JPS5226586A - Copper-clad laminates - Google Patents

Copper-clad laminates

Info

Publication number
JPS5226586A
JPS5226586A JP10317575A JP10317575A JPS5226586A JP S5226586 A JPS5226586 A JP S5226586A JP 10317575 A JP10317575 A JP 10317575A JP 10317575 A JP10317575 A JP 10317575A JP S5226586 A JPS5226586 A JP S5226586A
Authority
JP
Japan
Prior art keywords
copper
clad laminates
impregnating
pressing
prepared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10317575A
Other languages
Japanese (ja)
Other versions
JPS587456B2 (en
Inventor
Shigeyoshi Nakamura
Hiromi Kasahara
Yutaka Nomi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP10317575A priority Critical patent/JPS587456B2/en
Publication of JPS5226586A publication Critical patent/JPS5226586A/en
Publication of JPS587456B2 publication Critical patent/JPS587456B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE: A copper-clad laminate with improved thermal resistance and peeling strength of the copper foil, prepared by impregnating a base with a specific compound and pressing it.
COPYRIGHT: (C)1977,JPO&Japio
JP10317575A 1975-08-26 1975-08-26 Douhari Sekisouban Expired JPS587456B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10317575A JPS587456B2 (en) 1975-08-26 1975-08-26 Douhari Sekisouban

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10317575A JPS587456B2 (en) 1975-08-26 1975-08-26 Douhari Sekisouban

Publications (2)

Publication Number Publication Date
JPS5226586A true JPS5226586A (en) 1977-02-28
JPS587456B2 JPS587456B2 (en) 1983-02-09

Family

ID=14347161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10317575A Expired JPS587456B2 (en) 1975-08-26 1975-08-26 Douhari Sekisouban

Country Status (1)

Country Link
JP (1) JPS587456B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109168248B (en) * 2018-09-13 2020-11-27 安徽建筑大学 Circuit board insulating heat-insulating coating

Also Published As

Publication number Publication date
JPS587456B2 (en) 1983-02-09

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