JPS5223269A - Method of manufacturing lead frame for semicnductors - Google Patents
Method of manufacturing lead frame for semicnductorsInfo
- Publication number
- JPS5223269A JPS5223269A JP9910275A JP9910275A JPS5223269A JP S5223269 A JPS5223269 A JP S5223269A JP 9910275 A JP9910275 A JP 9910275A JP 9910275 A JP9910275 A JP 9910275A JP S5223269 A JPS5223269 A JP S5223269A
- Authority
- JP
- Japan
- Prior art keywords
- semicnductors
- lead frame
- manufacturing lead
- manufacturing
- theopening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000002184 metal Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9910275A JPS5223269A (en) | 1975-08-15 | 1975-08-15 | Method of manufacturing lead frame for semicnductors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9910275A JPS5223269A (en) | 1975-08-15 | 1975-08-15 | Method of manufacturing lead frame for semicnductors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5223269A true JPS5223269A (en) | 1977-02-22 |
| JPS5436065B2 JPS5436065B2 (enrdf_load_stackoverflow) | 1979-11-07 |
Family
ID=14238474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9910275A Granted JPS5223269A (en) | 1975-08-15 | 1975-08-15 | Method of manufacturing lead frame for semicnductors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5223269A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6113950U (ja) * | 1984-06-29 | 1986-01-27 | 大日本印刷株式会社 | 金属部分被覆を施した半導体リ−ドフレ−ム |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5029140A (enrdf_load_stackoverflow) * | 1973-07-18 | 1975-03-25 | ||
| JPS5199635A (ja) * | 1975-02-28 | 1976-09-02 | Nippon Electric Co | Bubunmetsukyomasukingujigu |
-
1975
- 1975-08-15 JP JP9910275A patent/JPS5223269A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5029140A (enrdf_load_stackoverflow) * | 1973-07-18 | 1975-03-25 | ||
| JPS5199635A (ja) * | 1975-02-28 | 1976-09-02 | Nippon Electric Co | Bubunmetsukyomasukingujigu |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6113950U (ja) * | 1984-06-29 | 1986-01-27 | 大日本印刷株式会社 | 金属部分被覆を施した半導体リ−ドフレ−ム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5436065B2 (enrdf_load_stackoverflow) | 1979-11-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5375828A (en) | Semiconductor circuit | |
| JPS5223269A (en) | Method of manufacturing lead frame for semicnductors | |
| JPS53109477A (en) | Mounting method of semiconductor element | |
| JPS523387A (en) | Manufacturing method of semiconductor device | |
| JPS52139383A (en) | Testing method for semiconductor device | |
| JPS53106572A (en) | Lead frame for semiconductor device | |
| JPS5427772A (en) | Production of semiconductor devices | |
| JPS5419652A (en) | Lead bonding method | |
| JPS5245274A (en) | Method for inspection before perfection of transistor | |
| JPS5294073A (en) | Leading-in frame and process for preparing it | |
| JPS5314563A (en) | Fixing method of semiconductor pellet to lead frame | |
| JPS51138166A (en) | Production method of semiconductor device | |
| JPS5247675A (en) | Process for production of semiconductor device | |
| JPS5285470A (en) | Lead frame fixing jig for wire bonding | |
| JPS51111065A (en) | Lead frame | |
| JPS5348678A (en) | Integrated circuit package | |
| JPS51118383A (en) | Manufacturing process for mos type semiconductor unit | |
| JPS5311577A (en) | Soldering method for wafers of semiconductor devices | |
| JPS51118369A (en) | Manufacturing process for simiconduator unit | |
| JPS528636A (en) | Method for mounting the upper and lower frames of sliding door | |
| JPS52103983A (en) | Semiconductor integrated circuit | |
| JPS53144671A (en) | Production of semiconductor device | |
| JPS5232530A (en) | Connecting process of lead wire for electric equipment | |
| JPS51122375A (en) | Semiconductor device | |
| JPS5379461A (en) | Semiconductor device and its manufacturing process |