JPS5645058A - Resin sealing semiconductor device - Google Patents

Resin sealing semiconductor device

Info

Publication number
JPS5645058A
JPS5645058A JP12077079A JP12077079A JPS5645058A JP S5645058 A JPS5645058 A JP S5645058A JP 12077079 A JP12077079 A JP 12077079A JP 12077079 A JP12077079 A JP 12077079A JP S5645058 A JPS5645058 A JP S5645058A
Authority
JP
Japan
Prior art keywords
silica
resin sealing
powders
moisture content
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12077079A
Other languages
Japanese (ja)
Other versions
JPS6040189B2 (en
Inventor
Teruyuki Kagami
Yasuhiro Mochizuki
Komei Yatsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP54120770A priority Critical patent/JPS6040189B2/en
Publication of JPS5645058A publication Critical patent/JPS5645058A/en
Publication of JPS6040189B2 publication Critical patent/JPS6040189B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To perform Si resin seal with high reliability and good workability by limiting the moisture content of silica impalpable powders for a reinforcing filler. CONSTITUTION:When an Si resin sealing material is made, impalpable powders such as noncrystallized silica, dissolved quartz powders or the like as a reinforcing filler mixed into Si base polymer have high moisture absroption. Therefore, the moisture content of these silica impalpable powders has a great effect on the reliabil- ity of a resin sealing semiconductor device. The moisture content in the silica impalpable powders is maintained at 12% or below by weight. And the occurrence rate of inferior goods will remarkably be reduced and the reliability of the device will greatly be improved.
JP54120770A 1979-09-21 1979-09-21 Resin-encapsulated semiconductor device Expired JPS6040189B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54120770A JPS6040189B2 (en) 1979-09-21 1979-09-21 Resin-encapsulated semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54120770A JPS6040189B2 (en) 1979-09-21 1979-09-21 Resin-encapsulated semiconductor device

Publications (2)

Publication Number Publication Date
JPS5645058A true JPS5645058A (en) 1981-04-24
JPS6040189B2 JPS6040189B2 (en) 1985-09-10

Family

ID=14794565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54120770A Expired JPS6040189B2 (en) 1979-09-21 1979-09-21 Resin-encapsulated semiconductor device

Country Status (1)

Country Link
JP (1) JPS6040189B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04146655A (en) * 1990-10-08 1992-05-20 Hitachi Ltd Semiconductor rectifying element and full-wave rectifying device using same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48101444A (en) * 1972-03-02 1973-12-20
JPS502045A (en) * 1973-05-09 1975-01-10

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48101444A (en) * 1972-03-02 1973-12-20
JPS502045A (en) * 1973-05-09 1975-01-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04146655A (en) * 1990-10-08 1992-05-20 Hitachi Ltd Semiconductor rectifying element and full-wave rectifying device using same

Also Published As

Publication number Publication date
JPS6040189B2 (en) 1985-09-10

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