JPS53147468A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS53147468A
JPS53147468A JP6259177A JP6259177A JPS53147468A JP S53147468 A JPS53147468 A JP S53147468A JP 6259177 A JP6259177 A JP 6259177A JP 6259177 A JP6259177 A JP 6259177A JP S53147468 A JPS53147468 A JP S53147468A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
resist film
obviate
subjecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6259177A
Other languages
Japanese (ja)
Inventor
Goro Ikegami
Yoshihisa Shimojo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP6259177A priority Critical patent/JPS53147468A/en
Publication of JPS53147468A publication Critical patent/JPS53147468A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE: To obviate leaving resist film in opening parts by subjecting the photo resist film after exposure and developing to short-time plasma ashing.
COPYRIGHT: (C)1978,JPO&Japio
JP6259177A 1977-05-27 1977-05-27 Production of semiconductor device Pending JPS53147468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6259177A JPS53147468A (en) 1977-05-27 1977-05-27 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6259177A JPS53147468A (en) 1977-05-27 1977-05-27 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS53147468A true JPS53147468A (en) 1978-12-22

Family

ID=13204709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6259177A Pending JPS53147468A (en) 1977-05-27 1977-05-27 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS53147468A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5633827A (en) * 1979-08-29 1981-04-04 Seiko Epson Corp Photo etching method including surface treatment of substrate
JP2008098228A (en) * 2006-10-06 2008-04-24 Matsushita Electric Ind Co Ltd Manufacturing method of semiconductor chip

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834039A (en) * 1971-09-03 1973-05-15

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834039A (en) * 1971-09-03 1973-05-15

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5633827A (en) * 1979-08-29 1981-04-04 Seiko Epson Corp Photo etching method including surface treatment of substrate
JP2008098228A (en) * 2006-10-06 2008-04-24 Matsushita Electric Ind Co Ltd Manufacturing method of semiconductor chip
US7767551B2 (en) 2006-10-06 2010-08-03 Panasonic Corporation Method for fabricating semiconductor chip
JP4544231B2 (en) * 2006-10-06 2010-09-15 パナソニック株式会社 Manufacturing method of semiconductor chip

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