JPS5324780A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5324780A
JPS5324780A JP9869276A JP9869276A JPS5324780A JP S5324780 A JPS5324780 A JP S5324780A JP 9869276 A JP9869276 A JP 9869276A JP 9869276 A JP9869276 A JP 9869276A JP S5324780 A JPS5324780 A JP S5324780A
Authority
JP
Japan
Prior art keywords
leads
lead frame
parallel
tie
bers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9869276A
Other languages
English (en)
Inventor
Kirio Miyahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9869276A priority Critical patent/JPS5324780A/ja
Publication of JPS5324780A publication Critical patent/JPS5324780A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP9869276A 1976-08-20 1976-08-20 Lead frame Pending JPS5324780A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9869276A JPS5324780A (en) 1976-08-20 1976-08-20 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9869276A JPS5324780A (en) 1976-08-20 1976-08-20 Lead frame

Publications (1)

Publication Number Publication Date
JPS5324780A true JPS5324780A (en) 1978-03-07

Family

ID=14226548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9869276A Pending JPS5324780A (en) 1976-08-20 1976-08-20 Lead frame

Country Status (1)

Country Link
JP (1) JPS5324780A (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5740926A (en) * 1980-08-26 1982-03-06 Nec Corp Device for projection and exposure
JPS57170532A (en) * 1981-04-13 1982-10-20 Fujitsu Ltd Inspecting method for mask
JPS57203562U (ja) * 1981-06-22 1982-12-24
JPS58179343A (ja) * 1982-04-14 1983-10-20 Nec Corp 図形検査方法
JPS59208407A (ja) * 1983-05-13 1984-11-26 Toshiba Corp マスク欠陥検査装置
JPS62134160U (ja) * 1987-01-22 1987-08-24

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5740926A (en) * 1980-08-26 1982-03-06 Nec Corp Device for projection and exposure
JPS57170532A (en) * 1981-04-13 1982-10-20 Fujitsu Ltd Inspecting method for mask
JPS6348174B2 (ja) * 1981-04-13 1988-09-28 Fujitsu Ltd
JPS57203562U (ja) * 1981-06-22 1982-12-24
JPS6311742Y2 (ja) * 1981-06-22 1988-04-05
JPS58179343A (ja) * 1982-04-14 1983-10-20 Nec Corp 図形検査方法
JPS59208407A (ja) * 1983-05-13 1984-11-26 Toshiba Corp マスク欠陥検査装置
JPS62134160U (ja) * 1987-01-22 1987-08-24
JPS6315960Y2 (ja) * 1987-01-22 1988-05-06

Similar Documents

Publication Publication Date Title
GB1557061A (en) Single transverse mode operation in double heterostructure junction laser
TR19632A (tr) Polivinil kloruer,esali plastiklestirilmis ve stabilize edilmis bilesimler
JPS5324780A (en) Lead frame
ES230670U (es) Bloque de construccion hueco perfeccionado en forma de cube-ta y cerrable por caperuza.
JPS5359471A (en) Electronic watch
JPS52104290A (en) Composite analysis unit
JPS5397343A (en) Semiconductor memory cell
JPS5269016A (en) Multi-vane fan with monolithic construction
IT7830182A0 (it) Stampo mediante trasporto allo stato fuso.
JPS51126642A (en) Elavator doorway frame
JPS52154974A (en) Buffer
JPS52149325A (en) Semiconductor rectifing device
DK140512B (da) Presse til oprivning af cellerne i grønne afgrøder.
JPS5297955A (en) Preparation of hydroxylaminoanthraquinones
JPS5338975A (en) Lead frame
JPS5377485A (en) Production of piezo-vibrator
JPS5235901A (en) Selective station display circuit
JPS5215944A (en) Division construction francis type runner
JPS5390886A (en) Wiring structure
JPS5379364A (en) Output buffer circuit
JPS51132754A (en) Wide working range gate circuit
JPS5321357A (en) Connecting structure for members
JPS5222458A (en) Delay circuit
JPS51132729A (en) Magnetic-domain storage cell
JPS51126018A (en) Mnos control circuit