device
JPS5376661A (en) Semiconductor device