|
US3851221A
(en)
*
|
1972-11-30 |
1974-11-26 |
P Beaulieu |
Integrated circuit package
|
|
JPS5061350U
(en:Method)
*
|
1973-10-01 |
1975-06-05 |
|
|
|
JPS5241149B2
(en:Method)
*
|
1974-03-16 |
1977-10-17 |
|
|
|
JPS5241193B2
(en:Method)
*
|
1974-03-16 |
1977-10-17 |
|
|
|
US3999105A
(en)
*
|
1974-04-19 |
1976-12-21 |
International Business Machines Corporation |
Liquid encapsulated integrated circuit package
|
|
US4000509A
(en)
*
|
1975-03-31 |
1976-12-28 |
International Business Machines Corporation |
High density air cooled wafer package having improved thermal dissipation
|
|
US4050507A
(en)
*
|
1975-06-27 |
1977-09-27 |
International Business Machines Corporation |
Method for customizing nucleate boiling heat transfer from electronic units immersed in dielectric coolant
|
|
US3993123A
(en)
*
|
1975-10-28 |
1976-11-23 |
International Business Machines Corporation |
Gas encapsulated cooling module
|
|
JPS5325949A
(en)
*
|
1976-08-24 |
1978-03-10 |
Mitsubishi Electric Corp |
Boiling coolant
|
|
US4034469A
(en)
*
|
1976-09-03 |
1977-07-12 |
Ibm Corporation |
Method of making conduction-cooled circuit package
|
|
US4034468A
(en)
*
|
1976-09-03 |
1977-07-12 |
Ibm Corporation |
Method for making conduction-cooled circuit package
|
|
US4103737A
(en)
*
|
1976-12-16 |
1978-08-01 |
Marantz Company, Inc. |
Heat exchanger structure for electronic apparatus
|
|
JPS5811101B2
(ja)
*
|
1977-11-25 |
1983-03-01 |
インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション |
半導体の表面処理方法
|
|
US4312012A
(en)
*
|
1977-11-25 |
1982-01-19 |
International Business Machines Corp. |
Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant
|
|
JPS5936827B2
(ja)
*
|
1979-01-12 |
1984-09-06 |
日本電信電話株式会社 |
集積回路素子の冷却装置
|
|
JPS5923470B2
(ja)
*
|
1979-02-01 |
1984-06-02 |
パイオニア株式会社 |
自然対流型放熱器
|
|
JPS55118561A
(en)
*
|
1979-03-05 |
1980-09-11 |
Hitachi Ltd |
Constant pressure type boiling cooler
|
|
JPS5612359U
(en:Method)
*
|
1979-07-10 |
1981-02-02 |
|
|
|
US4263965A
(en)
*
|
1980-01-21 |
1981-04-28 |
International Business Machines Corporation |
Leaved thermal cooling module
|
|
US4449578A
(en)
*
|
1980-06-16 |
1984-05-22 |
Showa Aluminum Corporation |
Device for releasing heat
|
|
JPS5715451A
(en)
*
|
1980-07-01 |
1982-01-26 |
Nec Corp |
Construction of cooling large ic circuit package
|
|
DE3044314C2
(de)
*
|
1980-11-25 |
1986-08-14 |
kabelmetal electro GmbH, 3000 Hannover |
Gehäuse zur Aufnahme von mit Wärme erzeugenden elektronischen Bauteilen bestückten gedruckten Schaltungen
|
|
US4590538A
(en)
*
|
1982-11-18 |
1986-05-20 |
Cray Research, Inc. |
Immersion cooled high density electronic assembly
|
|
DE3325942A1
(de)
*
|
1983-07-19 |
1985-01-31 |
Teldix Gmbh, 6900 Heidelberg |
Waermerohr zur temperaturerniedrigung in thermisch belasteten bereichen
|
|
FR2574615B1
(fr)
*
|
1984-12-11 |
1987-01-16 |
Silicium Semiconducteur Ssc |
Boitier pour composant de puissance haute-frequence refroidi par circulation d'eau
|
|
US4833567A
(en)
*
|
1986-05-30 |
1989-05-23 |
Digital Equipment Corporation |
Integral heat pipe module
|
|
US4790373A
(en)
*
|
1986-08-01 |
1988-12-13 |
Hughes Tool Company |
Cooling system for electrical components
|
|
US4805691A
(en)
*
|
1986-12-22 |
1989-02-21 |
Sundstrand Corporation |
Cooling technique for compact electronics inverter
|
|
EP0298372B1
(en)
*
|
1987-07-10 |
1993-01-13 |
Hitachi, Ltd. |
Semiconductor cooling apparatus
|
|
EP0328561A4
(en)
*
|
1987-08-19 |
1990-02-22 |
Sundstrand Corp |
HEAT EXCHANGER FOR ELECTRICAL COMPONENTS.
|
|
CA1306795C
(en)
*
|
1987-09-25 |
1992-08-25 |
Minnesota Mining And Manufacturing Company |
Thermal transfer bag
|
|
US4834257A
(en)
*
|
1987-12-11 |
1989-05-30 |
Westinghouse Electric Corp. |
Reinforced wall structure for a transformer tank
|
|
US4847731A
(en)
*
|
1988-07-05 |
1989-07-11 |
The United States Of America As Represented By The Secretary Of The Navy |
Liquid cooled high density packaging for high speed circuits
|
|
US5119021A
(en)
*
|
1989-07-13 |
1992-06-02 |
Thermal Management, Inc. |
Method and apparatus for maintaining electrically operating device temperatures
|
|
US5004973A
(en)
*
|
1989-07-13 |
1991-04-02 |
Thermal Management, Inc. |
Method and apparatus for maintaining electrically operating device temperatures
|
|
US5166775A
(en)
*
|
1990-01-16 |
1992-11-24 |
Cray Research, Inc. |
Air manifold for cooling electronic devices
|
|
US5014904A
(en)
*
|
1990-01-16 |
1991-05-14 |
Cray Research, Inc. |
Board-mounted thermal path connector and cold plate
|
|
US5083194A
(en)
*
|
1990-01-16 |
1992-01-21 |
Cray Research, Inc. |
Air jet impingement on miniature pin-fin heat sinks for cooling electronic components
|
|
EP0456508A3
(en)
*
|
1990-05-11 |
1993-01-20 |
Fujitsu Limited |
Immersion cooling coolant and electronic device using this coolant
|
|
US5321581A
(en)
*
|
1992-03-20 |
1994-06-14 |
Cray Research, Inc. |
Air distribution system and manifold for cooling electronic components
|
|
US5230564A
(en)
*
|
1992-03-20 |
1993-07-27 |
Cray Research, Inc. |
Temperature monitoring system for air-cooled electric components
|
|
US5305184A
(en)
*
|
1992-12-16 |
1994-04-19 |
Ibm Corporation |
Method and apparatus for immersion cooling or an electronic board
|
|
US5339214A
(en)
*
|
1993-02-12 |
1994-08-16 |
Intel Corporation |
Multiple-fan microprocessor cooling through a finned heat pipe
|
|
FR2701625B1
(fr)
*
|
1993-02-15 |
1995-05-24 |
Advanced Computer |
Assemblage de cartes d'un système informatique rapide.
|
|
US5704416A
(en)
*
|
1993-09-10 |
1998-01-06 |
Aavid Laboratories, Inc. |
Two phase component cooler
|
|
US5458189A
(en)
*
|
1993-09-10 |
1995-10-17 |
Aavid Laboratories |
Two-phase component cooler
|
|
US5485671A
(en)
*
|
1993-09-10 |
1996-01-23 |
Aavid Laboratories, Inc. |
Method of making a two-phase thermal bag component cooler
|
|
US5411077A
(en)
*
|
1994-04-11 |
1995-05-02 |
Minnesota Mining And Manufacturing Company |
Flexible thermal transfer apparatus for cooling electronic components
|
|
JP3525498B2
(ja)
*
|
1994-07-13 |
2004-05-10 |
株式会社デンソー |
沸騰冷却装置
|
|
US5513070A
(en)
*
|
1994-12-16 |
1996-04-30 |
Intel Corporation |
Dissipation of heat through keyboard using a heat pipe
|
|
US5587880A
(en)
*
|
1995-06-28 |
1996-12-24 |
Aavid Laboratories, Inc. |
Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation
|
|
USD387333S
(en)
*
|
1995-09-25 |
1997-12-09 |
Curtis Instruments, Inc. |
Heatsink enclosure for an electrical controller
|
|
DE19545447C2
(de)
*
|
1995-12-06 |
2001-12-13 |
Daimler Chrysler Ag |
Bremswiderstand-Kühleinrichtung
|
|
US6019167A
(en)
*
|
1997-12-19 |
2000-02-01 |
Nortel Networks Corporation |
Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments
|
|
US6377591B1
(en)
*
|
1998-12-09 |
2002-04-23 |
Mcdonnell Douglas Corporation |
Modularized fiber optic laser system and associated optical amplification modules
|
|
US6208511B1
(en)
*
|
1998-12-31 |
2001-03-27 |
Lucent Technologies, Inc. |
Arrangement for enclosing a fluid and method of manufacturing a fluid retaining enclosure
|
|
US6130818A
(en)
*
|
1999-05-27 |
2000-10-10 |
Hamilton Sundstrand Corporation |
Electronic assembly with fault tolerant cooling
|
|
US6222264B1
(en)
|
1999-10-15 |
2001-04-24 |
Dell Usa, L.P. |
Cooling apparatus for an electronic package
|
|
US6515859B2
(en)
*
|
2000-07-11 |
2003-02-04 |
Peavey Electronics Corporation |
Heat sink alignment
|
|
US6336497B1
(en)
*
|
2000-11-24 |
2002-01-08 |
Ching-Bin Lin |
Self-recirculated heat dissipating means for cooling central processing unit
|
|
FR2827115B1
(fr)
*
|
2001-07-06 |
2003-09-05 |
Alstom |
Coffre pour convertisseur de puissance
|
|
US6744136B2
(en)
|
2001-10-29 |
2004-06-01 |
International Rectifier Corporation |
Sealed liquid cooled electronic device
|
|
DE10156085A1
(de)
*
|
2001-11-16 |
2003-05-28 |
Sig Cantec Gmbh & Co Kg |
Vorrichtung und Verfahren zum Aufweiten und Formen von Dosenrümpfen
|
|
US6695039B1
(en)
|
2003-02-25 |
2004-02-24 |
Delphi Technologies, Inc. |
Orientation insensitive thermosiphon assembly for cooling electronic components
|
|
US20050039888A1
(en)
*
|
2003-08-21 |
2005-02-24 |
Pfahnl Andreas C. |
Two-phase cooling apparatus and method for automatic test equipment
|
|
JP4394946B2
(ja)
*
|
2003-12-24 |
2010-01-06 |
本田技研工業株式会社 |
燃料電池車
|
|
JP4573525B2
(ja)
*
|
2003-12-24 |
2010-11-04 |
本田技研工業株式会社 |
固体高分子電解質型燃料電池
|
|
US7581585B2
(en)
*
|
2004-10-29 |
2009-09-01 |
3M Innovative Properties Company |
Variable position cooling apparatus
|
|
US20060090881A1
(en)
*
|
2004-10-29 |
2006-05-04 |
3M Innovative Properties Company |
Immersion cooling apparatus
|
|
DE102004059180B4
(de)
*
|
2004-12-08 |
2008-08-21 |
Siemens Ag |
Widerstand mit Kühlung und Verwendung des Widerstands und Verfahren zur Widerstandskühlung
|
|
US20060162899A1
(en)
*
|
2005-01-26 |
2006-07-27 |
Huang Wei C |
Structure of liquid cooled waterblock with thermal conductivities
|
|
US20070034360A1
(en)
*
|
2005-06-08 |
2007-02-15 |
Hall Jack P |
High performance cooling assembly for electronics
|
|
USD537777S1
(en)
*
|
2005-10-11 |
2007-03-06 |
Ip Holdings Llc |
Housing extrusion for remote ballast
|
|
RU2372757C2
(ru)
*
|
2006-02-13 |
2009-11-10 |
Государственное Образовательное Учреждение Высшего Профессионального Образования "Дагестанский Государственный Технический Университет" (Дгту) |
Герметичный радиоэлектронный блок
|
|
US8240359B2
(en)
*
|
2006-04-17 |
2012-08-14 |
Gerald Garrett |
Liquid storage and cooling computer case
|
|
US20080017355A1
(en)
*
|
2006-05-16 |
2008-01-24 |
Hardcore Computer, Inc. |
Case for a liquid submersion cooled electronic device
|
|
TWI488562B
(zh)
*
|
2010-08-30 |
2015-06-11 |
Liquidcool Solutions Inc |
擠製伺服器殼體
|
|
US8619425B2
(en)
|
2011-10-26 |
2013-12-31 |
International Business Machines Corporation |
Multi-fluid, two-phase immersion-cooling of electronic component(s)
|
|
USD698074S1
(en)
|
2012-04-17 |
2014-01-21 |
Ip Holdings, Llc |
External ballast frame
|
|
US8953320B2
(en)
*
|
2012-09-13 |
2015-02-10 |
Levi A. Campbell |
Coolant drip facilitating partial immersion-cooling of electronic components
|
|
US9606587B2
(en)
*
|
2012-10-26 |
2017-03-28 |
Google Inc. |
Insulator module having structure enclosing atomspheric pressure gas
|
|
US9430006B1
(en)
|
2013-09-30 |
2016-08-30 |
Google Inc. |
Computing device with heat spreader
|
|
US8861191B1
(en)
|
2013-09-30 |
2014-10-14 |
Google Inc. |
Apparatus related to a structure of a base portion of a computing device
|
|
US9282678B2
(en)
|
2013-10-21 |
2016-03-08 |
International Business Machines Corporation |
Field-replaceable bank of immersion-cooled electronic components and separable heat sinks
|
|
US9332674B2
(en)
*
|
2013-10-21 |
2016-05-03 |
International Business Machines Corporation |
Field-replaceable bank of immersion-cooled electronic components
|
|
DE102014201483B4
(de)
*
|
2014-01-28 |
2016-04-07 |
Wago Verwaltungsgesellschaft Mbh |
Quaderförmiges Gehäuse für ein Elektronikmodul, Elektronikmodul und Anordnung zur Kühlung wenigstens eines Elektronikmoduls
|
|
SG10201809763VA
(en)
*
|
2014-05-02 |
2018-12-28 |
Nat Univ Singapore |
Device and method for a two phase heat transfer
|
|
US9442514B1
(en)
|
2014-07-23 |
2016-09-13 |
Google Inc. |
Graphite layer between carbon layers
|
|
USD761481S1
(en)
|
2014-08-26 |
2016-07-12 |
Ip Holdings, Llc |
Ballast housing
|
|
USD757344S1
(en)
|
2014-08-26 |
2016-05-24 |
Ip Holdings, Llc |
Ballast housing
|
|
USD780691S1
(en)
|
2015-05-20 |
2017-03-07 |
Ip Holdings, Llc |
Remote ballast
|
|
USD855238S1
(en)
|
2017-10-27 |
2019-07-30 |
Hgci, Inc. |
Ballast
|
|
USD871654S1
(en)
|
2017-10-30 |
2019-12-31 |
Hgci, Inc. |
Light fixture
|
|
TWI669479B
(zh)
*
|
2018-08-22 |
2019-08-21 |
威剛科技股份有限公司 |
具有散熱功能的儲存裝置及硬碟
|
|
US11178789B2
(en)
*
|
2020-03-31 |
2021-11-16 |
Advanced Energy Industries, Inc. |
Combination air-water cooling device
|
|
NL2025574B1
(en)
*
|
2020-05-13 |
2021-11-30 |
Microsoft Technology Licensing Llc |
Systems and methods for vapor management in immersion cooling
|
|
US12120847B1
(en)
|
2021-03-23 |
2024-10-15 |
Engendren LLC |
Container for one or more electronic devices and methods of use thereof
|