US4264857A
(en)
*
|
1978-06-30 |
1981-04-28 |
International Business Machines Corporation |
Constant voltage threshold device
|
US4253162A
(en)
*
|
1979-08-28 |
1981-02-24 |
Rca Corporation |
Blocked source node field-effect circuitry
|
JPS5754370A
(en)
*
|
1980-09-19 |
1982-03-31 |
Nippon Telegr & Teleph Corp <Ntt> |
Insulating gate type transistor
|
JPS5799777A
(en)
*
|
1980-12-12 |
1982-06-21 |
Toshiba Corp |
Metal oxide semiconductor type semiconductor device
|
US4883986A
(en)
*
|
1981-05-19 |
1989-11-28 |
Tokyo Shibaura Denki Kabushiki Kaisha |
High density semiconductor circuit using CMOS transistors
|
US4658279A
(en)
*
|
1983-09-08 |
1987-04-14 |
Wisconsin Alumini Research Foundation |
Velocity saturated strain sensitive semiconductor devices
|
DE3346518C1
(de)
*
|
1983-12-22 |
1989-01-12 |
Texas Instruments Deutschland Gmbh, 8050 Freising |
Feldeffekttransistor mit isolierter Gate-Elektrode
|
US4763183A
(en)
*
|
1984-08-01 |
1988-08-09 |
American Telephone And Telegraph Co., At&T Bell Laboratories |
Semiconductor-on-insulator (SOI) devices and SOI IC fabrication method
|
JPS648659A
(en)
*
|
1987-06-30 |
1989-01-12 |
Mitsubishi Electric Corp |
Supplementary semiconductor integrated circuit device
|
GB2211989A
(en)
*
|
1987-11-05 |
1989-07-12 |
Marconi Electronic Devices |
Field effect transistors
|
US5026656A
(en)
*
|
1988-02-01 |
1991-06-25 |
Texas Instruments Incorporated |
MOS transistor with improved radiation hardness
|
US4974051A
(en)
*
|
1988-02-01 |
1990-11-27 |
Texas Instruments Incorporated |
MOS transistor with improved radiation hardness
|
US4965213A
(en)
*
|
1988-02-01 |
1990-10-23 |
Texas Instruments Incorporated |
Silicon-on-insulator transistor with body node to source node connection
|
US5168337A
(en)
*
|
1988-02-19 |
1992-12-01 |
Nippondenso Co., Ltd. |
Polycrystalline diode and a method for making the same
|
US4899202A
(en)
*
|
1988-07-08 |
1990-02-06 |
Texas Instruments Incorporated |
High performance silicon-on-insulator transistor with body node to source node connection
|
US4906587A
(en)
*
|
1988-07-29 |
1990-03-06 |
Texas Instruments Incorporated |
Making a silicon-on-insulator transistor with selectable body node to source node connection
|
US5079605A
(en)
*
|
1988-07-29 |
1992-01-07 |
Texas Instruments Incorporated |
Silicon-on-insulator transistor with selectable body node to source node connection
|
US5144390A
(en)
*
|
1988-09-02 |
1992-09-01 |
Texas Instruments Incorporated |
Silicon-on insulator transistor with internal body node to source node connection
|
JP2507567B2
(ja)
*
|
1988-11-25 |
1996-06-12 |
三菱電機株式会社 |
絶縁体基板上の半導体層に形成されたmos型電界効果トランジスタ
|
JP2510710B2
(ja)
*
|
1988-12-13 |
1996-06-26 |
三菱電機株式会社 |
絶縁体基板上の半導体層に形成されたmos型電界効果トランジスタ
|
US5001528A
(en)
*
|
1989-01-31 |
1991-03-19 |
The United States Of America As Represented By The Secretary Of The Air Force |
Radiation hardened CMOS on SOI or SOS devices
|
US5160989A
(en)
*
|
1989-06-13 |
1992-11-03 |
Texas Instruments Incorporated |
Extended body contact for semiconductor over insulator transistor
|
USH1435H
(en)
*
|
1991-10-21 |
1995-05-02 |
Cherne Richard D |
SOI CMOS device having body extension for providing sidewall channel stop and bodytie
|
US5821575A
(en)
*
|
1996-05-20 |
1998-10-13 |
Digital Equipment Corporation |
Compact self-aligned body contact silicon-on-insulator transistor
|
TW363240B
(en)
*
|
1997-10-27 |
1999-07-01 |
United Microelectronics Corp |
Inspection method for transistors
|
US6046062A
(en)
*
|
1999-08-12 |
2000-04-04 |
Taiwan Semiconductor Manufacturing Company |
Method to monitor the kink effect
|
US6804502B2
(en)
|
2001-10-10 |
2004-10-12 |
Peregrine Semiconductor Corporation |
Switch circuit and method of switching radio frequency signals
|
US20050104104A1
(en)
*
|
2003-11-18 |
2005-05-19 |
Halliburton Energy Services, Inc. |
High temperature memory device
|
EP3249154A1
(en)
*
|
2003-11-18 |
2017-11-29 |
Halliburton Energy Services Inc. |
High temperature environment tool system and method
|
US7442932B2
(en)
*
|
2003-11-18 |
2008-10-28 |
Halliburton Energy Services, Inc. |
High temperature imaging device
|
US7288809B1
(en)
*
|
2003-12-16 |
2007-10-30 |
Spansion Llc |
Flash memory with buried bit lines
|
WO2006002347A1
(en)
|
2004-06-23 |
2006-01-05 |
Peregrine Semiconductor Corporation |
Integrated rf front end
|
US8742502B2
(en)
|
2005-07-11 |
2014-06-03 |
Peregrine Semiconductor Corporation |
Method and apparatus for use in improving linearity of MOSFETs using an accumulated charge sink-harmonic wrinkle reduction
|
US7890891B2
(en)
*
|
2005-07-11 |
2011-02-15 |
Peregrine Semiconductor Corporation |
Method and apparatus improving gate oxide reliability by controlling accumulated charge
|
USRE48965E1
(en)
|
2005-07-11 |
2022-03-08 |
Psemi Corporation |
Method and apparatus improving gate oxide reliability by controlling accumulated charge
|
US7910993B2
(en)
|
2005-07-11 |
2011-03-22 |
Peregrine Semiconductor Corporation |
Method and apparatus for use in improving linearity of MOSFET's using an accumulated charge sink
|
US9653601B2
(en)
|
2005-07-11 |
2017-05-16 |
Peregrine Semiconductor Corporation |
Method and apparatus for use in improving linearity of MOSFETs using an accumulated charge sink-harmonic wrinkle reduction
|
US20080076371A1
(en)
|
2005-07-11 |
2008-03-27 |
Alexander Dribinsky |
Circuit and method for controlling charge injection in radio frequency switches
|
EP3346611B1
(en)
|
2008-02-28 |
2021-09-22 |
pSemi Corporation |
Method and apparatus for use in digitally tuning a capacitor in an integrated circuit device
|
US20090251960A1
(en)
*
|
2008-04-07 |
2009-10-08 |
Halliburton Energy Services, Inc. |
High temperature memory device
|
US8482065B2
(en)
*
|
2008-11-25 |
2013-07-09 |
Newport Fab, Llc |
MOS transistor with a reduced on-resistance and area product
|
US9390974B2
(en)
|
2012-12-21 |
2016-07-12 |
Qualcomm Incorporated |
Back-to-back stacked integrated circuit assembly and method of making
|
JP5801300B2
(ja)
|
2009-07-15 |
2015-10-28 |
シランナ・セミコンダクター・ユー・エス・エイ・インコーポレイテッドSilanna Semiconductor U.S.A., Inc. |
背面放熱を伴う絶縁体上半導体
|
US8921168B2
(en)
|
2009-07-15 |
2014-12-30 |
Silanna Semiconductor U.S.A., Inc. |
Thin integrated circuit chip-on-board assembly and method of making
|
US9466719B2
(en)
|
2009-07-15 |
2016-10-11 |
Qualcomm Incorporated |
Semiconductor-on-insulator with back side strain topology
|
US9496227B2
(en)
|
2009-07-15 |
2016-11-15 |
Qualcomm Incorporated |
Semiconductor-on-insulator with back side support layer
|
KR101818556B1
(ko)
|
2009-07-15 |
2018-01-15 |
퀄컴 인코포레이티드 |
이면측 바디 연결을 가진 반도체-온-절연체
|
JP6006219B2
(ja)
|
2010-10-20 |
2016-10-12 |
ペレグリン セミコンダクター コーポレイション |
蓄積電荷シンクを用いてmosfetの線形性を改善することに使用される方法及び装置−高調波リンクルの抑制
|
US8829967B2
(en)
|
2012-06-27 |
2014-09-09 |
Triquint Semiconductor, Inc. |
Body-contacted partially depleted silicon on insulator transistor
|
US8729952B2
(en)
|
2012-08-16 |
2014-05-20 |
Triquint Semiconductor, Inc. |
Switching device with non-negative biasing
|
US9590674B2
(en)
|
2012-12-14 |
2017-03-07 |
Peregrine Semiconductor Corporation |
Semiconductor devices with switchable ground-body connection
|
US8847672B2
(en)
|
2013-01-15 |
2014-09-30 |
Triquint Semiconductor, Inc. |
Switching device with resistive divider
|
US9214932B2
(en)
|
2013-02-11 |
2015-12-15 |
Triquint Semiconductor, Inc. |
Body-biased switching device
|
US8977217B1
(en)
|
2013-02-20 |
2015-03-10 |
Triquint Semiconductor, Inc. |
Switching device with negative bias circuit
|
US8923782B1
(en)
|
2013-02-20 |
2014-12-30 |
Triquint Semiconductor, Inc. |
Switching device with diode-biased field-effect transistor (FET)
|
US9203396B1
(en)
|
2013-02-22 |
2015-12-01 |
Triquint Semiconductor, Inc. |
Radio frequency switch device with source-follower
|
US20150236748A1
(en)
|
2013-03-14 |
2015-08-20 |
Peregrine Semiconductor Corporation |
Devices and Methods for Duplexer Loss Reduction
|
US9406695B2
(en)
|
2013-11-20 |
2016-08-02 |
Peregrine Semiconductor Corporation |
Circuit and method for improving ESD tolerance and switching speed
|
US9379698B2
(en)
|
2014-02-04 |
2016-06-28 |
Triquint Semiconductor, Inc. |
Field effect transistor switching circuit
|
US9515181B2
(en)
|
2014-08-06 |
2016-12-06 |
Qualcomm Incorporated |
Semiconductor device with self-aligned back side features
|
CN105448734A
(zh)
*
|
2014-09-02 |
2016-03-30 |
无锡华润上华半导体有限公司 |
一种改善器件双峰效应的方法和半导体器件
|
US9831857B2
(en)
|
2015-03-11 |
2017-11-28 |
Peregrine Semiconductor Corporation |
Power splitter with programmable output phase shift
|
US9948281B2
(en)
|
2016-09-02 |
2018-04-17 |
Peregrine Semiconductor Corporation |
Positive logic digitally tunable capacitor
|
US10236872B1
(en)
|
2018-03-28 |
2019-03-19 |
Psemi Corporation |
AC coupling modules for bias ladders
|
US10886911B2
(en)
|
2018-03-28 |
2021-01-05 |
Psemi Corporation |
Stacked FET switch bias ladders
|
US10505530B2
(en)
|
2018-03-28 |
2019-12-10 |
Psemi Corporation |
Positive logic switch with selectable DC blocking circuit
|
US11476849B2
(en)
|
2020-01-06 |
2022-10-18 |
Psemi Corporation |
High power positive logic switch
|