JPS52121687A - Copper clad laminates - Google Patents

Copper clad laminates

Info

Publication number
JPS52121687A
JPS52121687A JP15897676A JP15897676A JPS52121687A JP S52121687 A JPS52121687 A JP S52121687A JP 15897676 A JP15897676 A JP 15897676A JP 15897676 A JP15897676 A JP 15897676A JP S52121687 A JPS52121687 A JP S52121687A
Authority
JP
Japan
Prior art keywords
clad laminates
copper clad
copper
subjected
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15897676A
Other languages
English (en)
Japanese (ja)
Other versions
JPS578657B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Akira Ichinokura
Makoto Kosokabe
Masahiro Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP15897676A priority Critical patent/JPS52121687A/ja
Publication of JPS52121687A publication Critical patent/JPS52121687A/ja
Publication of JPS578657B2 publication Critical patent/JPS578657B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Laminated Bodies (AREA)
JP15897676A 1976-12-27 1976-12-27 Copper clad laminates Granted JPS52121687A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15897676A JPS52121687A (en) 1976-12-27 1976-12-27 Copper clad laminates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15897676A JPS52121687A (en) 1976-12-27 1976-12-27 Copper clad laminates

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP3599774A Division JPS5222792B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-03-30 1974-03-30

Publications (2)

Publication Number Publication Date
JPS52121687A true JPS52121687A (en) 1977-10-13
JPS578657B2 JPS578657B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1982-02-17

Family

ID=15683479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15897676A Granted JPS52121687A (en) 1976-12-27 1976-12-27 Copper clad laminates

Country Status (1)

Country Link
JP (1) JPS52121687A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62162532A (ja) * 1986-01-14 1987-07-18 松下電工株式会社 片面金属張積層板
JPS62221535A (ja) * 1986-03-24 1987-09-29 新神戸電機株式会社 片面金属箔張コンポジツト積層板
JPS6369640A (ja) * 1986-09-11 1988-03-29 東洋紡績株式会社 熱硬化性樹脂フイルム積層体
JPH01196339A (ja) * 1988-01-30 1989-08-08 Toshiba Chem Corp 銅張積層板の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140446A (ja) * 1986-12-03 1988-06-13 Csk Corp カ−ドリ−ダ−のカ−ド搬送機構

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62162532A (ja) * 1986-01-14 1987-07-18 松下電工株式会社 片面金属張積層板
JPS62221535A (ja) * 1986-03-24 1987-09-29 新神戸電機株式会社 片面金属箔張コンポジツト積層板
JPS6369640A (ja) * 1986-09-11 1988-03-29 東洋紡績株式会社 熱硬化性樹脂フイルム積層体
JPH01196339A (ja) * 1988-01-30 1989-08-08 Toshiba Chem Corp 銅張積層板の製造方法

Also Published As

Publication number Publication date
JPS578657B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1982-02-17

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