JPS52135669A - Production of semiconductor elements - Google Patents

Production of semiconductor elements

Info

Publication number
JPS52135669A
JPS52135669A JP5291876A JP5291876A JPS52135669A JP S52135669 A JPS52135669 A JP S52135669A JP 5291876 A JP5291876 A JP 5291876A JP 5291876 A JP5291876 A JP 5291876A JP S52135669 A JPS52135669 A JP S52135669A
Authority
JP
Japan
Prior art keywords
wafer
semiconductor elements
production
pelletizing
masking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5291876A
Other languages
English (en)
Other versions
JPS5723421B2 (ja
Inventor
Kazuo Nakada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP5291876A priority Critical patent/JPS52135669A/ja
Publication of JPS52135669A publication Critical patent/JPS52135669A/ja
Publication of JPS5723421B2 publication Critical patent/JPS5723421B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
JP5291876A 1976-05-10 1976-05-10 Production of semiconductor elements Granted JPS52135669A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5291876A JPS52135669A (en) 1976-05-10 1976-05-10 Production of semiconductor elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5291876A JPS52135669A (en) 1976-05-10 1976-05-10 Production of semiconductor elements

Publications (2)

Publication Number Publication Date
JPS52135669A true JPS52135669A (en) 1977-11-12
JPS5723421B2 JPS5723421B2 (ja) 1982-05-18

Family

ID=12928198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5291876A Granted JPS52135669A (en) 1976-05-10 1976-05-10 Production of semiconductor elements

Country Status (1)

Country Link
JP (1) JPS52135669A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61116229U (ja) * 1984-12-28 1986-07-22
JPS6290469U (ja) * 1985-11-28 1987-06-10

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5124869A (en) * 1974-08-23 1976-02-28 Mitsubishi Electric Corp Handotaisochino totsukidenkyokukeiseiho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5124869A (en) * 1974-08-23 1976-02-28 Mitsubishi Electric Corp Handotaisochino totsukidenkyokukeiseiho

Also Published As

Publication number Publication date
JPS5723421B2 (ja) 1982-05-18

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