JPS522282A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS522282A
JPS522282A JP50076714A JP7671475A JPS522282A JP S522282 A JPS522282 A JP S522282A JP 50076714 A JP50076714 A JP 50076714A JP 7671475 A JP7671475 A JP 7671475A JP S522282 A JPS522282 A JP S522282A
Authority
JP
Japan
Prior art keywords
semiconductor device
pellet
wires
lead
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50076714A
Other languages
English (en)
Inventor
Takeo Sato
Osamu Ito
Yuji Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50076714A priority Critical patent/JPS522282A/ja
Publication of JPS522282A publication Critical patent/JPS522282A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP50076714A 1975-06-24 1975-06-24 Semiconductor device Pending JPS522282A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50076714A JPS522282A (en) 1975-06-24 1975-06-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50076714A JPS522282A (en) 1975-06-24 1975-06-24 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS522282A true JPS522282A (en) 1977-01-08

Family

ID=13613207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50076714A Pending JPS522282A (en) 1975-06-24 1975-06-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS522282A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5966157A (ja) * 1982-10-08 1984-04-14 Fujitsu Ltd 半導体装置及びその製造方法
JPS62277759A (ja) * 1986-05-27 1987-12-02 Matsushita Electric Ind Co Ltd クリツプ端子
US5319242A (en) * 1992-03-18 1994-06-07 Motorola, Inc. Semiconductor package having an exposed die surface
JP2000353772A (ja) * 1999-06-11 2000-12-19 Matsushita Electric Ind Co Ltd 熱伝導樹脂組成物構造体及びその製造方法、並びに、それを用いた熱伝導基板及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5966157A (ja) * 1982-10-08 1984-04-14 Fujitsu Ltd 半導体装置及びその製造方法
JPS62277759A (ja) * 1986-05-27 1987-12-02 Matsushita Electric Ind Co Ltd クリツプ端子
US5319242A (en) * 1992-03-18 1994-06-07 Motorola, Inc. Semiconductor package having an exposed die surface
JP2000353772A (ja) * 1999-06-11 2000-12-19 Matsushita Electric Ind Co Ltd 熱伝導樹脂組成物構造体及びその製造方法、並びに、それを用いた熱伝導基板及びその製造方法

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