IT953761B - Sistema di raffreddamento in parti colare per componenti elettronici - Google Patents

Sistema di raffreddamento in parti colare per componenti elettronici

Info

Publication number
IT953761B
IT953761B IT23522/72A IT2352272A IT953761B IT 953761 B IT953761 B IT 953761B IT 23522/72 A IT23522/72 A IT 23522/72A IT 2352272 A IT2352272 A IT 2352272A IT 953761 B IT953761 B IT 953761B
Authority
IT
Italy
Prior art keywords
electronic components
cooling system
particular cooling
electronic
components
Prior art date
Application number
IT23522/72A
Other languages
English (en)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of IT953761B publication Critical patent/IT953761B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Rectifiers (AREA)
IT23522/72A 1971-06-30 1972-04-26 Sistema di raffreddamento in parti colare per componenti elettronici IT953761B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15831871A 1971-06-30 1971-06-30

Publications (1)

Publication Number Publication Date
IT953761B true IT953761B (it) 1973-08-10

Family

ID=22567570

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23522/72A IT953761B (it) 1971-06-30 1972-04-26 Sistema di raffreddamento in parti colare per componenti elettronici

Country Status (7)

Country Link
US (1) US3741292A (it)
JP (1) JPS5215358B1 (it)
CA (1) CA961149A (it)
DE (1) DE2231597C3 (it)
FR (1) FR2143733B1 (it)
GB (1) GB1319937A (it)
IT (1) IT953761B (it)

Families Citing this family (94)

* Cited by examiner, † Cited by third party
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US3999105A (en) * 1974-04-19 1976-12-21 International Business Machines Corporation Liquid encapsulated integrated circuit package
US4000509A (en) * 1975-03-31 1976-12-28 International Business Machines Corporation High density air cooled wafer package having improved thermal dissipation
US4050507A (en) * 1975-06-27 1977-09-27 International Business Machines Corporation Method for customizing nucleate boiling heat transfer from electronic units immersed in dielectric coolant
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
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US4034469A (en) * 1976-09-03 1977-07-12 Ibm Corporation Method of making conduction-cooled circuit package
US4034468A (en) * 1976-09-03 1977-07-12 Ibm Corporation Method for making conduction-cooled circuit package
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US4263965A (en) * 1980-01-21 1981-04-28 International Business Machines Corporation Leaved thermal cooling module
US4449578A (en) * 1980-06-16 1984-05-22 Showa Aluminum Corporation Device for releasing heat
JPS5715451A (en) * 1980-07-01 1982-01-26 Nec Corp Construction of cooling large ic circuit package
DE3044314C2 (de) * 1980-11-25 1986-08-14 kabelmetal electro GmbH, 3000 Hannover Gehäuse zur Aufnahme von mit Wärme erzeugenden elektronischen Bauteilen bestückten gedruckten Schaltungen
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DE3325942A1 (de) * 1983-07-19 1985-01-31 Teldix Gmbh, 6900 Heidelberg Waermerohr zur temperaturerniedrigung in thermisch belasteten bereichen
FR2574615B1 (fr) * 1984-12-11 1987-01-16 Silicium Semiconducteur Ssc Boitier pour composant de puissance haute-frequence refroidi par circulation d'eau
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EP0328561A4 (en) * 1987-08-19 1990-02-22 Sundstrand Corp HEAT EXCHANGER FOR ELECTRICAL COMPONENTS.
CA1306795C (en) * 1987-09-25 1992-08-25 Minnesota Mining And Manufacturing Company Thermal transfer bag
US4834257A (en) * 1987-12-11 1989-05-30 Westinghouse Electric Corp. Reinforced wall structure for a transformer tank
US4847731A (en) * 1988-07-05 1989-07-11 The United States Of America As Represented By The Secretary Of The Navy Liquid cooled high density packaging for high speed circuits
US5004973A (en) * 1989-07-13 1991-04-02 Thermal Management, Inc. Method and apparatus for maintaining electrically operating device temperatures
US5119021A (en) * 1989-07-13 1992-06-02 Thermal Management, Inc. Method and apparatus for maintaining electrically operating device temperatures
US5083194A (en) * 1990-01-16 1992-01-21 Cray Research, Inc. Air jet impingement on miniature pin-fin heat sinks for cooling electronic components
US5166775A (en) * 1990-01-16 1992-11-24 Cray Research, Inc. Air manifold for cooling electronic devices
US5014904A (en) * 1990-01-16 1991-05-14 Cray Research, Inc. Board-mounted thermal path connector and cold plate
EP0456508A3 (en) * 1990-05-11 1993-01-20 Fujitsu Limited Immersion cooling coolant and electronic device using this coolant
US5230564A (en) * 1992-03-20 1993-07-27 Cray Research, Inc. Temperature monitoring system for air-cooled electric components
US5321581A (en) * 1992-03-20 1994-06-14 Cray Research, Inc. Air distribution system and manifold for cooling electronic components
US5305184A (en) * 1992-12-16 1994-04-19 Ibm Corporation Method and apparatus for immersion cooling or an electronic board
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
FR2701625B1 (fr) * 1993-02-15 1995-05-24 Advanced Computer Assemblage de cartes d'un système informatique rapide.
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
US5458189A (en) * 1993-09-10 1995-10-17 Aavid Laboratories Two-phase component cooler
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
US5411077A (en) * 1994-04-11 1995-05-02 Minnesota Mining And Manufacturing Company Flexible thermal transfer apparatus for cooling electronic components
JP3525498B2 (ja) * 1994-07-13 2004-05-10 株式会社デンソー 沸騰冷却装置
US5513070A (en) * 1994-12-16 1996-04-30 Intel Corporation Dissipation of heat through keyboard using a heat pipe
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation
USD387333S (en) * 1995-09-25 1997-12-09 Curtis Instruments, Inc. Heatsink enclosure for an electrical controller
DE19545447C2 (de) * 1995-12-06 2001-12-13 Daimler Chrysler Ag Bremswiderstand-Kühleinrichtung
US6019167A (en) * 1997-12-19 2000-02-01 Nortel Networks Corporation Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments
US6377591B1 (en) * 1998-12-09 2002-04-23 Mcdonnell Douglas Corporation Modularized fiber optic laser system and associated optical amplification modules
US6208511B1 (en) * 1998-12-31 2001-03-27 Lucent Technologies, Inc. Arrangement for enclosing a fluid and method of manufacturing a fluid retaining enclosure
US6130818A (en) * 1999-05-27 2000-10-10 Hamilton Sundstrand Corporation Electronic assembly with fault tolerant cooling
US6222264B1 (en) 1999-10-15 2001-04-24 Dell Usa, L.P. Cooling apparatus for an electronic package
US6515859B2 (en) * 2000-07-11 2003-02-04 Peavey Electronics Corporation Heat sink alignment
US6336497B1 (en) * 2000-11-24 2002-01-08 Ching-Bin Lin Self-recirculated heat dissipating means for cooling central processing unit
FR2827115B1 (fr) * 2001-07-06 2003-09-05 Alstom Coffre pour convertisseur de puissance
US6744136B2 (en) 2001-10-29 2004-06-01 International Rectifier Corporation Sealed liquid cooled electronic device
DE10156085A1 (de) * 2001-11-16 2003-05-28 Sig Cantec Gmbh & Co Kg Vorrichtung und Verfahren zum Aufweiten und Formen von Dosenrümpfen
US6695039B1 (en) 2003-02-25 2004-02-24 Delphi Technologies, Inc. Orientation insensitive thermosiphon assembly for cooling electronic components
US20050039888A1 (en) * 2003-08-21 2005-02-24 Pfahnl Andreas C. Two-phase cooling apparatus and method for automatic test equipment
JP4573525B2 (ja) * 2003-12-24 2010-11-04 本田技研工業株式会社 固体高分子電解質型燃料電池
JP4394946B2 (ja) * 2003-12-24 2010-01-06 本田技研工業株式会社 燃料電池車
US7581585B2 (en) * 2004-10-29 2009-09-01 3M Innovative Properties Company Variable position cooling apparatus
US20060090881A1 (en) * 2004-10-29 2006-05-04 3M Innovative Properties Company Immersion cooling apparatus
DE102004059180B4 (de) * 2004-12-08 2008-08-21 Siemens Ag Widerstand mit Kühlung und Verwendung des Widerstands und Verfahren zur Widerstandskühlung
US20060162899A1 (en) * 2005-01-26 2006-07-27 Huang Wei C Structure of liquid cooled waterblock with thermal conductivities
US20070034360A1 (en) * 2005-06-08 2007-02-15 Hall Jack P High performance cooling assembly for electronics
US8240359B2 (en) * 2006-04-17 2012-08-14 Gerald Garrett Liquid storage and cooling computer case
US20080017355A1 (en) * 2006-05-16 2008-01-24 Hardcore Computer, Inc. Case for a liquid submersion cooled electronic device
JPWO2011145618A1 (ja) * 2010-05-19 2013-07-22 日本電気株式会社 沸騰冷却器
TWI488562B (zh) * 2010-08-30 2015-06-11 Liquidcool Solutions Inc 擠製伺服器殼體
JP2013007501A (ja) * 2011-06-22 2013-01-10 Nec Corp 冷却装置
US8619425B2 (en) 2011-10-26 2013-12-31 International Business Machines Corporation Multi-fluid, two-phase immersion-cooling of electronic component(s)
USD698074S1 (en) 2012-04-17 2014-01-21 Ip Holdings, Llc External ballast frame
US8953320B2 (en) * 2012-09-13 2015-02-10 Levi A. Campbell Coolant drip facilitating partial immersion-cooling of electronic components
US9606587B2 (en) * 2012-10-26 2017-03-28 Google Inc. Insulator module having structure enclosing atomspheric pressure gas
US9430006B1 (en) 2013-09-30 2016-08-30 Google Inc. Computing device with heat spreader
US8861191B1 (en) 2013-09-30 2014-10-14 Google Inc. Apparatus related to a structure of a base portion of a computing device
US9282678B2 (en) 2013-10-21 2016-03-08 International Business Machines Corporation Field-replaceable bank of immersion-cooled electronic components and separable heat sinks
US9332674B2 (en) * 2013-10-21 2016-05-03 International Business Machines Corporation Field-replaceable bank of immersion-cooled electronic components
DE102014201483B4 (de) * 2014-01-28 2016-04-07 Wago Verwaltungsgesellschaft Mbh Quaderförmiges Gehäuse für ein Elektronikmodul, Elektronikmodul und Anordnung zur Kühlung wenigstens eines Elektronikmoduls
US9442514B1 (en) 2014-07-23 2016-09-13 Google Inc. Graphite layer between carbon layers
USD761481S1 (en) 2014-08-26 2016-07-12 Ip Holdings, Llc Ballast housing
USD757344S1 (en) 2014-08-26 2016-05-24 Ip Holdings, Llc Ballast housing
USD780691S1 (en) 2015-05-20 2017-03-07 Ip Holdings, Llc Remote ballast
USD855238S1 (en) 2017-10-27 2019-07-30 Hgci, Inc. Ballast
USD871654S1 (en) 2017-10-30 2019-12-31 Hgci, Inc. Light fixture
TWI669479B (zh) * 2018-08-22 2019-08-21 威剛科技股份有限公司 具有散熱功能的儲存裝置及硬碟
US11178789B2 (en) * 2020-03-31 2021-11-16 Advanced Energy Industries, Inc. Combination air-water cooling device

Also Published As

Publication number Publication date
FR2143733B1 (it) 1974-07-26
DE2231597C3 (de) 1980-12-04
DE2231597A1 (de) 1973-01-18
JPS5215358B1 (it) 1977-04-28
CA961149A (en) 1975-01-14
DE2231597B2 (de) 1980-04-17
JPS4817275A (it) 1973-03-05
GB1319937A (en) 1973-06-13
US3741292A (en) 1973-06-26
FR2143733A1 (it) 1973-02-09

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