JPS52134374A - Packaging method - Google Patents

Packaging method

Info

Publication number
JPS52134374A
JPS52134374A JP5152976A JP5152976A JPS52134374A JP S52134374 A JPS52134374 A JP S52134374A JP 5152976 A JP5152976 A JP 5152976A JP 5152976 A JP5152976 A JP 5152976A JP S52134374 A JPS52134374 A JP S52134374A
Authority
JP
Japan
Prior art keywords
packaging method
reliability
thin film
providing
increase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5152976A
Other languages
Japanese (ja)
Inventor
Yoshiharu Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP5152976A priority Critical patent/JPS52134374A/en
Publication of JPS52134374A publication Critical patent/JPS52134374A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To increase the reliability of connection by providing a packaging method having conductive thin film electrode patterns on a flexible tape buried with an element or a conductive elastic substance disposed at least one or wiring electrodes.
COPYRIGHT: (C)1977,JPO&Japio
JP5152976A 1976-05-06 1976-05-06 Packaging method Pending JPS52134374A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5152976A JPS52134374A (en) 1976-05-06 1976-05-06 Packaging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5152976A JPS52134374A (en) 1976-05-06 1976-05-06 Packaging method

Publications (1)

Publication Number Publication Date
JPS52134374A true JPS52134374A (en) 1977-11-10

Family

ID=12889534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5152976A Pending JPS52134374A (en) 1976-05-06 1976-05-06 Packaging method

Country Status (1)

Country Link
JP (1) JPS52134374A (en)

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