JPS5149723U - - Google Patents

Info

Publication number
JPS5149723U
JPS5149723U JP1975075200U JP7520075U JPS5149723U JP S5149723 U JPS5149723 U JP S5149723U JP 1975075200 U JP1975075200 U JP 1975075200U JP 7520075 U JP7520075 U JP 7520075U JP S5149723 U JPS5149723 U JP S5149723U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1975075200U
Other languages
Japanese (ja)
Other versions
JPS5520747Y2 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5149723U publication Critical patent/JPS5149723U/ja
Application granted granted Critical
Publication of JPS5520747Y2 publication Critical patent/JPS5520747Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/86—Inert electrodes with catalytic activity, e.g. for fuel cells
    • H01M4/88—Processes of manufacture
    • H01M4/8825—Methods for deposition of the catalytic active composition
    • H01M4/8867—Vapour deposition
    • H01M4/8871—Sputtering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30—Hydrogen technology
    • Y02E60/50—Fuel cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
JP1975075200U 1970-07-10 1975-06-03 Expired JPS5520747Y2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7026730A FR2098563A5 (de) 1970-07-10 1970-07-10

Publications (2)

Publication Number Publication Date
JPS5149723U true JPS5149723U (de) 1976-04-15
JPS5520747Y2 JPS5520747Y2 (de) 1980-05-19

Family

ID=9058937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975075200U Expired JPS5520747Y2 (de) 1970-07-10 1975-06-03

Country Status (13)

Country Link
US (1) US3779885A (de)
JP (1) JPS5520747Y2 (de)
AT (1) AT304220B (de)
BE (1) BE769722A (de)
CA (2) CA994708A (de)
CH (1) CH538551A (de)
DE (1) DE2134377C3 (de)
ES (1) ES393087A1 (de)
FR (1) FR2098563A5 (de)
GB (1) GB1333617A (de)
NL (1) NL7109534A (de)
SE (1) SE366778B (de)
SU (1) SU405215A3 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021261484A1 (ja) * 2020-06-23 2021-12-30 三国電子有限会社 誘導結合プラズマによりスパッタリング成膜を行う成膜装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU5889880A (en) * 1979-07-02 1981-01-15 Olin Corporation Manufacture of low overvoltage electrodes by cathodic sputtering
DE3107914A1 (de) * 1981-03-02 1982-09-16 Leybold-Heraeus GmbH, 5000 Köln Verfahren und vorrichtung zum beschichten von formteilen durch katodenzerstaeubung
US4451344A (en) * 1982-03-26 1984-05-29 International Business Machines Corp. Method of making edge protected ferrite core
US4812217A (en) * 1987-04-27 1989-03-14 American Telephone And Telegraph Company, At&T Bell Laboratories Method and apparatus for feeding and coating articles in a controlled atmosphere
US5279724A (en) * 1991-12-26 1994-01-18 Xerox Corporation Dual sputtering source
US5322606A (en) * 1991-12-26 1994-06-21 Xerox Corporation Use of rotary solenoid as a shutter actuator on a rotating arm
CA2137471A1 (en) 1992-06-26 1994-01-06 Tugrul Yasar Transport system for wafer processing line

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3294670A (en) * 1963-10-07 1966-12-27 Western Electric Co Apparatus for processing materials in a controlled atmosphere

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1758531A (en) * 1926-10-22 1930-05-13 Elektrodenzerstaubung M B H Ge Vacuum dispersion coating process
LU45647A1 (de) * 1964-03-12 1965-09-13
LU52106A1 (de) * 1966-10-05 1968-05-07
US3594301A (en) * 1968-11-22 1971-07-20 Gen Electric Sputter coating apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3294670A (en) * 1963-10-07 1966-12-27 Western Electric Co Apparatus for processing materials in a controlled atmosphere

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021261484A1 (ja) * 2020-06-23 2021-12-30 三国電子有限会社 誘導結合プラズマによりスパッタリング成膜を行う成膜装置

Also Published As

Publication number Publication date
DE2134377B2 (de) 1974-04-25
AT304220B (de) 1972-12-27
SE366778B (de) 1974-05-06
ES393087A1 (es) 1973-10-01
JPS5520747Y2 (de) 1980-05-19
CA981622A (en) 1976-01-13
SU405215A3 (de) 1973-10-22
FR2098563A5 (de) 1972-03-10
DE2134377A1 (de) 1972-01-13
CA994708A (fr) 1976-08-10
GB1333617A (en) 1973-10-10
US3779885A (en) 1973-12-18
CH538551A (fr) 1973-06-30
DE2134377C3 (de) 1974-11-28
BE769722A (fr) 1971-11-16
NL7109534A (de) 1972-01-12

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