JPS5311836B2 - - Google Patents

Info

Publication number
JPS5311836B2
JPS5311836B2 JP9734475A JP9734475A JPS5311836B2 JP S5311836 B2 JPS5311836 B2 JP S5311836B2 JP 9734475 A JP9734475 A JP 9734475A JP 9734475 A JP9734475 A JP 9734475A JP S5311836 B2 JPS5311836 B2 JP S5311836B2
Authority
JP
Japan
Prior art keywords
semi
removal
heat sink
liquid metal
conductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9734475A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5220783A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9734475A priority Critical patent/JPS5220783A/ja
Publication of JPS5220783A publication Critical patent/JPS5220783A/ja
Publication of JPS5311836B2 publication Critical patent/JPS5311836B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
JP9734475A 1975-08-11 1975-08-11 Semi-conductor unit Granted JPS5220783A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9734475A JPS5220783A (en) 1975-08-11 1975-08-11 Semi-conductor unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9734475A JPS5220783A (en) 1975-08-11 1975-08-11 Semi-conductor unit

Publications (2)

Publication Number Publication Date
JPS5220783A JPS5220783A (en) 1977-02-16
JPS5311836B2 true JPS5311836B2 (ru) 1978-04-25

Family

ID=14189850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9734475A Granted JPS5220783A (en) 1975-08-11 1975-08-11 Semi-conductor unit

Country Status (1)

Country Link
JP (1) JPS5220783A (ru)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5422186A (en) * 1977-07-20 1979-02-19 Matsushita Electric Ind Co Ltd Light emitting diode device
JP6116413B2 (ja) * 2013-07-09 2017-04-19 三菱電機株式会社 電力用半導体装置の製造方法
JP2015174129A (ja) * 2014-03-17 2015-10-05 株式会社日本スペリア社 液状金属接合材並びにその接合方法

Also Published As

Publication number Publication date
JPS5220783A (en) 1977-02-16

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