JPS5230382A - Semiconductor package device - Google Patents

Semiconductor package device

Info

Publication number
JPS5230382A
JPS5230382A JP10680275A JP10680275A JPS5230382A JP S5230382 A JPS5230382 A JP S5230382A JP 10680275 A JP10680275 A JP 10680275A JP 10680275 A JP10680275 A JP 10680275A JP S5230382 A JPS5230382 A JP S5230382A
Authority
JP
Japan
Prior art keywords
semiconductor package
package device
printed circuit
board
mecanically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10680275A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5311814B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Akira Demura
Keiichi Yasuda
Yuji Higaki
Toshio Tanaka
Hirofumi Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Hitachi Ltd
NEC Corp
Nippon Telegraph and Telephone Corp
Oki Electric Industry Co Ltd
Original Assignee
Fujitsu Ltd
Hitachi Ltd
NEC Corp
Nippon Telegraph and Telephone Corp
Oki Electric Industry Co Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, Hitachi Ltd, NEC Corp, Nippon Telegraph and Telephone Corp, Oki Electric Industry Co Ltd, Nippon Electric Co Ltd filed Critical Fujitsu Ltd
Priority to JP10680275A priority Critical patent/JPS5230382A/ja
Publication of JPS5230382A publication Critical patent/JPS5230382A/ja
Publication of JPS5311814B2 publication Critical patent/JPS5311814B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP10680275A 1975-09-03 1975-09-03 Semiconductor package device Granted JPS5230382A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10680275A JPS5230382A (en) 1975-09-03 1975-09-03 Semiconductor package device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10680275A JPS5230382A (en) 1975-09-03 1975-09-03 Semiconductor package device

Publications (2)

Publication Number Publication Date
JPS5230382A true JPS5230382A (en) 1977-03-08
JPS5311814B2 JPS5311814B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1978-04-25

Family

ID=14442988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10680275A Granted JPS5230382A (en) 1975-09-03 1975-09-03 Semiconductor package device

Country Status (1)

Country Link
JP (1) JPS5230382A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4554575A (en) * 1983-05-12 1985-11-19 Westinghouse Electric Corp. Low stress leadless chip carrier and method of assembly
US4700276A (en) * 1986-01-03 1987-10-13 Motorola Inc. Ultra high density pad array chip carrier
US5475261A (en) * 1990-09-19 1995-12-12 Fujitsu Limited Semiconductor device having many lead pins

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4554575A (en) * 1983-05-12 1985-11-19 Westinghouse Electric Corp. Low stress leadless chip carrier and method of assembly
US4700276A (en) * 1986-01-03 1987-10-13 Motorola Inc. Ultra high density pad array chip carrier
US5475261A (en) * 1990-09-19 1995-12-12 Fujitsu Limited Semiconductor device having many lead pins

Also Published As

Publication number Publication date
JPS5311814B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1978-04-25

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