JPS531464A - Bonding for crystal base - Google Patents
Bonding for crystal baseInfo
- Publication number
- JPS531464A JPS531464A JP7558776A JP7558776A JPS531464A JP S531464 A JPS531464 A JP S531464A JP 7558776 A JP7558776 A JP 7558776A JP 7558776 A JP7558776 A JP 7558776A JP S531464 A JPS531464 A JP S531464A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- crystal base
- thru
- wedges
- depression
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE: To enable the bonding with high precision without developing wedges in the bonding layer, by placing the semiconductor base on the upper surface of the bonding plate on which grooves of grid shape are formed thru the bonding wax and by heating thru the depression of molding board on this.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7558776A JPS531464A (en) | 1976-06-28 | 1976-06-28 | Bonding for crystal base |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7558776A JPS531464A (en) | 1976-06-28 | 1976-06-28 | Bonding for crystal base |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS531464A true JPS531464A (en) | 1978-01-09 |
Family
ID=13580472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7558776A Pending JPS531464A (en) | 1976-06-28 | 1976-06-28 | Bonding for crystal base |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS531464A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55140232A (en) * | 1979-04-20 | 1980-11-01 | Nippon Telegr & Teleph Corp <Ntt> | Method for bonding thin piece to mounting plate |
JPS61164777A (en) * | 1985-01-17 | 1986-07-25 | Toshiba Ceramics Co Ltd | Adhesive for silicone wafer |
JPS6327576A (en) * | 1986-07-22 | 1988-02-05 | Toshiba Ceramics Co Ltd | Adhesive for use in abrasive plate |
JPH0417332A (en) * | 1990-05-10 | 1992-01-22 | Shin Etsu Handotai Co Ltd | Wafer-holding plate for polishing semiconductor wafer and its face-correction treatment |
JP2002326157A (en) * | 2001-04-27 | 2002-11-12 | Kyocera Corp | Plate for polishing wafer, and method for machining the same |
US7459397B2 (en) | 2004-05-06 | 2008-12-02 | Opnext Japan, Inc. | Polishing method for semiconductor substrate, and polishing jig used therein |
JP2013004975A (en) * | 2011-06-14 | 2013-01-07 | Boe Technology Group Co Ltd | Substrate tray and method of manufacturing flexible electronic device |
JP2013026614A (en) * | 2011-07-19 | 2013-02-04 | Disco Abrasive Syst Ltd | Method for processing device wafer |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4912991A (en) * | 1972-05-18 | 1974-02-04 | ||
JPS4958750A (en) * | 1972-10-04 | 1974-06-07 |
-
1976
- 1976-06-28 JP JP7558776A patent/JPS531464A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4912991A (en) * | 1972-05-18 | 1974-02-04 | ||
JPS4958750A (en) * | 1972-10-04 | 1974-06-07 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55140232A (en) * | 1979-04-20 | 1980-11-01 | Nippon Telegr & Teleph Corp <Ntt> | Method for bonding thin piece to mounting plate |
JPS61164777A (en) * | 1985-01-17 | 1986-07-25 | Toshiba Ceramics Co Ltd | Adhesive for silicone wafer |
JPS6327576A (en) * | 1986-07-22 | 1988-02-05 | Toshiba Ceramics Co Ltd | Adhesive for use in abrasive plate |
JPH0417332A (en) * | 1990-05-10 | 1992-01-22 | Shin Etsu Handotai Co Ltd | Wafer-holding plate for polishing semiconductor wafer and its face-correction treatment |
JP2002326157A (en) * | 2001-04-27 | 2002-11-12 | Kyocera Corp | Plate for polishing wafer, and method for machining the same |
US7459397B2 (en) | 2004-05-06 | 2008-12-02 | Opnext Japan, Inc. | Polishing method for semiconductor substrate, and polishing jig used therein |
JP2013004975A (en) * | 2011-06-14 | 2013-01-07 | Boe Technology Group Co Ltd | Substrate tray and method of manufacturing flexible electronic device |
JP2013026614A (en) * | 2011-07-19 | 2013-02-04 | Disco Abrasive Syst Ltd | Method for processing device wafer |
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