JPS5062300A - - Google Patents

Info

Publication number
JPS5062300A
JPS5062300A JP49111386A JP11138674A JPS5062300A JP S5062300 A JPS5062300 A JP S5062300A JP 49111386 A JP49111386 A JP 49111386A JP 11138674 A JP11138674 A JP 11138674A JP S5062300 A JPS5062300 A JP S5062300A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49111386A
Other languages
Japanese (ja)
Other versions
JPS5645420B2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5062300A publication Critical patent/JPS5062300A/ja
Publication of JPS5645420B2 publication Critical patent/JPS5645420B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C15/00—Cyclic hydrocarbons containing only six-membered aromatic rings as cyclic parts
    • C07C15/40—Cyclic hydrocarbons containing only six-membered aromatic rings as cyclic parts substituted by unsaturated carbon radicals
    • C07C15/42—Cyclic hydrocarbons containing only six-membered aromatic rings as cyclic parts substituted by unsaturated carbon radicals monocyclic
    • C07C15/44—Cyclic hydrocarbons containing only six-membered aromatic rings as cyclic parts substituted by unsaturated carbon radicals monocyclic the hydrocarbon substituent containing a carbon-to-carbon double bond
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2/00—Preparation of hydrocarbons from hydrocarbons containing a smaller number of carbon atoms
    • C07C2/02—Preparation of hydrocarbons from hydrocarbons containing a smaller number of carbon atoms by addition between unsaturated hydrocarbons
    • C07C2/42—Preparation of hydrocarbons from hydrocarbons containing a smaller number of carbon atoms by addition between unsaturated hydrocarbons homo- or co-oligomerisation with ring formation, not being a Diels-Alder conversion
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C205/00—Compounds containing nitro groups bound to a carbon skeleton
    • C07C205/06—Compounds containing nitro groups bound to a carbon skeleton having nitro groups bound to carbon atoms of six-membered aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2602/00—Systems containing two condensed rings
    • C07C2602/02—Systems containing two condensed rings the rings having only two atoms in common
    • C07C2602/04—One of the condensed rings being a six-membered aromatic ring
    • C07C2602/08—One of the condensed rings being a six-membered aromatic ring the other ring being five-membered, e.g. indane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Artificial Filaments (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
JP11138674A 1973-10-01 1974-09-26 Expired JPS5645420B2 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00402646A US3856752A (en) 1973-10-01 1973-10-01 Soluble polyimides derived from phenylindane diamines and dianhydrides

Publications (2)

Publication Number Publication Date
JPS5062300A true JPS5062300A (cg-RX-API-DMAC7.html) 1975-05-28
JPS5645420B2 JPS5645420B2 (cg-RX-API-DMAC7.html) 1981-10-26

Family

ID=23592765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11138674A Expired JPS5645420B2 (cg-RX-API-DMAC7.html) 1973-10-01 1974-09-26

Country Status (8)

Country Link
US (1) US3856752A (cg-RX-API-DMAC7.html)
JP (1) JPS5645420B2 (cg-RX-API-DMAC7.html)
CA (1) CA1036747A (cg-RX-API-DMAC7.html)
CH (1) CH599266A5 (cg-RX-API-DMAC7.html)
DE (1) DE2446383C2 (cg-RX-API-DMAC7.html)
FR (1) FR2246583B1 (cg-RX-API-DMAC7.html)
GB (1) GB1470705A (cg-RX-API-DMAC7.html)
IT (1) IT1022463B (cg-RX-API-DMAC7.html)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143329A (en) * 1981-03-03 1982-09-04 Nippon Telegr & Teleph Corp <Ntt> Photosensitive resin and its production
JPS58191747A (ja) * 1982-04-21 1983-11-09 チバ−ガイギ−・アクチエンゲゼルシヤフト 放射線感受性塗布剤
JPH0260934A (ja) * 1988-06-28 1990-03-01 Amoco Corp 中間層絶縁体および基板被膜用の低誘電率、低水分吸収ポリイミドおよびコポリイミド
JPH04235285A (ja) * 1990-10-30 1992-08-24 Internatl Business Mach Corp <Ibm> 無電解メッキ方法
JPH05331445A (ja) * 1992-06-04 1993-12-14 Sumitomo Bakelite Co Ltd フィルム接着剤の製造方法
JP2020504769A (ja) * 2016-10-25 2020-02-13 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド ポリイミド
JP2020519693A (ja) * 2017-05-12 2020-07-02 ドッティコン エーエス ホールディング アクチェン ゲゼルシャフト インダン誘導体及び有機エレクトロニクスにおけるそれらの使用

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4026876A (en) * 1975-01-20 1977-05-31 Ciba-Geigy Corporation Soluble polyamide-imides derived from phenylindane diamines
US4358580A (en) * 1981-08-19 1982-11-09 Standard Oil Company (Indiana) Polyimides from tricyclo dodecane-3,6-diphenyl-1,8,4,5-tetracarboxylic acid dianhydride and tricyclo dodecane tetracarboxylic acid anhydride
US4362859A (en) * 1981-08-19 1982-12-07 Standard Oil Company (Indiana) Polyimides from bicyclo[4.2.0]octane-7,8-dimethyl-3,4,7,8-tetracarboxylic acid dianhydride (I) and bicyclo [4.2.0]octane-2,5 diphenyl-7,8-dimethyl-3,4,7,8-tetracarboxylic dianhydride
US4360657A (en) * 1981-08-19 1982-11-23 Standard Oil Company (Indiana) Tricyclo[6.4.0.02,7 ]-dodecane-1,8,2,7-tetracarboxylic acid dianhydride and polyimides therefrom
US4358582A (en) * 1981-08-19 1982-11-09 Standard Oil Company (Indiana) Novel nonaromatic dianhydride and polyimides from tricyclo [4.2.1.02,5 ] nonane-3,4 dimethyl-3,4,7,8-tetracarboxylic acid dianhydride
EP0099338B1 (de) * 1982-07-14 1986-05-14 Ciba-Geigy Ag Mit Thermoplasten modifizierte Epoxyharzsysteme
US4495321A (en) * 1983-12-19 1985-01-22 Atlantic Richfield Company Polyimide and/or polyamide-imide compositions in mixed solvents
US4525507A (en) * 1983-12-30 1985-06-25 Mouhanad Chaker High flash point/low surface energy solvent systems for polyimide conformal coatings
US4557860A (en) * 1984-07-06 1985-12-10 Stauffer Chemical Company Solventless, polyimide-modified epoxy composition
US4675350A (en) * 1984-11-13 1987-06-23 Westinghouse Electric Corp. Compatible self-crosslinking poly (amide-imide) polyepoxide resin blends and laminates made therewith
US5047487A (en) * 1985-01-04 1991-09-10 Raychem Corporation Compositions of poly(imides) having phenylindane diamines and/or dianhydride moieties in the poly(imide) backbone
EP0191726A3 (de) * 1985-01-17 1988-05-11 Ciba-Geigy Ag Polypyrrol-Polyimidzusammensetzungen
US4828964A (en) * 1985-08-20 1989-05-09 International Business Machines Corporation Polyimide formulation for forming a patterned film on a substrate
JPS6250375A (ja) * 1985-08-30 1987-03-05 Mitsui Toatsu Chem Inc 耐熱性接着剤
US4741939A (en) * 1985-10-23 1988-05-03 Westinghouse Electric Corp. Compatible self-crosslinking poly (amide-imide) polyepoxide resin blends and laminates made therewith
US4784707A (en) * 1986-02-07 1988-11-15 Aluminum Company Of America Method of making electrical connections using joint compound
USRE34431E (en) * 1986-07-21 1993-11-02 General Electric Company Macrocyclic oligomers containing spiro(bis)indane moieties
US4980453A (en) * 1986-07-21 1990-12-25 General Electric Company Macrocyclic oligomers containing spiro(bis)indane moietes
US4830953A (en) * 1986-08-18 1989-05-16 Ciba-Geigy Corporation Radiation-sensitive coating composition with polyazide and polyimide and process of photo-crosslinking the coating
US4879350A (en) * 1986-09-19 1989-11-07 Ciba-Geigy Corporation Dehydrogenated polycyclopentadiene
US4840999A (en) * 1986-09-19 1989-06-20 Ciba-Geigy Corporation Dehydrogenated polyspiroheptadiene
US5614606A (en) * 1986-12-31 1997-03-25 Ciba-Geigy Corporation Polyamic acids and polyimides
US5606013A (en) * 1986-12-31 1997-02-25 Ciba-Geigy Corporation Polyamic acids and polyimides
US4950727A (en) * 1988-01-20 1990-08-21 General Electric Company Spiro(bis)indane polyamide and polyimide copolysiloxanes and method of preparation
US4935490A (en) * 1988-04-13 1990-06-19 E. I. Dupont De Nemours And Company Highly soluble aromatic polyimides
US4851505A (en) * 1988-04-13 1989-07-25 E. I. Du Pont De Nemours And Company Highly soluble aromatic polyimides
US5006611A (en) * 1989-01-20 1991-04-09 Ciba-Geigy Corporation Curable epoxy resin compositions of matter containing a thermoplastic which has phenolic end groups
US4975221A (en) * 1989-05-12 1990-12-04 National Starch And Chemical Investment Holding Corporation High purity epoxy formulations for use as die attach adhesives
US5104970A (en) * 1989-07-07 1992-04-14 Hexcel Corporation Reactive polyimides for addition to thermosetting resins, and process for preparation of same
US5015270A (en) * 1989-10-10 1991-05-14 E. I. Du Pont De Nemours And Company Phenylindane-containing polyimide gas separation membranes
US4971873A (en) * 1989-10-30 1990-11-20 Eastman Kodak Company Solvent soluble polyimides as binders in photoconductor elements
US5108825A (en) * 1989-12-21 1992-04-28 General Electric Company Epoxy/polyimide copolymer blend dielectric and layered circuits incorporating it
EP0438382A1 (en) * 1990-01-19 1991-07-24 Ciba-Geigy Ag Disubstituted aromatic dianhydrides and polyimides prepared therefrom
US5153303A (en) * 1990-01-19 1992-10-06 Ciba-Geigy Corporation Polyimides prepared from disubstituted aromatic tetracarboxylic acid dianhydrides
US5412065A (en) * 1993-04-09 1995-05-02 Ciba-Geigy Corporation Polyimide oligomers
US5753306A (en) * 1996-09-11 1998-05-19 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method of forming a composite coating with particle materials that are readily dispersed in a sprayable polyimide solution
US5723271A (en) * 1996-11-19 1998-03-03 Eastman Kodak Company Photographic elements having a process-surviving polysiloxane block copolymer backing
US5723270A (en) * 1996-11-19 1998-03-03 Eastman Kodak Company Photographic elements having a process-surviving polysiloxane block copolymer backing
US5830988A (en) * 1997-08-26 1998-11-03 Molecular Optoelectronics Corporation Indane polyetherimides
US6180008B1 (en) 1998-07-30 2001-01-30 W. R. Grace & Co.-Conn. Polyimide membranes for hyperfiltration recovery of aromatic solvents
WO2001034678A1 (fr) * 1999-11-10 2001-05-17 Kaneka Corporation Polyimide soluble et composition contenant ce dernier, feuille de liaison, film lamine adhesif utilise pour recouvrir un tube de faisceau d'accelerateur et film lamine adhesif utilise pour recouvrir un fil conducteur destine a un dispositif de chauffe refroidissant un accelerateur
US6866977B2 (en) 2000-05-19 2005-03-15 Eastman Kodak Company Photoconductive elements having a polymeric barrier layer
US6294301B1 (en) * 2000-05-19 2001-09-25 Nexpress Solutions Llc Polymer and photoconductive element having a polymeric barrier layer
US6593046B2 (en) 2000-05-19 2003-07-15 Heidelberger Druckmaschinen Ag Photoconductive elements having a polymeric barrier layer
US7264913B2 (en) * 2002-11-21 2007-09-04 Az Electronic Materials Usa Corp. Antireflective compositions for photoresists
US7081511B2 (en) * 2004-04-05 2006-07-25 Az Electronic Materials Usa Corp. Process for making polyesters
US9334360B2 (en) 2011-07-15 2016-05-10 Sabic Global Technologies B.V. Color-stabilized biodegradable aliphatic-aromatic copolyesters, methods of manufacture, and articles thereof
US8877862B2 (en) 2011-07-15 2014-11-04 Saudi Basic Industries Corporation Method for color stabilization of poly(butylene-co-adipate terephthalate
US8889820B2 (en) 2012-02-15 2014-11-18 Saudi Basic Industries Corporation Amorphous, high glass transition temperature copolyester compositions, methods of manufacture, and articles thereof
US8901273B2 (en) 2012-02-15 2014-12-02 Saudi Basic Industries Corporation Amorphous, high glass transition temperature copolyester compositions, methods of manufacture, and articles thereof
US8969506B2 (en) 2012-02-15 2015-03-03 Saudi Basic Industries Corporation Amorphous, high glass transition temperature copolyester compositions, methods of manufacture, and articles thereof
SG11201508593QA (en) * 2013-05-17 2015-12-30 Fujifilm Electronic Materials Novel polymer and thermosetting composition containing same
KR20160020506A (ko) * 2013-07-02 2016-02-23 킹 압둘라 유니버시티 오브 사이언스 앤드 테크놀로지 이무수물, 폴리이미드, 각각의 제조 방법, 및 사용 방법
BR112018001264B1 (pt) * 2015-07-23 2022-04-19 Huntsman Advanced Materials Americas Llc Composição curável, processo para produção de uma composição curável, artigo curado, e, método para produção de um prepreg ou towpreg.
US10793676B2 (en) * 2016-11-03 2020-10-06 Fujifilm Electronic Materials U.S.A., Inc. Polyimides
RU2019136679A (ru) 2017-04-18 2021-05-19 ХАНТСМАН ЭДВАНСТ МАТИРИАЛЗ АМЕРИКАС ЭлЭлСи Система отверждаемой смолы
EP3401305A1 (en) 2017-05-12 2018-11-14 Dottikon Es Holding Ag Indane derivatives and their use in organic electronics
KR102605655B1 (ko) 2017-06-16 2023-11-23 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 다층 구조물
JP7140686B2 (ja) 2017-09-11 2022-09-21 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド 誘電フィルム形成用組成物
ES2982344T3 (es) 2019-10-02 2024-10-15 Toray Industries Composición de resina de benzoxazina, producto preimpregnado y material compuesto reforzado con fibra
EP4041803A4 (en) 2019-10-04 2022-11-30 FUJIFILM Electronic Materials U.S.A., Inc. FLATTENING METHOD AND COMPOSITION
CN115280188A (zh) 2020-01-16 2022-11-01 富士胶片电子材料美国有限公司 干膜
CN111484412A (zh) * 2020-05-26 2020-08-04 上海华谊树脂有限公司 一种合成含茚满结构化合物的方法
JP7739057B2 (ja) 2020-06-17 2025-09-16 エボニック オペレーションズ ゲーエムベーハー 架橋中空糸膜およびその新たな製造方法
CN112409187B (zh) * 2020-11-30 2022-09-02 山东华夏神舟新材料有限公司 6-氨基-1-(4-氨基苯基)-1,3,3-三甲基茚满的合成方法
EP4255967A1 (en) 2020-12-04 2023-10-11 Toray Composite Materials America, Inc. Prepreg and carbon fiber-reinforced composite material
CN115181115B (zh) * 2021-11-15 2023-10-10 同济大学 螺环并双苯并噁唑环二胺、源自其的无色透明聚酰亚胺及其制备方法
WO2024184163A1 (en) 2023-03-03 2024-09-12 Huntsman Advanced Materials (Switzerland) Gmbh Bismaleimide compounds and low dielectric resin composition comprising them
CN119242040A (zh) * 2024-08-22 2025-01-03 广州市众拓塑胶模具有限公司 一种耐热高硬度工程塑料及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3649596A (en) * 1964-08-05 1972-03-14 Du Pont Polyamic acid from tricyclo-(4.2.2.0 2 5)-dec-7-ene - 3 4 9 10 - tetracarboxylic dianhydride
US3639356A (en) * 1965-10-12 1972-02-01 Chevron Res Tricyclo-decene tetracarboxylic acid diimide polymers
DE2009739A1 (de) * 1970-03-03 1971-09-30 Bayer Aromatische Polyimide mit erhöhter Löslichkeit
US3748338A (en) * 1972-05-01 1973-07-24 Ciba Geigy Corp Soluble polyimides from aromatic dianhydrides and 10,10-di-(p-aminophenyl)thioxanthene

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143329A (en) * 1981-03-03 1982-09-04 Nippon Telegr & Teleph Corp <Ntt> Photosensitive resin and its production
JPS58191747A (ja) * 1982-04-21 1983-11-09 チバ−ガイギ−・アクチエンゲゼルシヤフト 放射線感受性塗布剤
JPH0260934A (ja) * 1988-06-28 1990-03-01 Amoco Corp 中間層絶縁体および基板被膜用の低誘電率、低水分吸収ポリイミドおよびコポリイミド
JPH04235285A (ja) * 1990-10-30 1992-08-24 Internatl Business Mach Corp <Ibm> 無電解メッキ方法
JPH05331445A (ja) * 1992-06-04 1993-12-14 Sumitomo Bakelite Co Ltd フィルム接着剤の製造方法
JP2020504769A (ja) * 2016-10-25 2020-02-13 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド ポリイミド
US11939428B2 (en) 2016-10-25 2024-03-26 Fujifilm Electronic Materials U.S.A., Inc. Polyimides
JP2020519693A (ja) * 2017-05-12 2020-07-02 ドッティコン エーエス ホールディング アクチェン ゲゼルシャフト インダン誘導体及び有機エレクトロニクスにおけるそれらの使用
US11495746B2 (en) 2017-05-12 2022-11-08 Dottikon Es Holding Ag Indane derivatives and their use in organic electronics

Also Published As

Publication number Publication date
IT1022463B (it) 1978-03-20
DE2446383A1 (de) 1975-04-03
FR2246583A1 (cg-RX-API-DMAC7.html) 1975-05-02
US3856752A (en) 1974-12-24
JPS5645420B2 (cg-RX-API-DMAC7.html) 1981-10-26
FR2246583B1 (cg-RX-API-DMAC7.html) 1983-07-01
DE2446383C2 (de) 1982-04-01
GB1470705A (en) 1977-04-21
CA1036747A (en) 1978-08-15
CH599266A5 (cg-RX-API-DMAC7.html) 1978-05-31

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