JPS522167A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPS522167A
JPS522167A JP50076560A JP7656075A JPS522167A JP S522167 A JPS522167 A JP S522167A JP 50076560 A JP50076560 A JP 50076560A JP 7656075 A JP7656075 A JP 7656075A JP S522167 A JPS522167 A JP S522167A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding method
wire
improper
shortcircuiting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50076560A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5426469B2 (enExample
Inventor
Naoji Okubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50076560A priority Critical patent/JPS522167A/ja
Publication of JPS522167A publication Critical patent/JPS522167A/ja
Publication of JPS5426469B2 publication Critical patent/JPS5426469B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP50076560A 1975-06-24 1975-06-24 Wire bonding method Granted JPS522167A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50076560A JPS522167A (en) 1975-06-24 1975-06-24 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50076560A JPS522167A (en) 1975-06-24 1975-06-24 Wire bonding method

Publications (2)

Publication Number Publication Date
JPS522167A true JPS522167A (en) 1977-01-08
JPS5426469B2 JPS5426469B2 (enExample) 1979-09-04

Family

ID=13608619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50076560A Granted JPS522167A (en) 1975-06-24 1975-06-24 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS522167A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62105207A (ja) * 1985-10-31 1987-05-15 Sanyo Electric Co Ltd 移動ロボツトの誘導装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62105207A (ja) * 1985-10-31 1987-05-15 Sanyo Electric Co Ltd 移動ロボツトの誘導装置

Also Published As

Publication number Publication date
JPS5426469B2 (enExample) 1979-09-04

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