JPS5176079A - - Google Patents

Info

Publication number
JPS5176079A
JPS5176079A JP50107162A JP10716275A JPS5176079A JP S5176079 A JPS5176079 A JP S5176079A JP 50107162 A JP50107162 A JP 50107162A JP 10716275 A JP10716275 A JP 10716275A JP S5176079 A JPS5176079 A JP S5176079A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50107162A
Other languages
Japanese (ja)
Inventor
Peru Orofusen Orufu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHEMICAL REAKTOR EQUIP AS
KEMIKARU RIAKUTAA EKYUITSUPUMENTO AS
Original Assignee
CHEMICAL REAKTOR EQUIP AS
KEMIKARU RIAKUTAA EKYUITSUPUMENTO AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DK472874A external-priority patent/DK472874A/da
Priority claimed from DK603974A external-priority patent/DK603974A/da
Application filed by CHEMICAL REAKTOR EQUIP AS, KEMIKARU RIAKUTAA EKYUITSUPUMENTO AS filed Critical CHEMICAL REAKTOR EQUIP AS
Publication of JPS5176079A publication Critical patent/JPS5176079A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/6779—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks the workpieces being stored in a carrier, involving loading and unloading
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
JP50107162A 1974-09-06 1975-09-05 Pending JPS5176079A (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK472874A DK472874A (da) 1974-09-06 1974-09-06 Fremgangsmade og apparat til beroringsfri handtering af sarbare, hovedsageligt skiveformede objekter, navnlig tyndfilmbelagte halvledersubstrater
DK603974A DK603974A (da) 1974-11-20 1974-11-20 Kassette til opbevaring og transport af ensartede, hovedsageligt skiveformede objekter, navnlig tyndfilmbelagte halvledersubstrater

Publications (1)

Publication Number Publication Date
JPS5176079A true JPS5176079A (enExample) 1976-07-01

Family

ID=26067602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50107162A Pending JPS5176079A (enExample) 1974-09-06 1975-09-05

Country Status (5)

Country Link
US (1) US4002254A (enExample)
JP (1) JPS5176079A (enExample)
DE (1) DE2539036A1 (enExample)
GB (1) GB1513444A (enExample)
NL (1) NL7510568A (enExample)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK604074A (da) * 1974-11-20 1976-05-21 Chemical Reactor Equip As Apparat til beroringsfri transport af sarbare, hovedsageligt skiveformede objekter, navnlig tyndfilmbelagte halvledersubstrater
US4647266A (en) * 1979-12-21 1987-03-03 Varian Associates, Inc. Wafer coating system
FR2472446A1 (fr) * 1979-12-27 1981-07-03 Guy Mongodin Appareil pour le transfert de plaquettes minces disposees verticalement dans un panier rainure de rangement
US4578001A (en) * 1980-12-29 1986-03-25 Anchor Hocking Corporation Air conveying hopper
US4682928A (en) * 1982-05-24 1987-07-28 Proconics International, Inc. Wafer transfer apparatus
US4493606A (en) * 1982-05-24 1985-01-15 Proconics International, Inc. Wafer transfer apparatus
DE3219502C2 (de) * 1982-05-25 1990-04-19 Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar Vorrichtung zum automatischen Transport scheibenförmiger Objekte
US4474397A (en) * 1982-11-16 1984-10-02 International Business Machines Corporation Pick-up head utilizing aspirated air flow
US4603897A (en) * 1983-05-20 1986-08-05 Poconics International, Inc. Vacuum pickup apparatus
US4496180A (en) * 1983-07-20 1985-01-29 Cincinnati Milacron Industries, Inc. Vacuum handling apparatus
US4502721A (en) * 1984-01-30 1985-03-05 Bristol-Myers Company Gripping device
US5067762A (en) * 1985-06-18 1991-11-26 Hiroshi Akashi Non-contact conveying device
US4620738A (en) * 1985-08-19 1986-11-04 Varian Associates, Inc. Vacuum pick for semiconductor wafers
US4773687A (en) * 1987-05-22 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Wafer handler
US4984954A (en) * 1988-04-25 1991-01-15 Warenback Douglas H Spatula for wafer transport
US4867631A (en) * 1988-04-25 1989-09-19 Tegal Corporation Spatula for wafer transport
US4900214A (en) * 1988-05-25 1990-02-13 American Telephone And Telegraph Company Method and apparatus for transporting semiconductor wafers
FR2637214B1 (fr) * 1988-10-03 1990-12-21 Cogema Prehenseur pneumatique
EP0634787B1 (en) * 1993-07-15 1997-05-02 Applied Materials, Inc. Subsrate tray and ceramic blade for semiconductor processing apparatus
US5580112A (en) * 1995-05-10 1996-12-03 Taiwan Semiconductor Manufacturing Company Ltd. Vacuum pencil having a short tip with an abutment means
US6024393A (en) 1996-11-04 2000-02-15 Applied Materials, Inc. Robot blade for handling of semiconductor substrate
US6168697B1 (en) 1998-03-10 2001-01-02 Trusi Technologies Llc Holders suitable to hold articles during processing and article processing methods
US6095582A (en) * 1998-03-11 2000-08-01 Trusi Technologies, Llc Article holders and holding methods
US5967578A (en) * 1998-05-29 1999-10-19 Sez North America, Inc. Tool for the contact-free support of plate-like substrates
US6073828A (en) * 1998-06-30 2000-06-13 Lam Research Corporation End effector for substrate handling and method for making the same
US6315342B1 (en) * 1999-12-23 2001-11-13 Abb T&D Technology Ltd. Apparatus and method for feeding of parts with open internal geometries using pressurized gas
JP4391655B2 (ja) 2000-02-22 2009-12-24 インターナショナル・ビジネス・マシーンズ・コーポレーション エアピンセット
DE10062011B4 (de) * 2000-12-13 2005-02-24 Infineon Technologies Ag Halteeinrichtung
DE10247051A1 (de) * 2002-10-09 2004-04-22 Polymer Latex Gmbh & Co Kg Latex und Verfahren zu seiner Herstellung
US7100954B2 (en) * 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
US20070000527A1 (en) * 2005-06-30 2007-01-04 Aegerter Brian K Workpiece support for use in a process vessel and system for treating microelectronic workpieces
DE102004045957A1 (de) * 2004-09-22 2006-04-06 Singulus Technologies Ag Vorrichtung zum Halten und Transportieren eines Werkstücks mit einer ebenen Oberfläche
DE102009047086A1 (de) * 2009-11-24 2011-05-26 J. Schmalz Gmbh Druckluftbetriebener Greifer
CN104934504A (zh) * 2015-07-03 2015-09-23 陈�光 一种硅片倒片机构
CN107403749B (zh) * 2017-08-03 2023-04-25 宁波知了智能科技有限公司 直驱电机取晶装置
CN112810725B (zh) * 2021-02-04 2024-01-23 逸美德科技股份有限公司 移动单元用的定位承载机构和固定方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3516386A (en) * 1965-07-16 1970-06-23 Boeing Co Thin film deposition fixture
US3645581A (en) * 1968-11-26 1972-02-29 Ind Modular Systems Corp Apparatus and method for handling and treating articles
US3822025A (en) * 1973-03-16 1974-07-02 Gerber Scientific Instr Co Pressurized gas selector mechanism
US3902618A (en) * 1973-10-05 1975-09-02 West Co Primary nurser assembly

Also Published As

Publication number Publication date
DE2539036A1 (de) 1976-03-25
NL7510568A (nl) 1976-03-09
GB1513444A (en) 1978-06-07
US4002254A (en) 1977-01-11

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