JPH1187599A - リードフレーム及びこれを備えた半導体装置 - Google Patents

リードフレーム及びこれを備えた半導体装置

Info

Publication number
JPH1187599A
JPH1187599A JP10207151A JP20715198A JPH1187599A JP H1187599 A JPH1187599 A JP H1187599A JP 10207151 A JP10207151 A JP 10207151A JP 20715198 A JP20715198 A JP 20715198A JP H1187599 A JPH1187599 A JP H1187599A
Authority
JP
Japan
Prior art keywords
island
lead
lead frame
semiconductor device
base portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10207151A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1187599A5 (enExample
Inventor
Akie Ooshima
晶恵 大島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UMC Japan Co Ltd
Original Assignee
Nippon Steel Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Semiconductor Corp filed Critical Nippon Steel Semiconductor Corp
Priority to JP10207151A priority Critical patent/JPH1187599A/ja
Publication of JPH1187599A publication Critical patent/JPH1187599A/ja
Publication of JPH1187599A5 publication Critical patent/JPH1187599A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP10207151A 1997-07-07 1998-07-07 リードフレーム及びこれを備えた半導体装置 Pending JPH1187599A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10207151A JPH1187599A (ja) 1997-07-07 1998-07-07 リードフレーム及びこれを備えた半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9-195239 1997-07-07
JP19523997 1997-07-07
JP10207151A JPH1187599A (ja) 1997-07-07 1998-07-07 リードフレーム及びこれを備えた半導体装置

Publications (2)

Publication Number Publication Date
JPH1187599A true JPH1187599A (ja) 1999-03-30
JPH1187599A5 JPH1187599A5 (enExample) 2005-10-27

Family

ID=26509005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10207151A Pending JPH1187599A (ja) 1997-07-07 1998-07-07 リードフレーム及びこれを備えた半導体装置

Country Status (1)

Country Link
JP (1) JPH1187599A (enExample)

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