IT7829676A0 - Procedimento e gas per il trattamento di dispositivi semiconduttori. - Google Patents

Procedimento e gas per il trattamento di dispositivi semiconduttori.

Info

Publication number
IT7829676A0
IT7829676A0 IT7829676A IT2967678A IT7829676A0 IT 7829676 A0 IT7829676 A0 IT 7829676A0 IT 7829676 A IT7829676 A IT 7829676A IT 2967678 A IT2967678 A IT 2967678A IT 7829676 A0 IT7829676 A0 IT 7829676A0
Authority
IT
Italy
Prior art keywords
treatment
gas
semiconductor devices
semiconductor
devices
Prior art date
Application number
IT7829676A
Other languages
English (en)
Original Assignee
Dionex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dionex Corp filed Critical Dionex Corp
Publication of IT7829676A0 publication Critical patent/IT7829676A0/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/427—Stripping or agents therefor using plasma means only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H01L21/31138—Etching organic layers by chemical means by dry-etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
IT7829676A 1977-11-11 1978-11-10 Procedimento e gas per il trattamento di dispositivi semiconduttori. IT7829676A0 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/850,713 US4303467A (en) 1977-11-11 1977-11-11 Process and gas for treatment of semiconductor devices

Publications (1)

Publication Number Publication Date
IT7829676A0 true IT7829676A0 (it) 1978-11-10

Family

ID=25308913

Family Applications (1)

Application Number Title Priority Date Filing Date
IT7829676A IT7829676A0 (it) 1977-11-11 1978-11-10 Procedimento e gas per il trattamento di dispositivi semiconduttori.

Country Status (8)

Country Link
US (1) US4303467A (it)
JP (1) JPS5489484A (it)
CA (1) CA1117400A (it)
DE (1) DE2848691A1 (it)
FR (1) FR2408913A1 (it)
GB (1) GB2008499B (it)
IT (1) IT7829676A0 (it)
NL (1) NL7811183A (it)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD150318A3 (de) * 1980-02-08 1981-08-26 Rainer Moeller Verfahren und rohrreaktor zur plasmachemischen dampfphasenabscheidung und zum plasmaaetzen
US4264409A (en) * 1980-03-17 1981-04-28 International Business Machines Corporation Contamination-free selective reactive ion etching or polycrystalline silicon against silicon dioxide
US4415402A (en) * 1981-04-02 1983-11-15 The Perkin-Elmer Corporation End-point detection in plasma etching or phosphosilicate glass
US4550239A (en) * 1981-10-05 1985-10-29 Tokyo Denshi Kagaku Kabushiki Kaisha Automatic plasma processing device and heat treatment device
US4550242A (en) * 1981-10-05 1985-10-29 Tokyo Denshi Kagaku Kabushiki Kaisha Automatic plasma processing device and heat treatment device for batch treatment of workpieces
US4462882A (en) * 1983-01-03 1984-07-31 Massachusetts Institute Of Technology Selective etching of aluminum
US4505782A (en) * 1983-03-25 1985-03-19 Lfe Corporation Plasma reactive ion etching of aluminum and aluminum alloys
JPS60240121A (ja) * 1984-05-15 1985-11-29 Fujitsu Ltd 横型炉
GB8431422D0 (en) * 1984-12-13 1985-01-23 Standard Telephones Cables Ltd Plasma reactor vessel
US4749440A (en) * 1985-08-28 1988-06-07 Fsi Corporation Gaseous process and apparatus for removing films from substrates
JPH0698292B2 (ja) * 1986-07-03 1994-12-07 忠弘 大見 超高純度ガスの供給方法及び供給系
US4793897A (en) * 1987-03-20 1988-12-27 Applied Materials, Inc. Selective thin film etch process
US5169478A (en) * 1987-10-08 1992-12-08 Friendtech Laboratory, Ltd. Apparatus for manufacturing semiconductor devices
DE68923247T2 (de) * 1988-11-04 1995-10-26 Fujitsu Ltd Verfahren zum Erzeugen eines Fotolackmusters.
US4900395A (en) * 1989-04-07 1990-02-13 Fsi International, Inc. HF gas etching of wafers in an acid processor
US5217567A (en) * 1992-02-27 1993-06-08 International Business Machines Corporation Selective etching process for boron nitride films
US5362353A (en) * 1993-02-26 1994-11-08 Lsi Logic Corporation Faraday cage for barrel-style plasma etchers
US20040213368A1 (en) * 1995-09-11 2004-10-28 Norman Rostoker Fusion reactor that produces net power from the p-b11 reaction
US6465159B1 (en) * 1999-06-28 2002-10-15 Lam Research Corporation Method and apparatus for side wall passivation for organic etch
US6664740B2 (en) * 2001-02-01 2003-12-16 The Regents Of The University Of California Formation of a field reversed configuration for magnetic and electrostatic confinement of plasma
US6611106B2 (en) * 2001-03-19 2003-08-26 The Regents Of The University Of California Controlled fusion in a field reversed configuration and direct energy conversion
JP2004273532A (ja) * 2003-03-05 2004-09-30 Hitachi High-Technologies Corp プラズマエッチング方法
US9123512B2 (en) 2005-03-07 2015-09-01 The Regents Of The Unviersity Of California RF current drive for plasma electric generation system
US8031824B2 (en) 2005-03-07 2011-10-04 Regents Of The University Of California Inductive plasma source for plasma electric generation system
US9607719B2 (en) 2005-03-07 2017-03-28 The Regents Of The University Of California Vacuum chamber for plasma electric generation system
SG11201402259YA (en) 2011-11-14 2014-06-27 Univ California Systems and methods for forming and maintaining a high performance frc
MX2016001066A (es) 2013-08-29 2016-08-03 Halliburton Energy Services Inc Metodos y sistemas para generar especies de fluoruro reactivas a partir de un precursor gaseoso en una formacion subterranea para su estimulacion.
SI3312843T1 (sl) 2013-09-24 2020-02-28 Tae Technologies, Inc. Sistemi za tvorjenje in ohranjanje visokozmogljivega FRC
PE20170757A1 (es) 2014-10-13 2017-07-04 Tri Alpha Energy Inc Sistemas y metodos para fusionar y comprimir toroides compactos
TWI654908B (zh) 2014-10-30 2019-03-21 美商堤艾億科技公司 形成及維持高效能場反轉型磁場結構的系統及方法
PT3295459T (pt) 2015-05-12 2020-11-19 Tae Tech Inc Sistemas e processos para reduzir correntes de foucault indesejáveis
EP3357067B1 (en) 2015-11-13 2021-09-29 TAE Technologies, Inc. Systems and methods for frc plasma position stability
MY194606A (en) 2016-10-28 2022-12-06 Tae Tech Inc Systems and methods for improved sustainment of a high performance frc elevated energies utilizing neutral beam injectors with tunable beam energies
AU2017355652B2 (en) 2016-11-04 2022-12-15 Tae Technologies, Inc. Systems and methods for improved sustainment of a high performance FRC with multi-scaled capture type vacuum pumping
EA201991202A1 (ru) 2016-11-15 2019-10-31 Системы и способы улучшенного поддержания высокоэффективной конфигурации с обращенным полем и нагрева электронов посредством высших гармоник быстрых волн в высокоэффективной конфигурации с обращенным полем
WO2020037264A1 (en) * 2018-08-17 2020-02-20 Life Technologies Corporation Method of forming ion sensors
EP3837539A1 (en) * 2018-08-17 2021-06-23 Life Technologies Corporation Method of forming ion sensors

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4026742A (en) * 1972-11-22 1977-05-31 Katsuhiro Fujino Plasma etching process for making a microcircuit device
US4213818A (en) * 1979-01-04 1980-07-22 Signetics Corporation Selective plasma vapor etching process

Also Published As

Publication number Publication date
GB2008499B (en) 1982-07-28
US4303467A (en) 1981-12-01
GB2008499A (en) 1979-06-06
DE2848691A1 (de) 1979-05-17
FR2408913A1 (fr) 1979-06-08
CA1117400A (en) 1982-02-02
NL7811183A (nl) 1979-05-15
JPS5489484A (en) 1979-07-16

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