JPS5223269A - Method of manufacturing lead frame for semicnductors - Google Patents

Method of manufacturing lead frame for semicnductors

Info

Publication number
JPS5223269A
JPS5223269A JP9910275A JP9910275A JPS5223269A JP S5223269 A JPS5223269 A JP S5223269A JP 9910275 A JP9910275 A JP 9910275A JP 9910275 A JP9910275 A JP 9910275A JP S5223269 A JPS5223269 A JP S5223269A
Authority
JP
Japan
Prior art keywords
semicnductors
lead frame
manufacturing lead
manufacturing
theopening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9910275A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5436065B2 (zh
Inventor
Koji Suda
Shigemasa Nakazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP9910275A priority Critical patent/JPS5223269A/ja
Publication of JPS5223269A publication Critical patent/JPS5223269A/ja
Publication of JPS5436065B2 publication Critical patent/JPS5436065B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP9910275A 1975-08-15 1975-08-15 Method of manufacturing lead frame for semicnductors Granted JPS5223269A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9910275A JPS5223269A (en) 1975-08-15 1975-08-15 Method of manufacturing lead frame for semicnductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9910275A JPS5223269A (en) 1975-08-15 1975-08-15 Method of manufacturing lead frame for semicnductors

Publications (2)

Publication Number Publication Date
JPS5223269A true JPS5223269A (en) 1977-02-22
JPS5436065B2 JPS5436065B2 (zh) 1979-11-07

Family

ID=14238474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9910275A Granted JPS5223269A (en) 1975-08-15 1975-08-15 Method of manufacturing lead frame for semicnductors

Country Status (1)

Country Link
JP (1) JPS5223269A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6113950U (ja) * 1984-06-29 1986-01-27 大日本印刷株式会社 金属部分被覆を施した半導体リ−ドフレ−ム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5029140A (zh) * 1973-07-18 1975-03-25
JPS5199635A (ja) * 1975-02-28 1976-09-02 Nippon Electric Co Bubunmetsukyomasukingujigu

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5029140A (zh) * 1973-07-18 1975-03-25
JPS5199635A (ja) * 1975-02-28 1976-09-02 Nippon Electric Co Bubunmetsukyomasukingujigu

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6113950U (ja) * 1984-06-29 1986-01-27 大日本印刷株式会社 金属部分被覆を施した半導体リ−ドフレ−ム

Also Published As

Publication number Publication date
JPS5436065B2 (zh) 1979-11-07

Similar Documents

Publication Publication Date Title
JPS5375828A (en) Semiconductor circuit
JPS5223269A (en) Method of manufacturing lead frame for semicnductors
JPS53109477A (en) Mounting method of semiconductor element
JPS5210032A (en) Construction method of semiconductor memory unit
JPS523387A (en) Manufacturing method of semiconductor device
JPS53106572A (en) Lead frame for semiconductor device
JPS5294073A (en) Leading-in frame and process for preparing it
JPS51138166A (en) Production method of semiconductor device
JPS5247675A (en) Process for production of semiconductor device
JPS5223281A (en) Method of manufacturing semiconductor device
JPS5285470A (en) Lead frame fixing jig for wire bonding
JPS51111065A (en) Lead frame
JPS5219071A (en) Production method of semiconductor device
JPS5379461A (en) Semiconductor device and its manufacturing process
JPS5314563A (en) Fixing method of semiconductor pellet to lead frame
JPS5348678A (en) Integrated circuit package
JPS51118383A (en) Manufacturing process for mos type semiconductor unit
JPS5311577A (en) Soldering method for wafers of semiconductor devices
JPS51118369A (en) Manufacturing process for simiconduator unit
JPS528636A (en) Method for mounting the upper and lower frames of sliding door
JPS52103983A (en) Semiconductor integrated circuit
JPS5232530A (en) Connecting process of lead wire for electric equipment
JPS51122375A (en) Semiconductor device
JPS53132267A (en) Hermetic sealing method of semiconductor element
JPS51132777A (en) Inspect on method of semiconductor apparatus