JPS5252572A - Packaging construction for semiconductor element - Google Patents

Packaging construction for semiconductor element

Info

Publication number
JPS5252572A
JPS5252572A JP12856475A JP12856475A JPS5252572A JP S5252572 A JPS5252572 A JP S5252572A JP 12856475 A JP12856475 A JP 12856475A JP 12856475 A JP12856475 A JP 12856475A JP S5252572 A JPS5252572 A JP S5252572A
Authority
JP
Japan
Prior art keywords
semiconductor element
packaging construction
substrate
construction
packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12856475A
Other languages
Japanese (ja)
Inventor
Hideshi Ono
Kazunari Kume
Minoru Watanabe
Munetaka Tamaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP12856475A priority Critical patent/JPS5252572A/en
Publication of JPS5252572A publication Critical patent/JPS5252572A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To facilitate positioning and observation by using a clear member such as glass in a substrate in an element packaging construction wherein the semiconductor element is directly bonded to the substrate conductor with the electrode side of the semiconductor element being faced downward.
COPYRIGHT: (C)1977,JPO&Japio
JP12856475A 1975-10-25 1975-10-25 Packaging construction for semiconductor element Pending JPS5252572A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12856475A JPS5252572A (en) 1975-10-25 1975-10-25 Packaging construction for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12856475A JPS5252572A (en) 1975-10-25 1975-10-25 Packaging construction for semiconductor element

Publications (1)

Publication Number Publication Date
JPS5252572A true JPS5252572A (en) 1977-04-27

Family

ID=14987871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12856475A Pending JPS5252572A (en) 1975-10-25 1975-10-25 Packaging construction for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5252572A (en)

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