Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co LtdfiledCriticalNEC Corp
Priority to JP5341876ApriorityCriticalpatent/JPS52135674A/en
Publication of JPS52135674ApublicationCriticalpatent/JPS52135674A/en
PURPOSE: To increase heat radiation efficiency and facilitate disassembly for internal inspection as well by mounting heat sinks on both top and bottom surfaces and allowing heat to radiate from both sides.
COPYRIGHT: (C)1977,JPO&Japio
JP5341876A1976-05-101976-05-10Flat package type semiconductor device
PendingJPS52135674A
(en)