JPH1197288A - Laminated ceramic electronic component and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide laminated ceramic electronic components in which internal electrodes can be surely connected to external electrodes, even when the thicknesses of the internal electrodes are reduced for high lamination. SOLUTION: Since an internal electric stripe pattern 7d is utilized as thick internal electric sections in laminated ceramic electronic components, thinned internal electrodes 1d can be surely connected to external electrodes via the pattern 7d and, at the same time, the thick internal electric sections can be formed very easily by locally thickening the electrodes 1d. Therefore, highly laminated ceramic electronic components can be realized with high productivity and high accuracy at low cost.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer ceramic electronic component for stabilizing the connection between an internal electrode and an external electrode of a multilayer ceramic electronic component such as a multilayer ceramic capacitor and a multilayer piezoelectric element used in various electronic devices, and a method of manufacturing the same. It is about.

[0002]

2. Description of the Related Art Conventionally, multilayer ceramic capacitors have been required to be further reduced in size, increased in capacity, and reduced in cost with the miniaturization and high performance of various electronic devices. For this reason, it is desired to change the internal electrode from the conventional palladium to nickel, and to further reduce the thickness of the dielectric (less than 2 μm after firing) and increase the number of layers (more than 300 layers). High cost due to lowness has been a problem.

[0003] For this reason, it is desired to make the internal electrode thinner. In particular, when a base metal using nickel, copper, alloy or the like is used for the internal electric power, the connection between the internal electrode and the external electrode becomes thinner as the thickness becomes thinner. Was difficult.

Japanese Patent Application Laid-Open No. 62-40713 and Japanese Patent Application Laid-Open
Japanese Patent Application Laid-Open No. 2-40714 attempts to extend the internal electrode to the side surface of the chip by devising the pattern of the internal electrode. In Japanese Patent Application Laid-Open No. 1-312816, the connection between the internal electrode and the external electrode is made at the corner of the chip. In Japanese Patent Application Laid-Open No. 1-312817, a pattern shape of an internal electrode is devised so as to connect a plurality of internal electrodes, and a connection portion between an internal electrode and an external electrode is formed on a plurality of surfaces (not only an end surface, (A plurality of surfaces including a part of the side surface adjacent to the end surface).

FIG. 10 is a partial cross-sectional view of the multilayer ceramic capacitor of the first conventional example. In FIG. 10, reference numeral 1a denotes an internal electrode, and a plurality of layers are built in the ceramic layer 2a so as to alternately overlap. Reference numeral 3 denotes an external electrode, which is alternately connected to a plurality of layers of internal electrodes 1a. Reference numerals 4 and 5 denote each surface of the multilayer ceramic capacitor. When 4 is an end surface and 5 is a side surface, the internal electrodes 1a
Is configured to be connected to the external electrode 3 on a plurality of surfaces of the end surface 4 and the side surface 5.

Here, in Japanese Unexamined Patent Publication Nos. Hei 2-156618 and Hei 2-156609, a connection between an internal electrode and an external electrode is made on a plurality of side surfaces of a chip, and a slit is formed in the internal electrode in order to further improve high frequency characteristics. It forms patterns and cuts. In Japanese Patent Application Laid-Open No. 5-471591, the sinterability is improved by inserting a dummy internal electrode that does not contribute to the capacity.

However, only by devising the pattern shape of the conventional internal electrode, the connection between the external electrode and the internal electrode becomes more difficult as the internal electrode becomes thinner. For this reason, Japanese Patent Application Laid-Open Nos. 5-304042 and 5-3
Japanese Patent No. 35175 proposes that the connection between the internal electrode and the external electrode is improved by locally increasing the portion of the internal electrode connected to the external electrode.

According to this, when the internal electrodes are thinned, it is effective in improving the connection yield between the external electrodes and the internal electrodes, but the number of stacked internal electrodes is 300.
When the number of layers is equal to or more than 500 or more than 500, irregularities (or steps) due to the connection internal voltage are likely to occur in the multilayer ceramic capacitor.

The possibility of occurrence of the unevenness (or step) will be described with reference to FIG. FIG. 11 is a partial cross-sectional view of the multilayer ceramic capacitor of Conventional Example 2. FIG.
In the above, only the connection portion between the internal electrode and the external electrode is locally thickened. In FIG. 11, some of the external electrodes and the ceramic layer are removed for easy explanation.
In FIG. 11, reference numeral 2b denotes a ceramic layer, which is formed while burying a plurality of internal electrodes 1b vertically. 6
Is a connection internal electrode, which is locally formed on the internal electrode 1b. Compared to FIG. 10, in FIG. 11, it can be seen that the introduction of the connection internal electricity 6 makes the ceramic layer 2b uneven. When the ceramic layer 2b has irregularities, the internal electrodes 1b are formed in an irregular state. In particular, in the ceramic layer 2b, irregularities due to the connection internal voltage 6 are generated. The internal electrode 1b is apt to be cut in the vicinity of the uneven portion.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has as its object to realize a multilayer ceramic electronic component capable of reliably connecting an internal electrode and an external electrode even when the number of layers is increased, and a method of manufacturing the same. .

[0011]

According to the present invention, an internal electric stripe pattern is used as an internal electric thick part, and an internal electrode and an external electrode are securely connected via the internal electric stripe pattern. As a result, it is possible to form the internal electrode thick portion in which the internal electrode is locally thickened very easily, and it is possible to achieve high-precision and high-lamination at low cost with good productivity.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, an internal electrode and a ceramic layer are alternately laminated, and a portion of the internal electrode connected to an external electrode is locally thicker than other portions. In the multilayer ceramic electronic component having the formed inner thickness part, the inner electrode and the inner thickness part are made of a base metal material, and the thickness of the inner thickness part is 1 μm or more and 20 μm or less, and The multilayer ceramic electronic component is connected to the external electrode at a plurality of locations, and has an effect that stable connection with the external electrode can be performed even with a thin internal electrode.

According to a second aspect of the present invention, there is provided the multilayer ceramic electronic component according to the first aspect, wherein the inner electrode thick portion is connected to the external electrode also on the side surface.
Even if the internal electrode has a small thickness, it has an effect that a more stable connection with the external electrode can be performed.

According to a third aspect of the present invention, there is provided the multilayer ceramic electronic component according to the first aspect, wherein the particle diameter of the internal electrode is different from the particle diameter of the inner electrode thick portion. By using base metal particles having a particle size, the thickness of the internal electrode can be locally increased and the connection stability between the external electrode and the internal electrode can be improved.

According to a fourth aspect of the present invention, there is provided the multilayer ceramic electronic component according to the first aspect, wherein the ceramic powder is contained only in the thick portion of the inner electrode, and the thickness is locally increased. By containing ceramic powder in the portion which has been made, the difference in sintering density and sinterability between different materials can be absorbed between the base metal internal electrode and the ceramic layer.
Even in a multilayer ceramic electronic component having a high number of laminated layers of zero or more, it has an effect that the probability of occurrence of defects such as delamination (delamination) can be reduced.

According to a fifth aspect of the present invention, the internal electrodes and the ceramic layers are alternately laminated, and a portion of the internal electrode connected to the external electrode is formed to be locally thicker than other portions. A method for manufacturing a multilayer ceramic electronic component having an inner thick part, wherein a plurality of internal electrodes formed on a ceramic green sheet are formed at equal pitches with a width of 0.05 mm or more and 1 mm or less as inner thick parts. After forming an internal electric stripe pattern having a continuous width and forming a ceramic green laminate by laminating a predetermined number of the ceramic green sheets, the ceramic green laminate is parallel and perpendicular to the internal electric stripe pattern, In addition, when divided into individual pieces, the inner electrode stripe pattern is divided so as to be exposed at a plurality of positions of the individual pieces, and external electrodes are formed so as to cover the exposed inner electrode stripe patterns. A manufacturing method of a multilayer ceramic electronic component, it is possible to form the inner conductive thick portions very thin with internal conductive stripe pattern, an effect that can be produced with good productivity at a low cost.

According to a sixth aspect of the present invention, there is provided the method for manufacturing a multilayer ceramic electronic component according to the fifth aspect, wherein the inner electric stripe pattern is formed by gravure printing. This has the effect that multilayer ceramic electronic components can be manufactured at low cost and with good productivity.

According to a seventh aspect of the present invention, there is provided a method of manufacturing a multilayer ceramic electronic component according to the fifth aspect, wherein the internal electric stripe pattern is formed by ink jet printing. Patterns can be easily manufactured, and have the effect of reducing the cost of multilayer ceramic electronic components.

Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. (Embodiment 1) Embodiment 1 of the present invention is shown in FIG.
This will be described with reference to FIG. FIG. 1 is a partially cutaway perspective view showing the internal configuration of the multilayer ceramic electronic component. In FIG. 1, reference numeral 7a denotes an internal electric stripe pattern which becomes an internal electric thick part. The internal electrode 1c is connected to the external electrode 3 together with the internal electrode stripe pattern 7a. The internal electrode 1c and the internal electric stripe pattern 7a are built in the ceramic layer 2c so that a plurality of layers alternately overlap. Reference numerals 4 and 5 indicate the respective surfaces of the multilayer ceramic electronic component, 4 indicates an end surface, and 5 indicates a side surface. FIG. 2 is a partially cutaway perspective view showing the internal configuration of the multilayer ceramic electronic component, and corresponds to a state where the external electrodes 3 in FIG. 1 are removed.
In FIG. 2, the inner electric stripe pattern 7b is configured to be exposed at a plurality of positions on the end face 4 and the side face 5 of the multilayer ceramic electronic component.

The internal electric stripe pattern 7b does not need to be formed on all internal electrodes. The inner stripe pattern 7b may be formed every other layer, every few layers, or irregularly. By forming in this way,
The formation cost of the internal electricity stripe pattern 7b can be reduced.

(Embodiment 2) A multilayer ceramic electronic component and a method of manufacturing the same according to Embodiment 2 of the present invention will be described with reference to FIGS. FIG. 3 is a perspective view of a main part for describing the internal structure of the multilayer ceramic electronic component. In FIG. 3, an internal electric stripe pattern 7 c which is an internal electric thick part is formed so as to cover the internal electrode 1 c, and is formed so as to be exposed at least on the end face 4 and the side face 5. The inner electric stripe pattern 7c is composed of the plurality of exposed portions (end face 4 and side face 5).
Is configured to be connected to an external electrode (not shown in FIG. 3).

Next, in this embodiment, means for exposing the inner stripe pattern on the end face 4 and the side face 5 will be described in more detail with reference to FIGS. 4, 5 and 6. FIG. FIG. 4 is a perspective sectional view of the ceramic green laminate,
Reference numeral 8 denotes a ceramic green laminate. Ceramic laminate 8
Of the internal electrode 1 on the surface and inside of the
d and an internal electricity stripe pattern 7d are formed.
As shown in FIG. 4, the plurality of internal electrodes 1d are connected by an internal stripe pattern 7d.

FIG. 5 illustrates the first cutting direction of the ceramic green laminate 8. In FIG. 5, 9
a is the cutting direction. When the ceramic green laminate 8 is cut along the cutting direction 9a in FIG. 5, the ceramic green laminate 8 is cut in a direction orthogonal to the internal electricity stripe pattern 7d.

FIG. 6 illustrates a second cutting direction of the ceramic green laminate. In FIG. 6, 9b
Is the cutting direction. When the ceramic green laminate 8 is cut along the cutting direction 9b in FIG. 6, the ceramic green laminate 8 is cut while the internal power stripe pattern is divided into two at the center.

This will be described in more detail. First, a ceramic green laminate 8 as shown in FIG. 4 was prepared using nickel as the internal electrode 1d and the internal electrode stripe pattern 7d. Note that the inner ceramic stripe pattern used in the present embodiment was formed by the method described in the third embodiment described later. Here, the thickness of the internal electrode 1d is 0.5
The thickness of the internal electric stripe pattern 7d was set to 3 μm.

Next, as shown in FIGS. 5 and 6, this ceramic green laminate 8 is cut and fired to obtain a sample corresponding to FIG. 3 or FIG. To be exposed). Next, external electrodes were formed thereon using a firing type copper paste. When the characteristics of this sample were measured, the following results were obtained. For comparison, FIG. 10 was prepared as Conventional Example 1. In addition, as the second conventional example, one equivalent to FIG.

First, in Conventional Example 2, the internal electrode 1b was prepared by screen printing, and the connection internal electricity 6 was screen-printed thereon while being aligned each time. For this reason,
Since the number of printing steps is doubled, and alignment in three directions of XYθ is required each time, the manufacturing cost is increased. The results are summarized below (Table 1).

From the results shown in Table 1, it can be seen that when the internal electrodes are thin, the pass number is low in Conventional Example 1. Then, the exposed portion of the internal electrode of the same sample was observed, but it was hardly exposed. When the cross section of the sample was observed with a scanning electron microscope, the internal electrodes were extremely thin and cut. For this reason, it was found that the reason why the pass number of the conventional example 1 was small was due to the internal electrode. In addition, in the conventional example 2, the number of passed was high.

[0029]

[Table 1]

(Embodiment 3) As Embodiment 3 of the present invention, a method of forming an internal electric stripe pattern by a gravure printing method will be described with reference to FIG. FIG.
This figure shows a state in which an inner electrode stripe pattern 7e to be an inner electrode thick portion is continuously formed on the internal electrodes formed on the ceramic raw sheet 14. In FIG. 7, 10
Is a gravure plate, and 11 is an impression cylinder. Gravure version 1
0, the impression cylinder 11 rotates in the direction of arrow 12a. At this time, the lower part of the gravure plate 10 is immersed in an ink reservoir (not shown), and the ink adheres. Thereafter, excess ink is scraped off with a doctor blade (not shown).

While the base film 13 and the ceramic green sheet 14 formed on the base film 13 are fed in the direction of arrow 12b, a predetermined pattern is printed on the surface thereof. In the present embodiment, by forming the stripe pattern 15 on the surface of the gravure plate 10, the internal electrode stripe pattern 7 is formed on the internal electrode 1 e formed on the ceramic green sheet 14.
e is formed.

As in the present embodiment, the inner electric stripe pattern 7e is formed by gravure printing to obtain a 10 m / m
Min-200 m / min, high-speed, high-precision formation (gravure plate 10
Is formed by a rigid metal body, the accuracy can be improved). In the case of the gravure printing method, since the printing can be performed while performing alignment using a continuous film, the alignment between the internal electrode 1e and the internal electrode stripe pattern 7e is simplified.
In particular, by regularly forming the internal electrodes 1e in a grid pattern as shown in FIG. 7, the stripe pattern can be aligned in only one direction.

A commercially available sheet edge controller can be used for such alignment only in the film width direction. In the case of Conventional Example 2 (see Embodiment 2),
The printing of the connection internal line 6 is performed at a low speed of 0.1 to 0.2 m / min, and the positioning in the three directions of XYθ is required each time. In addition, since screen printing is performed, the screen plate is elongated or deformed due to an increase in the number of times of printing.

Needless to say, the internal electrode 1e can be formed by gravure printing or ink jet printing in addition to screen printing. In particular, in the present embodiment, the internal electrode 1e can be formed with high productivity and high precision by gravure printing the internal electrode 1e.

(Embodiment 4) As Embodiment 4 of the present invention, a method of forming an internal electric stripe pattern by an ink jet method will be described with reference to FIG. In FIG. 8, reference numeral 16 denotes an ink jet device. The electrode ink (not shown) filled in the ink tank 18 is sent to the ink jet device 16 via the tube 17,
A predetermined pattern is printed by an external electric signal (not shown). In the fourth embodiment, the ink jet device 16 prints the internal electric stripe pattern 7f to be the internal electric thick part. In the present embodiment, the internal electrode 1f is formed directly on the base film 13 and sent in the direction of arrow 12c. At this time, the internal electrode stripe pattern 7f is formed on the internal electrode 1f by the ink jet device 16 in a non-contact manner. For this reason, even if the internal electrode 1f is not dried (the solid state immediately after printing), the internal electrode stripe pattern 7f can be formed, and the manufacturing cost can be reduced.

In particular, in the present embodiment, the pitch, width, thickness, and the like of the internal stripe pattern 7f can be freely set by an external electric signal, so that it is possible to cope with the production of many kinds of small quantities. Of course, the internal electrode 1f is
It may be formed by ink jet printing other than gravure printing and screen printing.

(Embodiment 5) As Embodiment 5 of the present invention, a method of forming an internal electric stripe pattern 7g to be an internal electric thick part by a screen printing method will be described with reference to FIG. In FIG. 9, reference numeral 19 denotes a rotary screen plate on which a stripe pattern 20 is formed. The ceramic raw sheet 14 is indicated by an arrow 12c.
At this time, the ink comes in contact with the rotary screen plate 19 rotating as indicated by the arrow 12c, and the ink is applied from the stripe pattern 20, thereby forming the internal electricity stripe pattern 7g.

In particular, in the present embodiment, since the alignment between the internal electrode stripe pattern 7g and the internal electrode 1g needs to be performed only in one direction, it can be performed automatically only by using a commercially available sheet edge controller. As the rotary screen plate 19, a commercially available nickel plating plate can be used. Also, in FIG. 9, ink and a squeegee are contained inside the rotary screen plate 19, but these are not shown.

The internal electric stripe pattern 7g may be formed on the internal electrode 1g, or may be formed first and then formed below the internal electrode 1g. Also, internal electrode 1g and internal electric stripe pattern 7g
May be formed directly on the ceramic green sheet or directly on the base film. Further, as proposed by the present inventors in Japanese Patent No. 2636306 or the like, it may be embedded in a ceramic green sheet.

(Embodiment 6) As Embodiment 6 of the present invention, optimization of the material of the internal electrode and the internal stripe pattern will be described. In particular, when manufacturing a small and large-capacity multilayer ceramic capacitor desired from the market, it is essential to make the internal electrodes thinner and increase the number of stacked layers.

This will be described in more detail. First, in order to make the internal electrode thinner, an internal electrode ink was prepared using nickel powder having a particle size of 0.2 μm. Then, the internal electrodes were formed on the green ceramic sheet by gravure printing. Then, a multilayer ceramic capacitor was prepared using the internal electrodes. For the inner stripe pattern, nickel powder having a particle size of 1 μm was used. Both the internal electrodes and the internal stripe pattern were formed by gravure printing. Observation of the cross section of the multilayer ceramic capacitor thus produced revealed that the thickness of the internal electrode was 0.2 to 0.5 μm after firing, and that the thickness of the internal electrode stripe pattern was 1.0 to 2.0 μm after firing. It was possible to automatically increase the thickness of the inner electrode stripe pattern than the internal electrodes without devising ink or ink.

As the particle size becomes finer, such as 0.2 μm, the unit price of the electrode powder itself increases, and it becomes more difficult to disperse (make ink). On the other hand, electrode powder having a particle size of about 1.0 μm has a low unit price and is easy to be dispersed (made into ink). Also, as for the electrode powder material, a unit price is high for a material having high purity and high uniformity. For this reason, the unit price of the product can be further reduced by selectively using the electrode material and electrode powder that can be made thinner even if the internal electrode part is expensive and the inexpensive stripe pattern part. Can be Also, different materials can be used, such as nickel for the internal electrode and an alloy material that easily forms an alloy with the external electrode for the internal electrode stripe pattern. By doing so, the internal electrode can be made thinner, and the internal electric stripe pattern can perform more stable connection with the external electrode.

(Embodiment 7) As Embodiment 7 of the present invention, the shrinkage ratio of the electrode portion and the ceramic portion at the time of firing is adjusted by adding a dielectric powder to the internal stripe pattern, and the delamination ( A method for reducing defects such as delamination will be described. Conventionally, as disclosed in
In JP-A-153646 and the like, it is proposed to add a ceramic material or a non-conductive material similar to the ceramic material to the internal electrode in order to adjust the shrinkage ratio during firing. However, the addition of such a material results in the internal electrode having a thickness of 2 μm.
When the thickness is as thick as above, there is an effect, but the thickness of the internal electrode is 2 μm.
When the diameter is less than m (especially 1 μm or less), the internal electrodes are conversely porous (porous), so that the internal electrodes are cut off, resulting in a reduction in capacity and a difficulty in connecting the internal electrodes to the external electrodes. Was.

In the present embodiment, the internal electrode can be made of only the electrode material without adding the ceramic material or the non-conductor, and the ceramic material or the non-conductor can be added only to the internal electric stripe pattern. In particular, in the present embodiment, the electrode material is concentrated on the inner stripe pattern portion,
Depending on firing conditions, delamination or the like may occur. In such a case, for example, the same ceramic material (preferably having a particle size of about 0.3 to 1 μm) is added to the inner electrode stripe pattern by about 1 to 30% by weight.
Such defects can be prevented from occurring.

The internal electrodes can be made of a material such as nickel, copper or the like as a single material or as an alloy. Also, it is desirable that the inner electric stripe pattern has a thickness of 1 μm or more and 20 μm or less and is connected to an external electrode on a plurality of side surfaces or a plurality of locations. The inner electric stripe pattern has a thickness of 0.
If it is 5 μm or less, the effect of improving connection stability is small. When the thickness of the inner electric stripe pattern exceeds 25 μm, delamination may occur.

As the ink used for the internal electric stripe pattern, an ink that dissolves a ceramic green sheet can be used. When the thickness of the ceramic raw sheet is 10 μm or less, a plurality of internal electrodes are short-circuited by the internal electric stripe pattern, so that the internal electrodes of a plurality of layers are connected via the internal electric stripe pattern (in addition to the external electrodes). Therefore, the product yield can be further increased.

[0047]

As is clear from the above description of the embodiments, according to the present invention, the use of the internal electrode stripe pattern enables the connection between the internal electrode and the external electrode as if the internal electrode was thinned. Even if it becomes difficult, products can be manufactured with high yield. In addition, since the internal electrode and the external electrode are connected not by the internal electrode for connection but by the internal electrode stripe pattern in which the pattern is continuously formed, the alignment with the internal electrode can be simplified. It can be manufactured at low cost and high productivity.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view showing an internal configuration of a multilayer ceramic electronic component according to a first embodiment of the present invention.

FIG. 2 is a partially cutaway perspective view showing an internal configuration of the embodiment.

FIG. 3 is an essential part perspective view for describing an internal structure of a multilayer ceramic electronic component according to a second embodiment of the present invention.

FIG. 4 is a perspective view of the ceramic green laminate of the embodiment.

FIG. 5 is a perspective sectional view illustrating a first cutting direction of the ceramic green laminate of the embodiment.

FIG. 6 is a perspective cross-sectional view for explaining a second cutting direction of the ceramic green laminate of the embodiment.

FIG. 7 is a schematic perspective view showing a state in which an internal electric stripe pattern according to a third embodiment of the present invention is continuously formed on internal electrodes formed on a ceramic raw sheet.

FIG. 8 is a schematic perspective view for explaining a method of forming an internal electric stripe pattern by an ink jet method according to a fourth embodiment of the present invention.

FIG. 9 is a schematic perspective view for explaining a method of forming an internal electric stripe pattern by a gravure printing method according to a fifth embodiment of the present invention.

FIG. 10 is a partial cross-sectional view of a multilayer ceramic capacitor of Conventional Example 1.

FIG. 11 is a partial cross-sectional view of a multilayer ceramic capacitor of Conventional Example 2.

[Explanation of symbols]

 1a to 1g Internal electrode 2a to 2c Ceramic layer 3 External electrode 4 End face 5 Side face 6 Internal power for connection 7a to 7g Internal power stripe pattern (inner power thick part) 8 Ceramic raw laminate 9a, 9b Cutting direction 10 Gravure plate 11 Impression cylinders 12a to 12c arrows 13 base film 14 ceramic raw sheet 15 stripe pattern 16 ink jet device 17 tube 18 ink tank 19 rotary screen plate 20 stripe pattern

Claims (7)

[Claims] 1. A multilayer ceramic electronic component having an internal electrode thick portion in which internal electrodes and ceramic layers are alternately laminated, and a portion of the internal electrode connected to an external electrode is locally thicker than other portions. , Wherein the internal electrode and the internal thick portion are made of a base metal material, and the internal thick portion has a thickness of 1 μm or more and 20 μm or less, and is connected to the external electrode at a plurality of locations. . 2. The multilayer ceramic electronic component according to claim 1, wherein the inner electric thick part is connected to the external electrode also on the side surface. 3. The multilayer ceramic electronic component according to claim 1, wherein the particle diameter of the internal electrode is different from the particle diameter of the thick inner wall portion. 4. The multilayer ceramic electronic component according to claim 1, wherein the ceramic powder is contained only in the thick portion of the inner electrode. 5. A multilayer ceramic electronic device having an internal electrode thick portion in which internal electrodes and ceramic layers are alternately stacked, and a portion of the internal electrode connected to an external electrode is locally thicker than other portions. A method of manufacturing a component, wherein a continuous inner electrode stripe pattern having a width of 0.05 mm or more and 1 mm or less is formed at a constant pitch as an inner electrode thick portion on a plurality of internal electrodes formed on a ceramic raw sheet. After a predetermined number of the ceramic green sheets are laminated to form a ceramic green laminate, the ceramic green laminate is divided into individual pieces in a direction parallel and perpendicular to the internal electric stripe pattern, and the internal electric A multi-layer ceramic electronic component in which a stripe pattern is divided so as to be exposed at a plurality of portions of the individual piece, and external electrodes are formed so as to cover the exposed inner electrode stripe pattern. Construction method. 6. The method for manufacturing a multilayer ceramic electronic component according to claim 5, wherein the internal electric stripe pattern is formed by gravure printing. 7. The method for producing a multilayer ceramic electronic component according to claim 5, wherein the internal electric stripe pattern is formed by ink jet printing.