JPS5210675A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5210675A
JPS5210675A JP8683275A JP8683275A JPS5210675A JP S5210675 A JPS5210675 A JP S5210675A JP 8683275 A JP8683275 A JP 8683275A JP 8683275 A JP8683275 A JP 8683275A JP S5210675 A JPS5210675 A JP S5210675A
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor
percipheral
acquire
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8683275A
Other languages
Japanese (ja)
Inventor
Isamu Kitahiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8683275A priority Critical patent/JPS5210675A/en
Publication of JPS5210675A publication Critical patent/JPS5210675A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/1515Shape
    • H01L2924/15153Shape the die mounting substrate comprising a recess for hosting the device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/15165Monolayer substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]

Abstract

PURPOSE: To acquire a semiconductor without a short circuit defect by positioning the electrode terminal part on the semiconductor pellet so as to avoid contact with the percipheral part and the conductor for connection, etc.
COPYRIGHT: (C)1977,JPO&Japio
JP8683275A 1975-07-15 1975-07-15 Semiconductor device Pending JPS5210675A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8683275A JPS5210675A (en) 1975-07-15 1975-07-15 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8683275A JPS5210675A (en) 1975-07-15 1975-07-15 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5210675A true JPS5210675A (en) 1977-01-27

Family

ID=13897775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8683275A Pending JPS5210675A (en) 1975-07-15 1975-07-15 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5210675A (en)

Similar Documents

Publication Publication Date Title
JPS51115775A (en) Semiconductor apparatus
JPS529379A (en) Semiconductor device manufacturing process
JPS5210675A (en) Semiconductor device
JPS51132973A (en) Semiconductor device
JPS5212572A (en) Semi-conductor device
JPS5362471A (en) Semiconductor device
JPS5211872A (en) Semiconductor device
JPS5230382A (en) Semiconductor package device
JPS5360176A (en) Semiconductor device
JPS5211772A (en) Semiconductor device
JPS52149392A (en) Wire release device of without screw terminal
JPS5259829A (en) Central controller for electric devices
JPS51123065A (en) Semiconductor device
JPS5284966A (en) Semiconductor device
JPS51130894A (en) Electric lead use conductor device
JPS5216978A (en) Semiconductor
JPS5324785A (en) Semiconductor device
JPS5258370A (en) Semiconductor device
JPS52142484A (en) Production of semiconductor device
JPS5237767A (en) Semiconductor device
JPS51140479A (en) Semiconductor device
JPS51150283A (en) Semiconductor device
JPS51151089A (en) Manufacturing method of a semiconductor
JPS53108381A (en) Manufacture for semiconductor device
JPS5276877A (en) Semiconductor device