JPS5297338A - Method of forming small holes - Google Patents
Method of forming small holesInfo
- Publication number
- JPS5297338A JPS5297338A JP1031677A JP1031677A JPS5297338A JP S5297338 A JPS5297338 A JP S5297338A JP 1031677 A JP1031677 A JP 1031677A JP 1031677 A JP1031677 A JP 1031677A JP S5297338 A JPS5297338 A JP S5297338A
- Authority
- JP
- Japan
- Prior art keywords
- small holes
- forming small
- forming
- holes
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/26—Perforating by non-mechanical means, e.g. by fluid jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/143—Electron beam
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/145—Infrared
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/167—X-ray
- Y10S430/168—X-ray exposure process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/948—Radiation resist
- Y10S438/95—Multilayer mask including nonradiation sensitive layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/948—Radiation resist
- Y10S438/952—Utilizing antireflective layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/978—Semiconductor device manufacturing: process forming tapered edges on substrate or adjacent layers
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2604939A DE2604939C3 (de) | 1976-02-09 | 1976-02-09 | Verfahren zum Herstellen von wenigstens einem Durchgangsloch insbesondere einer Düse für Tintenstrahldrucker |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5297338A true JPS5297338A (en) | 1977-08-16 |
JPS552475B2 JPS552475B2 (ja) | 1980-01-21 |
Family
ID=5969390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1031677A Granted JPS5297338A (en) | 1976-02-09 | 1977-02-03 | Method of forming small holes |
Country Status (7)
Country | Link |
---|---|
US (1) | US4059480A (ja) |
JP (1) | JPS5297338A (ja) |
CA (1) | CA1072219A (ja) |
DE (1) | DE2604939C3 (ja) |
FR (1) | FR2340181A1 (ja) |
GB (1) | GB1567340A (ja) |
IT (1) | IT1118002B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55121077A (en) * | 1979-03-13 | 1980-09-17 | Seiko Epson Corp | Manufacture of ink jet head |
JPS57208256A (en) * | 1981-06-18 | 1982-12-21 | Canon Inc | Ink jet head |
JPS57208255A (en) * | 1981-06-18 | 1982-12-21 | Canon Inc | Ink jet head |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4106976A (en) * | 1976-03-08 | 1978-08-15 | International Business Machines Corporation | Ink jet nozzle method of manufacture |
US4184925A (en) * | 1977-12-19 | 1980-01-22 | The Mead Corporation | Solid metal orifice plate for a jet drop recorder |
DE2802976C2 (de) * | 1978-01-24 | 1980-02-07 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren und Vorrichtung zur Herstellung von Durchbrüchen (Löchern) in Glasplatten, vorzugsweise mit feinsten Strukturen |
US4206541A (en) * | 1978-06-26 | 1980-06-10 | Extel Corporation | Method of manufacturing thin film thermal print heads |
CA1109927A (en) * | 1978-06-26 | 1981-09-29 | Edmund T. Marciniec | Manufacture of thin film thermal print head |
US4273858A (en) * | 1978-07-19 | 1981-06-16 | Somar Manufacturing Co., Ltd. | Resist material for micro-fabrication with unsaturated dicarboxylic moiety |
US4349647A (en) * | 1978-07-19 | 1982-09-14 | Somar Manufacturing Co., Ltd. | Resist material for micro-fabrication |
DE2922416A1 (de) * | 1979-06-01 | 1980-12-11 | Ibm Deutschland | Schattenwurfmaske zum strukturieren von oberflaechenbereichen und verfahren zu ihrer herstellung |
DE3070833D1 (en) * | 1980-09-19 | 1985-08-08 | Ibm Deutschland | Structure with a silicon body that presents an aperture and method of making this structure |
DE3339108A1 (de) * | 1983-10-28 | 1985-05-09 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Tonwiedergabesystem |
US4728392A (en) * | 1984-04-20 | 1988-03-01 | Matsushita Electric Industrial Co., Ltd. | Ink jet printer and method for fabricating a nozzle member |
EP0238694B1 (en) * | 1986-03-27 | 1992-01-29 | Ibm Deutschland Gmbh | Method of forming identically positioned alignment marks on opposite sides of a semiconductor wafer |
DE3917434A1 (de) * | 1989-05-29 | 1989-11-09 | Siemens Ag | Mehrschichtig aufgebauter tintendruckkopf mit durch selektives aetzen erzeugten tintenkanaelen |
JPH0680713B2 (ja) * | 1989-10-11 | 1994-10-12 | 三菱電機株式会社 | ウエハ試験用プローブカードおよびその製造方法 |
US5189777A (en) * | 1990-12-07 | 1993-03-02 | Wisconsin Alumni Research Foundation | Method of producing micromachined differential pressure transducers |
JP3290495B2 (ja) * | 1992-04-21 | 2002-06-10 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
JP3196796B2 (ja) * | 1992-06-24 | 2001-08-06 | セイコーエプソン株式会社 | インクジェット記録ヘッドのノズル形成方法 |
JPH07329304A (ja) * | 1994-04-11 | 1995-12-19 | Fujitsu Ltd | インクジェット記録装置、その記録ヘッド用ノズル板およびそのノズル板の製造方法 |
US5658471A (en) * | 1995-09-22 | 1997-08-19 | Lexmark International, Inc. | Fabrication of thermal ink-jet feed slots in a silicon substrate |
US5901425A (en) * | 1996-08-27 | 1999-05-11 | Topaz Technologies Inc. | Inkjet print head apparatus |
US6797194B1 (en) * | 1998-02-27 | 2004-09-28 | Stella Chemifa Kabushiki Kaisha | Surface treating for micromachining and method for surface treatment |
US6644789B1 (en) | 2000-07-06 | 2003-11-11 | Lexmark International, Inc. | Nozzle assembly for an ink jet printer |
US6402301B1 (en) | 2000-10-27 | 2002-06-11 | Lexmark International, Inc | Ink jet printheads and methods therefor |
US6648732B2 (en) | 2001-01-30 | 2003-11-18 | Hewlett-Packard Development Company, L.P. | Thin film coating of a slotted substrate and techniques for forming slotted substrates |
US6684504B2 (en) * | 2001-04-09 | 2004-02-03 | Lexmark International, Inc. | Method of manufacturing an imageable support matrix for printhead nozzle plates |
US6902867B2 (en) * | 2002-10-02 | 2005-06-07 | Lexmark International, Inc. | Ink jet printheads and methods therefor |
WO2007099774A1 (ja) * | 2006-02-28 | 2007-09-07 | Konica Minolta Holdings, Inc. | 液体吐出ヘッド、液体吐出装置及び液体吐出方法 |
JP4706850B2 (ja) * | 2006-03-23 | 2011-06-22 | 富士フイルム株式会社 | ノズルプレートの製造方法、液滴吐出ヘッド及び画像形成装置 |
JP4088330B1 (ja) * | 2007-05-18 | 2008-05-21 | 株式会社テスコム | 硝子穴あけ方法及び光学窓作製方法 |
JP5596919B2 (ja) * | 2008-11-26 | 2014-09-24 | キヤノン株式会社 | 半導体装置の製造方法 |
US10269863B2 (en) * | 2012-04-18 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and apparatus for via last through-vias |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3202094A (en) * | 1961-10-02 | 1965-08-24 | Little Inc A | Metal stencils and process for making them |
US3313626A (en) * | 1962-08-01 | 1967-04-11 | Russeli H Whitney | Process of making a lithographic printing plate |
US3576669A (en) * | 1968-08-15 | 1971-04-27 | Nasa | Method for coating through-holes |
US3742229A (en) * | 1972-06-29 | 1973-06-26 | Massachusetts Inst Technology | Soft x-ray mask alignment system |
US3958255A (en) * | 1974-12-31 | 1976-05-18 | International Business Machines Corporation | Ink jet nozzle structure |
-
1976
- 1976-02-09 DE DE2604939A patent/DE2604939C3/de not_active Expired
- 1976-09-29 US US05/727,831 patent/US4059480A/en not_active Expired - Lifetime
- 1976-12-22 FR FR7639684A patent/FR2340181A1/fr active Granted
-
1977
- 1977-01-10 GB GB806/77A patent/GB1567340A/en not_active Expired
- 1977-01-28 IT IT19719/77A patent/IT1118002B/it active
- 1977-02-03 JP JP1031677A patent/JPS5297338A/ja active Granted
- 1977-02-09 CA CA271,450A patent/CA1072219A/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55121077A (en) * | 1979-03-13 | 1980-09-17 | Seiko Epson Corp | Manufacture of ink jet head |
JPS626992B2 (ja) * | 1979-03-13 | 1987-02-14 | Seikoo Epuson Kk | |
JPS57208256A (en) * | 1981-06-18 | 1982-12-21 | Canon Inc | Ink jet head |
JPS57208255A (en) * | 1981-06-18 | 1982-12-21 | Canon Inc | Ink jet head |
JPH0422700B2 (ja) * | 1981-06-18 | 1992-04-20 | Canon Kk | |
JPH0459144B2 (ja) * | 1981-06-18 | 1992-09-21 | Canon Kk |
Also Published As
Publication number | Publication date |
---|---|
DE2604939C3 (de) | 1978-07-27 |
FR2340181B1 (ja) | 1980-03-14 |
US4059480A (en) | 1977-11-22 |
JPS552475B2 (ja) | 1980-01-21 |
GB1567340A (en) | 1980-05-14 |
DE2604939A1 (de) | 1977-08-11 |
IT1118002B (it) | 1986-02-24 |
CA1072219A (en) | 1980-02-19 |
DE2604939B2 (de) | 1977-11-24 |
FR2340181A1 (fr) | 1977-09-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5297338A (en) | Method of forming small holes | |
BG28052A4 (en) | Method of obtaining of aminoalkyl-heterocycles | |
BG28061A3 (en) | Method of obtaining of hexahydrodibenzopyranones | |
JPS5360191A (en) | Method of forming through hole | |
BG27734A3 (en) | Method of obtaining of m- aryloxybenzaldehydes | |
BG28068A3 (en) | Method of obtaining of 3-chlorcephalosporines | |
BG28988A4 (en) | Method of obtaining of 4- halo- dihydropropyrans | |
BG28071A3 (en) | Method of obtaining of 2-deoxystreptamineaminoglucosides | |
BG27754A3 (en) | Method of obtaining of 3- halomethylcephems | |
JPS5351253A (en) | Method of forming patterns | |
BG28845A3 (en) | Method of obtaining of n- alkyldiphenylamines | |
BG28066A3 (en) | Method of obtaining of pyridobenzodiazepinones | |
BG27755A3 (en) | Method of obtaining of 7- alkoxy- 3- chlormethilcephems | |
JPS5348676A (en) | Method of forming pattern | |
JPS531676A (en) | Method of forming screw holes | |
JPS52120269A (en) | Method of forming | |
JPS52121933A (en) | Method of embanking | |
JPS5358596A (en) | Method of making polyallylpolyamines | |
BG28417A3 (en) | Method of obtaining of trans- 5a- aryldecahydrobenzazepine | |
JPS52135067A (en) | Method of forming pattern | |
JPS5377090A (en) | Method of etherizing | |
JPS52108937A (en) | Method of polybrominating bissphenoxyalkane | |
JPS52123334A (en) | Method of forming patterns | |
JPS5358459A (en) | Method of forming step | |
JPS536345A (en) | Method of providing pattern |