JPS5231673A - Resin sealing method of semiconductor device - Google Patents

Resin sealing method of semiconductor device

Info

Publication number
JPS5231673A
JPS5231673A JP10828175A JP10828175A JPS5231673A JP S5231673 A JPS5231673 A JP S5231673A JP 10828175 A JP10828175 A JP 10828175A JP 10828175 A JP10828175 A JP 10828175A JP S5231673 A JPS5231673 A JP S5231673A
Authority
JP
Japan
Prior art keywords
resin sealing
semiconductor device
sealing method
dimensions
performance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10828175A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5544453B2 (OSRAM
Inventor
Masao Hayakawa
Takamichi Maeda
Masao Kumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP10828175A priority Critical patent/JPS5231673A/ja
Publication of JPS5231673A publication Critical patent/JPS5231673A/ja
Publication of JPS5544453B2 publication Critical patent/JPS5544453B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP10828175A 1975-09-04 1975-09-04 Resin sealing method of semiconductor device Granted JPS5231673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10828175A JPS5231673A (en) 1975-09-04 1975-09-04 Resin sealing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10828175A JPS5231673A (en) 1975-09-04 1975-09-04 Resin sealing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5231673A true JPS5231673A (en) 1977-03-10
JPS5544453B2 JPS5544453B2 (OSRAM) 1980-11-12

Family

ID=14480658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10828175A Granted JPS5231673A (en) 1975-09-04 1975-09-04 Resin sealing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5231673A (OSRAM)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53141578A (en) * 1977-05-16 1978-12-09 Fuji Electric Co Ltd Glass-slurry applying device
JPH0378234A (ja) * 1989-08-21 1991-04-03 Rohm Co Ltd 半導体装置の製造方法
US5042145A (en) * 1988-09-27 1991-08-27 Alcatel N.V. Method for mounting an electronic component and memory card using same
US5120678A (en) * 1990-11-05 1992-06-09 Motorola Inc. Electrical component package comprising polymer-reinforced solder bump interconnection
US5508888A (en) * 1994-05-09 1996-04-16 At&T Global Information Solutions Company Electronic component lead protector

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53141578A (en) * 1977-05-16 1978-12-09 Fuji Electric Co Ltd Glass-slurry applying device
US5042145A (en) * 1988-09-27 1991-08-27 Alcatel N.V. Method for mounting an electronic component and memory card using same
JPH0378234A (ja) * 1989-08-21 1991-04-03 Rohm Co Ltd 半導体装置の製造方法
US5120678A (en) * 1990-11-05 1992-06-09 Motorola Inc. Electrical component package comprising polymer-reinforced solder bump interconnection
US5508888A (en) * 1994-05-09 1996-04-16 At&T Global Information Solutions Company Electronic component lead protector

Also Published As

Publication number Publication date
JPS5544453B2 (OSRAM) 1980-11-12

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