JPS522281A - Method of making semiconductor devices - Google Patents
Method of making semiconductor devicesInfo
- Publication number
- JPS522281A JPS522281A JP50076713A JP7671375A JPS522281A JP S522281 A JPS522281 A JP S522281A JP 50076713 A JP50076713 A JP 50076713A JP 7671375 A JP7671375 A JP 7671375A JP S522281 A JPS522281 A JP S522281A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor devices
- making semiconductor
- header
- chassis
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50076713A JPS522281A (en) | 1975-06-24 | 1975-06-24 | Method of making semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50076713A JPS522281A (en) | 1975-06-24 | 1975-06-24 | Method of making semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS522281A true JPS522281A (en) | 1977-01-08 |
Family
ID=13613174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50076713A Pending JPS522281A (en) | 1975-06-24 | 1975-06-24 | Method of making semiconductor devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS522281A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5966157A (ja) * | 1982-10-08 | 1984-04-14 | Fujitsu Ltd | 半導体装置及びその製造方法 |
US5596231A (en) * | 1991-08-05 | 1997-01-21 | Asat, Limited | High power dissipation plastic encapsulated package for integrated circuit die |
US5687474A (en) * | 1992-04-30 | 1997-11-18 | Vlsi Technology, Inc. | Method of assembling and cooling a package structure with accessible chip |
-
1975
- 1975-06-24 JP JP50076713A patent/JPS522281A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5966157A (ja) * | 1982-10-08 | 1984-04-14 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JPH041503B2 (ja) * | 1982-10-08 | 1992-01-13 | Fujitsu Ltd | |
US5596231A (en) * | 1991-08-05 | 1997-01-21 | Asat, Limited | High power dissipation plastic encapsulated package for integrated circuit die |
US5687474A (en) * | 1992-04-30 | 1997-11-18 | Vlsi Technology, Inc. | Method of assembling and cooling a package structure with accessible chip |
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