JPS48101444A - - Google Patents

Info

Publication number
JPS48101444A
JPS48101444A JP48024473A JP2447373A JPS48101444A JP S48101444 A JPS48101444 A JP S48101444A JP 48024473 A JP48024473 A JP 48024473A JP 2447373 A JP2447373 A JP 2447373A JP S48101444 A JPS48101444 A JP S48101444A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48024473A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS48101444A publication Critical patent/JPS48101444A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
JP48024473A 1972-03-02 1973-03-02 Pending JPS48101444A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US23140272A 1972-03-02 1972-03-02

Publications (1)

Publication Number Publication Date
JPS48101444A true JPS48101444A (ja) 1973-12-20

Family

ID=22869092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48024473A Pending JPS48101444A (ja) 1972-03-02 1973-03-02

Country Status (6)

Country Link
US (1) US3759867A (ja)
JP (1) JPS48101444A (ja)
CA (1) CA1009785A (ja)
DE (1) DE2309924A1 (ja)
FR (1) FR2177780B1 (ja)
GB (1) GB1416092A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54149736A (en) * 1978-05-17 1979-11-24 Alps Electric Co Ltd Coating resin composition
JPS5645058A (en) * 1979-09-21 1981-04-24 Hitachi Ltd Resin sealing semiconductor device
JPS56122145A (en) * 1980-02-29 1981-09-25 Shin Etsu Chem Co Ltd Resin composition for sealing semiconductor device

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3925276A (en) * 1971-02-16 1975-12-09 Gen Electric Organopolysiloxane release resins useful in cooking and baking processes
NL7411631A (nl) * 1973-09-10 1975-03-12 Rhone Poulenc Sa Werkwijze voor de bereiding van vloeibare methyl- vinylfenylpolysiloxanharsen, werkwijze voor de bereiding van copolymeriseerbare samenstellingen met deze harsen, werkwijze voor het bekleden van voorwerpen, alsmede de beklede voorwerpen.
US3832420A (en) * 1973-09-20 1974-08-27 Dow Corning Silicone elastomer containing polymonomethylsiloxane
US4130599A (en) * 1975-05-19 1978-12-19 General Electric Company Silanol-free resins
DE2556420A1 (de) * 1975-12-15 1977-06-16 Wacker Chemie Gmbh Zu elastomeren haertbare massen auf grundlage von diorganopolysiloxanen und verfahren zum herstellen von organopolysiloxanelastomeren
JPS55165922A (en) * 1979-06-14 1980-12-24 Daicel Chem Ind Ltd Production of thermosetting organopolysiloxane
JP3415640B2 (ja) * 1992-07-29 2003-06-09 東レ・ダウコーニング・シリコーン株式会社 オルガノシロキサンオリゴマーの製造方法
JP4733937B2 (ja) * 2004-07-09 2011-07-27 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器
JP4676735B2 (ja) * 2004-09-22 2011-04-27 東レ・ダウコーニング株式会社 光半導体装置の製造方法および光半導体装置
JP4590253B2 (ja) * 2004-12-16 2010-12-01 東レ・ダウコーニング株式会社 オルガノポリシロキサンおよびシリコーン組成物
KR100589513B1 (ko) * 2005-11-29 2006-06-14 대영씨엔이(주) 질소산화물 제거를 위한 선택적 촉매환원반응용 촉매를이용한 코팅제 조성물, 그 선택적 촉매환원반응용 촉매모듈 소자, 및 그 선택적 촉매환원반응용 촉매 모듈
US8927652B2 (en) * 2012-12-07 2015-01-06 Ppg Industries Ohio, Inc. Coating compositions for food and beverage containers

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1290349A (ja) * 1968-12-09 1972-09-27

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54149736A (en) * 1978-05-17 1979-11-24 Alps Electric Co Ltd Coating resin composition
JPS5645058A (en) * 1979-09-21 1981-04-24 Hitachi Ltd Resin sealing semiconductor device
JPS6040189B2 (ja) * 1979-09-21 1985-09-10 株式会社日立製作所 樹脂封止型半導体装置
JPS56122145A (en) * 1980-02-29 1981-09-25 Shin Etsu Chem Co Ltd Resin composition for sealing semiconductor device
JPS6129544B2 (ja) * 1980-02-29 1986-07-07 Shinetsu Chem Ind Co

Also Published As

Publication number Publication date
FR2177780B1 (ja) 1976-09-10
US3759867A (en) 1973-09-18
DE2309924A1 (de) 1973-09-13
CA1009785A (en) 1977-05-03
FR2177780A1 (ja) 1973-11-09
GB1416092A (en) 1975-12-03

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