JPH118450A - Metal base circuit board - Google Patents
Metal base circuit boardInfo
- Publication number
- JPH118450A JPH118450A JP15853197A JP15853197A JPH118450A JP H118450 A JPH118450 A JP H118450A JP 15853197 A JP15853197 A JP 15853197A JP 15853197 A JP15853197 A JP 15853197A JP H118450 A JPH118450 A JP H118450A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- circuit board
- metal
- elastic modulus
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、応力緩和性に優
れ、しかも放熱性に優れた金属ベ−ス回路基板に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal-based circuit board excellent in stress relaxation and heat dissipation.
【0002】[0002]
【従来の技術】従来より、金属板上に無機フィラ−を充
填したエポキシ樹脂等からなる絶縁層を設け、その上に
導電回路を配設した金属ベース回路基板が、熱放散性に
優れることから高発熱性電子部品を実装する回路基板と
して用いられている。2. Description of the Related Art Conventionally, a metal base circuit board having an insulating layer made of an epoxy resin or the like filled with an inorganic filler on a metal plate and having a conductive circuit disposed thereon has excellent heat dissipation. It is used as a circuit board on which high heat-generating electronic components are mounted.
【0003】一方、車載用電子機器について、その小型
化、省スペ−ス化と共に、電子機器をエンジンル−ム内
に設置することが要望されている。エンジンル−ム内は
温度が高く、温度変化が大きいなど過酷な環境であり、
また、放熱面積の大きな基板が必要とされる。このよう
な用途に対して、放熱性に優れる前記金属ベ−ス回路基
板が注目されている。[0003] On the other hand, there is a demand for electronic equipment to be mounted in an engine room as well as to reduce the size and space of electronic equipment for vehicles. The engine room is in a harsh environment such as high temperatures and large temperature changes.
Further, a substrate having a large heat dissipation area is required. For such applications, attention has been paid to the metal-based circuit boards having excellent heat dissipation.
【0004】従来の金属ベ−ス回路基板は、熱放散性や
経済的な理由からアルミニウム板を用いることが多い
が、実使用下で加熱/冷却が繰り返されると、前記アル
ミニウム板と電子部品、特にチップ部品との熱膨張率の
差に起因して大きな熱応力が発生し、部品を固定してい
る半田部分或いはその近傍にクラックが発生するなど電
気的信頼性が低下するという問題点がある。A conventional metal-based circuit board often uses an aluminum plate for heat dissipation and economical reasons. However, if heating / cooling is repeated in actual use, the aluminum plate and electronic components and In particular, there is a problem that a large thermal stress is generated due to a difference in the coefficient of thermal expansion from the chip component, and cracks are generated in a solder portion fixing the component or in the vicinity thereof, thereby deteriorating electrical reliability. .
【0005】又、絶縁層に低弾性率の材料を用いること
により金属板と電子部品との間で発生する応力を緩和す
ることができる。しかし、チップ部品のサイズが大きく
なればなるほど前記材料の弾性率を大幅に下げる必要が
あるが、低弾性率の材料は一般にアルミニウムや回路導
体の銅とは密着性が弱く、そのために、導電箔と金属板
との密着性に優れる金属ベース回路基板が得られないと
いう問題がある。特に、導電箔の金属板との密着性は高
温度下で著しく低下するために、耐熱性に優れる金属ベ
ース回路基板が得難い。Further, by using a material having a low elastic modulus for the insulating layer, stress generated between the metal plate and the electronic component can be reduced. However, as the size of the chip component increases, the modulus of elasticity of the material needs to be greatly reduced.However, a material having a low modulus of elasticity generally has low adhesion to aluminum or copper of a circuit conductor. There is a problem that a metal base circuit board having excellent adhesion between the metal base plate and the metal plate cannot be obtained. In particular, since the adhesion of the conductive foil to the metal plate is significantly reduced at high temperatures, it is difficult to obtain a metal-based circuit board having excellent heat resistance.
【0006】[0006]
【発明が解決しようとする課題】本発明は、上記の事情
に鑑みてなされたものであり、金属板と導電回路との密
着性に優れ、しかも応力緩和に優れるので、急激な加熱
/冷却を受けても半田或いはその近傍でクラック発生等
の異常を生じない、熱放散性に優れる金属ベ−ス回路基
板を提供することを目的とするものである。DISCLOSURE OF THE INVENTION The present invention has been made in view of the above circumstances, and has excellent adhesion between a metal plate and a conductive circuit and excellent stress relaxation. It is an object of the present invention to provide a metal-based circuit board excellent in heat dissipation, which does not cause an abnormality such as crack generation in the solder or its vicinity even when received.
【0007】[0007]
【課題を解決するための手段】本発明は、金属板上に多
層構造を有する絶縁層を介して回路が積層されてなる金
属ベ−ス回路基板であって、前記絶縁層が少なくとも2
種以上の樹脂組成物層からなり、しかも前記樹脂組成物
層の少なくとも1層が−40℃の弾性率が2×1010P
a以下であることを特徴とする金属ベ−ス回路基板であ
る。SUMMARY OF THE INVENTION The present invention is a metal-based circuit board having a circuit laminated on a metal plate via an insulating layer having a multilayer structure, wherein the insulating layer has at least two layers.
And at least one of the resin composition layers has an elastic modulus at −40 ° C. of 2 × 10 10 P
(a) or less, which is a metal-based circuit board.
【0008】又、本発明は、−40℃の弾性率が2×1
010Pa以下である樹脂組成物層と回路との間に、少な
くとも1層以上の他の樹脂組成物層を介在させてなるこ
とを特徴とする前記の金属ベ−ス回路基板であり、好ま
しくは、−40℃の弾性率が2×1010Pa以下である
樹脂組成物層がエポキシ樹脂硬化体からなる前記金属ベ
ース回路基板である。[0008] The present invention also provides an elastic modulus at -40 ° C of 2 × 1.
The metal-based circuit board described above, wherein at least one or more other resin composition layers are interposed between the resin composition layer having a pressure of 0 10 Pa or less and the circuit. Is a metal-based circuit board in which a resin composition layer having an elastic modulus at −40 ° C. of 2 × 10 10 Pa or less is made of a cured epoxy resin.
【0009】加えて、本発明は、樹脂組成物層が0℃以
下のガラス転移温度を有するゴム系高分子を含有するこ
とを特徴とする前記の金属ベ−ス回路基板である。In addition, the present invention is the above-mentioned metal-based circuit board, wherein the resin composition layer contains a rubber-based polymer having a glass transition temperature of 0 ° C. or less.
【0010】[0010]
【発明の実施の形態】以下、図を用いて本発明について
説明する。図1及び図2は、いずれも本発明の金属ベ−
ス回路基板の一例の断面図である。金属板1上に絶縁層
2を有し、前記絶縁層2上に導体回路6が設けられてい
る。本発明においては、絶縁層2が多層構造を有する。
図1においては前記絶縁層2が2つの樹脂組成物層3、
4からなり、図2においては3つの樹脂組成物層3、
4、5から構成されている多層構造を例示しているが、
本発明においてはこれに限定されるものではない。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. 1 and 2 show the metal base of the present invention.
FIG. 2 is a cross-sectional view of an example of a circuit board. An insulating layer is provided on a metal plate, and a conductor circuit is provided on the insulating layer. In the present invention, the insulating layer 2 has a multilayer structure.
In FIG. 1, the insulating layer 2 has two resin composition layers 3,
2, three resin composition layers 3 in FIG.
Although a multilayer structure composed of 4 and 5 is illustrated,
The present invention is not limited to this.
【0011】本発明の樹脂組成物層3、4、5は、金属
ベース回路基板の熱放散性を高く維持するためにいろい
ろな無機充填剤を含有することが好ましく、前記絶縁層
2は、樹脂の種類、無機充填剤の種類、樹脂への添加剤
等の種類、或いはそれらの量的割合を変更した少なくと
も2種類以上の樹脂組成物層で構成されている。例え
ば、図2において、樹脂組成物層3、4、5がいずれも
異なる組成であっても、また樹脂組成物層3と5が同一
組成であり、樹脂組成物層4が前記二つの樹脂組成物層
3と5とは組成が相違していても構わない。The resin composition layers 3, 4, and 5 of the present invention preferably contain various inorganic fillers in order to maintain high heat dissipation of the metal-based circuit board. , Types of inorganic fillers, types of additives to the resin, or at least two or more types of resin composition layers in which the quantitative ratios thereof are changed. For example, in FIG. 2, even if the resin composition layers 3, 4, and 5 have different compositions, the resin composition layers 3 and 5 have the same composition, and the resin composition layer 4 has the two resin compositions. The composition of the material layers 3 and 5 may be different.
【0012】本発明に於いては、複数存在する前記樹脂
組成物層のうちの少なくとも1層が、−40℃の弾性率
が2×1010Pa以下であることが本質的である。この
−40℃の弾性率が2×1010Pa以下の樹脂組成物層
が少なくとも1層以上存在するときに、本発明の目的を
達成することができるからである。In the present invention, it is essential that at least one of the plurality of resin composition layers has an elastic modulus at −40 ° C. of 2 × 10 10 Pa or less. This is because the object of the present invention can be achieved when at least one resin composition layer having an elastic modulus at −40 ° C. of 2 × 10 10 Pa or less exists.
【0013】従来公知の樹脂組成物の弾性率は、例えば
エポキシ樹脂に無機充填剤を高充填した場合、−40℃
のときに約3×1010Pa程度であるが、本発明者ら
は、従来公知の樹脂組成物の無機充填剤を高充填でき、
耐電圧特性が高く、しかも高熱伝導率を有するという特
性を損なうことなく、弾性率を低くするべく実験的に検
討した結果、後述するごとく、−40℃でも2×1010
Pa以下の弾性率を有する樹脂組成物を得ることを見い
だし、この低弾性率の樹脂組成物を用いて応力緩和性に
優れる金属ベース回路基板が得られることができるとい
う知見を得て、本発明に至ったものである。The modulus of elasticity of a conventionally known resin composition is, for example, −40 ° C. when an epoxy resin is highly filled with an inorganic filler.
In this case, the pressure is about 3 × 10 10 Pa, but the present inventors can fill the inorganic filler of the conventionally known resin composition at a high level,
As a result of an experimental study to lower the elastic modulus without deteriorating the characteristics of having a high withstand voltage characteristic and having a high thermal conductivity, as described later, 2 × 10 10 even at −40 ° C.
The present inventors have found that a resin composition having an elastic modulus of Pa or less can be obtained, and the present invention has been found that a metal-based circuit board having excellent stress relaxation can be obtained using the resin composition having a low elastic modulus. It has been reached.
【0014】本発明者らの検討結果によれば、金属ベー
ス回路基板が実用条件下で加熱/冷却履歴を受けて発生
する熱応力は、−40℃の弾性率が2×1010Pa以下
である樹脂組成物層が少なくとも1層以上存在すること
で緩和され、前記樹脂組成物層の絶縁層内での位置は特
定する必要がないことを見いだした。更に、本発明者ら
は、−40℃の弾性率が2×1010Pa以下である樹脂
組成物層と回路との間に、少なくとも1層以上の他の、
即ち−40℃の弾性率が2×1010Pa以下ではない樹
脂組成物層を介在させるときに、導体回路と金属板との
接着力が高温下においても高く維持されることを見いだ
し、本発明に至ったものである。According to the study results of the present inventors, the thermal stress generated when the metal-based circuit board is subjected to a heating / cooling history under practical conditions is such that the elastic modulus at −40 ° C. is 2 × 10 10 Pa or less. It has been found that the presence of at least one resin composition layer is relaxed, and that the position of the resin composition layer in the insulating layer does not need to be specified. Furthermore, the present inventors have found that between the resin composition layer and the circuit is -40 ℃ elastic modulus 2 × 10 10 Pa or less, the other at least one or more layers,
That is, it has been found that when a resin composition layer having an elastic modulus at −40 ° C. of not more than 2 × 10 10 Pa is interposed, the adhesive force between the conductor circuit and the metal plate is kept high even at a high temperature. It has been reached.
【0015】本発明の−40℃の弾性率が2×1010P
a以下である樹脂組成物に用いられる樹脂としては、耐
熱性、電気絶縁性に優れた樹脂であればどのようなもの
であっても良いが、耐熱性や寸法安定性の点から熱硬化
性樹脂が好ましく、更に熱硬化性樹脂の中では、常温ま
たは加熱下で比較的低粘度で取扱い易く、耐熱性や電気
絶縁性や接着性等に優れるエポキシ樹脂が好ましい。
尚、エポキシ樹脂は、エポキシ樹脂を主成分としてフェ
ノ−ル樹脂やポリイミド樹脂等を併用したものでもよ
い。The elastic modulus at -40 ° C. of the present invention is 2 × 10 10 P
As the resin used for the resin composition of a or less, any resin may be used as long as it is excellent in heat resistance and electrical insulation, but from the viewpoint of heat resistance and dimensional stability, thermosetting resin is used. Resins are preferred, and among the thermosetting resins, epoxy resins which are relatively low in viscosity at room temperature or under heating, are easy to handle, and are excellent in heat resistance, electrical insulation, adhesion and the like are preferred.
The epoxy resin may be a resin containing an epoxy resin as a main component and a phenol resin or a polyimide resin in combination.
【0016】弾性率を下げるために、(1)通常のエポ
キシ樹脂にブタジエン系ゴム、アクリルゴム、シリコン
ゴム等のゴムを分散させる、(2)ウレタン変性を施こ
す、(3)ダイマ−酸グリシジルエステル、ポリグリコ
−ル型エポキシ樹脂、ブチルエ−テル変性ビスフェノ−
ルA型エポキシ樹脂等の可撓性エポキシ樹脂を使用す
る、(4)通常のエポキシ樹脂に変性ポリアミン系等の
可撓性硬化剤を使用する、或いは(5)それらを組み合
わせ使用すること等を採用することができる。In order to lower the modulus of elasticity, (1) a rubber such as butadiene rubber, acrylic rubber, silicon rubber or the like is dispersed in a normal epoxy resin, (2) urethane modification is performed, (3) glycidyl dimer acid Ester, polyglycol type epoxy resin, butyl ether-modified bisphenol
(4) using a flexible curing agent such as a modified polyamine type resin with a normal epoxy resin, or (5) using a combination thereof. Can be adopted.
【0017】特に、低温領域で低弾性率の樹脂組成物を
得るには、ガラス転移温度が0℃以下のゴム系高分子を
分散させることが好ましく、回路基板の使用条件が極め
て低い気温を想定する場合は、更に低いガラス転移温度
のものを分散させることが好ましい。ゴム系高分子を分
散させるには、既にゲル化したゴム粒子をエポキシ樹脂
に添加後エポキシ樹脂を硬化させたり、液状ゴムをエポ
キシ樹脂に溶解させておいて、エポキシ樹脂硬化時に相
分離させてゴムを分散させる等の様々な方法を採用する
ことができる。In particular, in order to obtain a resin composition having a low elastic modulus in a low temperature range, it is preferable to disperse a rubber-based polymer having a glass transition temperature of 0 ° C. or less, and assume that the circuit board is used under extremely low temperatures. In this case, it is preferable to disperse those having a lower glass transition temperature. To disperse the rubber-based polymer, add the already gelled rubber particles to the epoxy resin and then cure the epoxy resin, or dissolve the liquid rubber in the epoxy resin and separate the phases when the epoxy resin cures. Various methods such as dispersing can be adopted.
【0018】本発明の−40℃の弾性率が2×1010P
a以下である樹脂組成物に用いられる無機充填剤として
は、電気絶縁性が良好で、しかも高熱伝導率のものが用
いられ、このようなものとして酸化珪素、酸化アルミニ
ウム、窒化アルミニウム、窒化珪素、窒化ホウ素等があ
り、単独系でも混合系でも用いることができる。これら
のうち、酸化珪素、酸化アルミニウムは粒子形状が球状
で高充填可能なものが安価に、容易に入手できることか
ら、窒化硼素は誘電率の低いという理由で好ましい。The elastic modulus at -40 ° C. of the present invention is 2 × 10 10 P
As the inorganic filler used in the resin composition having a or less, a material having good electric insulation and high thermal conductivity is used, and as such, silicon oxide, aluminum oxide, aluminum nitride, silicon nitride, There is boron nitride and the like, and a single system or a mixed system can be used. Among them, silicon oxide and aluminum oxide, which have a spherical particle shape and can be highly filled, can be easily obtained at low cost, and therefore, boron nitride is preferable because of its low dielectric constant.
【0019】又、前記無機充填剤の添加量は樹脂組成物
中50〜80体積%が好ましい。50%未満では放熱性
の効果が低下し実用上用途が制限されることがあるし、
80%を超えると樹脂中への分散が難しくなるし、−4
0℃で2×1010Pa以下の弾性率を有する樹脂組成物
が得にくくなるし、また接着性の低下やボイド残存によ
る耐電圧の低下をきたすためである。The amount of the inorganic filler to be added is preferably 50 to 80% by volume in the resin composition. If it is less than 50%, the effect of heat radiation may be reduced and the application may be practically limited,
If it exceeds 80%, dispersion in the resin becomes difficult, and -4
This is because it becomes difficult to obtain a resin composition having a modulus of elasticity of 2 × 10 10 Pa or less at 0 ° C., and it also causes a decrease in adhesion and a decrease in withstand voltage due to remaining voids.
【0020】本発明において、−40℃の弾性率が2×
1010Pa以下である樹脂組成物層の厚みは10〜10
0μm程度あれば良く、ことに20〜80μmとすると
きは金属ベース回路基板を生産性高く製造できることか
ら好ましい。In the present invention, the elastic modulus at −40 ° C. is 2 ×
The thickness of the resin composition layer of 10 10 Pa or less is 10 to 10
A thickness of about 0 μm is sufficient, and a thickness of 20 to 80 μm is preferable because a metal-based circuit board can be manufactured with high productivity.
【0021】−40℃の弾性率が2×1010Pa以下で
ある樹脂組成物以外の樹脂組成物、即ち−40℃の弾性
率が2×1010Paを越える樹脂組成物に用いる樹脂の
種類に関しては、耐熱性、電気絶縁性に優れた樹脂であ
ればどのようなものでも構わないが、樹脂組成物層同士
が十分に接着するように、前記−40℃の曲げ弾性率が
2×1010Pa以下である樹脂組成物に用いた樹脂と同
系統であることが好ましい。Types of resins used for resin compositions other than the resin composition having an elastic modulus at -40 ° C. of 2 × 10 10 Pa or less, ie, a resin composition having an elastic modulus at −40 ° C. exceeding 2 × 10 10 Pa As for the resin, any resin may be used as long as it is excellent in heat resistance and electrical insulation. However, the bending elastic modulus at −40 ° C. is 2 × 10 so that the resin composition layers are sufficiently bonded to each other. It is preferably the same type as the resin used for the resin composition having a pressure of 10 Pa or less.
【0022】また、−40℃の弾性率が2×1010Pa
以下である樹脂組成物以外の樹脂組成物に用いる無機充
填剤についても、電気絶縁性が良好で、しかも高熱伝導
率のものであれば良く、例えば酸化珪素、酸化アルミニ
ウム、窒化アルミニウム、窒化珪素、窒化ホウ素等を単
独または複合して用いることができる。なお、隣接し合
う樹脂組成物層が樹脂及び無機充填剤が同一の場合、無
機充填剤の添加量の差異を3%程度付すことで、それぞ
れの樹脂組成物層が、例えば走査型電子顕微鏡を用いて
それらの断面を観察するときに、明瞭に区分できる。The elastic modulus at -40 ° C. is 2 × 10 10 Pa
Inorganic fillers used in resin compositions other than the following resin compositions also have good electrical insulation properties and high thermal conductivity, such as silicon oxide, aluminum oxide, aluminum nitride, silicon nitride, Boron nitride or the like can be used alone or in combination. When the adjacent resin composition layers have the same resin and inorganic filler, the difference in the amount of the inorganic filler added is about 3%, so that each of the resin composition layers is, for example, a scanning electron microscope. When used to observe their cross sections, they can be clearly distinguished.
【0023】前記−40℃の弾性率が2×1010Pa以
下である樹脂組成物層以外の樹脂組成物層の厚さについ
ても、10〜100μm程度であれば良く、生産性高く
金属ベース回路基板を製造できることから、20〜80
μmが好ましく選択される。The thickness of the resin composition layer other than the resin composition layer having an elastic modulus at −40 ° C. of 2 × 10 10 Pa or less may be about 10 to 100 μm. Since a substrate can be manufactured, 20 to 80
μm is preferably selected.
【0024】本発明において、少なくとも導体回路6に
接する樹脂組成物層を形成する樹脂中に予めエポキシシ
ラン、アミノシラン等のシランカップリング剤を配合す
ることで、導体回路6と絶縁層2の接着性を向上するす
るのが望ましい。In the present invention, the silane coupling agent such as epoxy silane or amino silane is previously blended into the resin forming the resin composition layer in contact with the conductor circuit 6 so that the adhesion between the conductor circuit 6 and the insulating layer 2 can be improved. It is desirable to improve.
【0025】導体回路6としては、銅、アルミニウム、
ニッケル、鉄、錫、銀、チタニウムのいずれか、これら
の金属を2種類以上含む合金、或いは前記金属又は合金
を使用したクラッド箔等を用いることができる。尚、前
記箔の製造方法は電解法でも圧延法で作製したものでも
よく、箔上にはNiメッキ、Ni−Auメッキ、半田メ
ッキなどの金属メッキがほどこされていてもかまわない
が、絶縁層2との接着性の点から導体回路6の絶縁層に
接する側の表面はエッチングやメッキ等により予め粗化
処理されていることが一層好ましい。The conductor circuit 6 includes copper, aluminum,
Any of nickel, iron, tin, silver, and titanium, an alloy containing two or more of these metals, a clad foil using the metal or the alloy, or the like can be used. The foil may be manufactured by an electrolytic method or a rolling method. The foil may be plated with a metal such as Ni plating, Ni-Au plating, or solder plating. It is more preferable that the surface of the conductive circuit 6 on the side in contact with the insulating layer be roughened in advance by etching, plating, or the like, from the viewpoint of adhesion to the insulating layer 2.
【0026】本発明に用いられる金属板1は、アルミニ
ウム、鉄、銅およびそれらのの合金、もしくはこれらの
クラッド材等からなり、その厚みは特に規定するもので
はないが、熱放散性に富みしかも経済的であることか
ら、厚み0.5〜5.0mmのアルミニウムが一般的に
選択される。The metal plate 1 used in the present invention is made of aluminum, iron, copper and alloys thereof, or a clad material thereof, and the thickness thereof is not particularly limited. Aluminum is generally chosen to be 0.5-5.0 mm thick because of its economy.
【0027】尚、本発明の金属ベース回路基板の製造方
法に関しては、無機充填剤を含有する樹脂に適宜硬化剤
等の添加剤を添加した絶縁材料を複数準備し、金属板及
び/又は導体箔上に多層塗布しながら、必要に応じて加
熱処理等を施して、硬化させ、その後導体箔より回路形
成する方法、或いは予め絶縁材料からなるシ−トを作製
しておき、前記シートを介して金属板や導体箔を張り合
わせ回路形成する方法、或いは前記方法に於いて導体箔
に変えて予め回路形成されている導体回路を直接に用い
る方法等の従来公知の方法で得ることができる。In the method of manufacturing a metal-based circuit board according to the present invention, a plurality of insulating materials are prepared by adding an additive such as a curing agent to a resin containing an inorganic filler, and a metal plate and / or a conductive foil are prepared. A method of forming a circuit from a conductive foil, or a sheet made of an insulating material in advance, or a sheet made of an insulating material is prepared in advance by applying a heat treatment or the like as needed while applying a multilayer coating thereon, and then through the sheet. It can be obtained by a conventionally known method such as a method of forming a circuit by bonding a metal plate or a conductor foil, or a method of directly using a conductor circuit formed in advance by a circuit instead of the conductor foil in the above method.
【0028】以下、実施例に基づき、本発明を更に詳細
に説明する。Hereinafter, the present invention will be described in more detail with reference to Examples.
【0029】[0029]
〔実施例1〕厚さ2.0mmのアルミニウム板に、まず
樹脂組成物A(表1に示す)により、硬化後の厚さが5
0μmになるように1層目を形成し、150℃で15分
加熱した。その上に、樹脂組成物B(表1に示す)によ
り、硬化後の厚さが50μmの2層目を形成し、150
℃で10分加熱した。更に、その上に厚さが35μmの
銅箔をプレス積層した後、150℃で5時間の条件で樹
脂組成物を硬化させて金属ベ−ス基板を作製し、更に、
銅箔をエッチングしてパッド部を有する所望の回路を形
成して、金属ベース回路基板とした。また、前記樹脂組
成物を用いて150℃で5時間硬化させて、厚さ約1m
m幅約2mm長さ約50mmの試験片を別途作製し、弾
性率の測定に供した。Example 1 An aluminum plate having a thickness of 2.0 mm was first cured with a resin composition A (shown in Table 1) to a thickness of 5 mm.
The first layer was formed so as to have a thickness of 0 μm, and heated at 150 ° C. for 15 minutes. A second layer having a thickness of 50 μm after curing was formed thereon with the resin composition B (shown in Table 1).
Heated at 0 ° C for 10 minutes. Further, after a copper foil having a thickness of 35 μm was press-laminated thereon, the resin composition was cured at 150 ° C. for 5 hours to produce a metal-based substrate.
A desired circuit having a pad portion was formed by etching the copper foil to obtain a metal-based circuit board. The resin composition was cured at 150 ° C. for 5 hours to have a thickness of about 1 m.
A test piece having a m width of about 2 mm and a length of about 50 mm was separately prepared and used for measurement of elastic modulus.
【0030】上記の樹脂硬化体については、動的粘弾性
測定器(東洋ボ−ルドウィン社製;RHEOVIBRO
N DDV−III−EP型)を用い、周波数11H
z、昇温速度2℃/分の条件下、−100℃〜+150
℃の温度範囲で弾性率を測定した。表1に−40℃での
弾性率測定結果を示した。又、金属ベ−ス基板について
の20℃及び125℃雰囲気下での銅箔ピ−ル強度測定
結果と、金属ベース回路基板についてのヒ−トサイクル
試験と熱抵抗とを次に示す条件で測定し、その測定結果
を表2に示した。For the above-mentioned cured resin, a dynamic viscoelasticity meter (manufactured by Toyo Baldwin Co., Ltd .; RHEOVIBRO)
There use the N DDV-III-EP type), frequency 11H
z, -100 ° C to +150 under the condition of a heating rate of 2 ° C / min.
The elastic modulus was measured in the temperature range of ° C. Table 1 shows the measurement results of the elastic modulus at -40 ° C. In addition, the results of copper foil peel strength measurement of a metal base substrate at 20 ° C. and 125 ° C., a heat cycle test of a metal base circuit board, and a thermal resistance were measured under the following conditions. Table 2 shows the measurement results.
【0031】<銅箔ピール強度測定方法>テンシロン
(オリエンテック社製;型式UCT−1T)を用い、1
cm幅で90度方向に50mm/分の速度で剥離した時
の強度を求めた。測定は20℃と125℃で測定した。<Measurement method of copper foil peel strength> Tensilon (manufactured by Orientec; model UCT-1T) was used to
The strength when peeled at a speed of 50 mm / min in a 90- degree direction at a width of cm was determined. The measurement was performed at 20 ° C and 125 ° C.
【0032】<ヒ−トサイクル試験方法>パッド間にチ
ップサイズ2.1mm×2.5mm、3.2mm×2.
5mm、5.0mm×2.5mmの3種類のチップ抵抗
を各10個ずつ半田付けし、−40℃7分〜+125℃
7分を1サイクルとして500回のヒートサイクル試験
を行なった後、顕微鏡で半田部分のクラックの有無を観
察した。<Heat cycle test method> Chip size 2.1 mm × 2.5 mm, 3.2 mm × 2.
10 kinds of 5 mm, 5.0 mm × 2.5 mm chip resistors are soldered, each at -40 ° C. for 7 minutes to + 125 ° C.
After performing a heat cycle test 500 times with 7 minutes as one cycle, the presence or absence of cracks in the solder portion was observed with a microscope.
【0033】<熱抵抗の測定方法>パッド上にトランジ
スタ−(TO−220;株式会社東芝製)を半田付け
し、試料とした。金属ベース回路基板のトランジスタ−
を搭載していない面を冷却しながら、トランジスタ−に
通電して、トランジスタ−と冷却部金属板の温度をそれ
ぞれ測定した。トランジスタ−への通電量と、トランジ
スタ−と金属板の温度差より熱抵抗を算出した。<Method of Measuring Thermal Resistance> A transistor (TO-220; manufactured by Toshiba Corporation) was soldered on a pad to obtain a sample. Transistor on metal base circuit board
While cooling the surface on which no was mounted, electricity was supplied to the transistor, and the temperatures of the transistor and the cooling portion metal plate were measured. Thermal resistance was calculated from the amount of electricity to the transistor and the temperature difference between the transistor and the metal plate.
【0034】[0034]
【表1】 [Table 1]
【0035】[0035]
【表2】 [Table 2]
【0036】〔実施例2〕厚さ2.0mmのアルミニウ
ム板に、まず樹脂組成物Bにより、硬化後の厚さが50
μmになるように1層目を形成し、150℃で10分加
熱した。その上に、樹脂組成物Aにより、やはり硬化後
の厚さが50μmの2層目を形成し、150℃で15分
加熱した。更に、その上に、樹脂組成物Bにより、硬化
後の厚さが50μmになるように3層目を形成し、15
0℃で10分加熱した。その後、その上に厚さが35μ
mの銅箔をプレス積層した後、150℃で5時間で樹脂
組成物を硬化させて金属ベ−ス基板を作製した。この金
属ベ−ス基板とこれより得た金属ベース回路基板を用い
て、実施例1と同様にしていろいろな物性を測定した。
それらの結果を表2に示した。Example 2 First, a resin composition B was applied to an aluminum plate having a thickness of 2.0 mm so that the thickness after curing was 50%.
A first layer was formed to a thickness of μm and heated at 150 ° C. for 10 minutes. A second layer having a thickness of 50 μm after curing was also formed from the resin composition A thereon, and heated at 150 ° C. for 15 minutes. Further, a third layer was formed thereon using a resin composition B so that the thickness after curing became 50 μm.
Heat at 0 ° C. for 10 minutes. After that, a thickness of 35μ
After pressing and laminating a copper foil having a thickness of m, the resin composition was cured at 150 ° C. for 5 hours to prepare a metal-based substrate. Various physical properties were measured in the same manner as in Example 1 using the metal base substrate and the metal base circuit board obtained from the metal base substrate.
Table 2 shows the results.
【0037】〔実施例3〜5〕実施例1で1層目の樹脂
組成物Aを樹脂組成物C〜E(表1に示す)に変えた以
外は、実施例1と同じ操作でいろいろな金属ベ−ス基板
と金属ベース回路基板を作製し、実施例1と同じ方法で
物性測定した。これらの結果を表1及び表2に示した。[Examples 3 to 5] Various operations were performed in the same manner as in Example 1 except that the resin composition A in the first layer was changed to the resin compositions C to E (shown in Table 1). A metal base substrate and a metal base circuit board were prepared, and physical properties were measured in the same manner as in Example 1. The results are shown in Tables 1 and 2.
【0038】〔比較例1〕実施例1で1層目にも2層目
にも樹脂組成物Bを用いた以外は、実施例1と同じ操作
で金属ベ−ス基板と金属ベース回路基板を作製し、物性
を測定した。これらの結果を表2に示した。Comparative Example 1 A metal-based substrate and a metal-based circuit board were prepared in the same manner as in Example 1 except that the resin composition B was used for both the first and second layers. It was prepared and its physical properties were measured. Table 2 shows the results.
【0039】〔比較例2〕実施例1で1層目も2層目も
樹脂組成物Aを用いた以外は、実施例1と同じ操作で金
属ベ−ス基板、金属ベース回路基板を作製し、物性を測
定した。これらの結果を表2に示した。Comparative Example 2 A metal-based substrate and a metal-based circuit board were produced in the same manner as in Example 1, except that the resin composition A was used for both the first and second layers. And physical properties were measured. Table 2 shows the results.
【0040】〔比較例3〕実施例1で1層目の樹脂組成
物Aを樹脂組成物F(表1に示す)に変えた以外は、実
施例1と同じ操作で金属ベ−ス基板、金属ベース回路基
板を作製し、物性を測定した。これらの結果を表1及び
表2に示した。Comparative Example 3 The procedure of Example 1 was repeated, except that the resin composition A of the first layer was changed to a resin composition F (shown in Table 1). A metal-based circuit board was manufactured, and physical properties were measured. The results are shown in Tables 1 and 2.
【0041】[0041]
【発明の効果】本発明の金属ベ−ス回路基板は、絶縁層
を複数組成の樹脂組成物層で多層化し、少なくともその
一部に−40℃の弾性率が2×1010Pa以下の樹脂組
成物層を存在させているので、低温でも応力緩和性に非
常に優れ、実使用条件下で受ける激しい温度変化によっ
ても半田部分にクラックを生じることがなく高信頼性の
混成集積回路を提供することができる。According to the metal-based circuit board of the present invention, the insulating layer is multilayered with a plurality of resin composition layers, and at least a part thereof has a resin having an elastic modulus at -40 ° C. of 2 × 10 10 Pa or less. Because of the presence of the composition layer, it provides a highly reliable hybrid integrated circuit with excellent stress relaxation even at low temperatures and no cracks in the solder part even under severe temperature changes under actual use conditions. be able to.
【0042】加えて、本発明の金属ベース回路基板は、
前記樹脂組成物層が無機充填剤を含有していても良く、
従来からの熱放散性が優れる点、耐電圧等の電気絶縁性
に優れる点等が良好のままに維持されていながら、前記
応力緩和性が改善されているので、自動車のエンジンル
−ム等過酷な環境でも使用することができ、産業上非常
に有用である。In addition, the metal-based circuit board of the present invention
The resin composition layer may contain an inorganic filler,
The stress relaxation property is improved while maintaining the excellent points of excellent heat dissipation and electric insulation such as withstand voltage. It can be used in various environments and is industrially very useful.
【図1】 本発明の多層回路基板の一例を示す断面図FIG. 1 is a sectional view showing an example of a multilayer circuit board of the present invention.
【図2】 本発明の多層回路基板の他の一例を示す断面
図FIG. 2 is a sectional view showing another example of the multilayer circuit board of the present invention.
1 金属板 2 絶縁層 3 樹脂組成物層(第一層) 4 樹脂組成物層(第二層) 5 樹脂組成物層(第三層) 6 導体回路 Reference Signs List 1 metal plate 2 insulating layer 3 resin composition layer (first layer) 4 resin composition layer (second layer) 5 resin composition layer (third layer) 6 conductive circuit
───────────────────────────────────────────────────── フロントページの続き (72)発明者 加藤 和男 東京都町田市旭町3丁目5番1号 電気化 学工業株式会社総合研究所内 (72)発明者 米村 直己 群馬県渋川市中村1135番地 電気化学工業 株式会社渋川工場内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kazuo Kato 3-5-1 Asahicho, Machida-shi, Tokyo Denki Kagaku Kogyo Co., Ltd. (72) Inventor Naoki Yonemura 1135 Nakamura Shibukawa-shi, Gunma Electric Chemical Industry Co., Ltd.
Claims (4)
して回路が載置されてなる金属ベ−ス回路基板であっ
て、前記絶縁層が少なくとも2種以上の樹脂組成物層か
らなり、しかも前記樹脂組成物層の少なくとも1層が−
40℃の弾性率が2×1010Pa以下であることを特徴
とする金属ベ−ス回路基板。1. A metal-based circuit board having a circuit mounted on a metal plate via an insulating layer having a multilayer structure, wherein the insulating layer comprises at least two or more resin composition layers. In addition, at least one of the resin composition layers is-
A metal-based circuit board having an elastic modulus at 40 ° C. of 2 × 10 10 Pa or less.
である樹脂組成物層と回路との間に、少なくとも1層以
上の他の樹脂組成物層を介在させてなることを特徴とす
る請求項1記載の金属ベ−ス回路基板。2. A circuit comprising a resin composition layer having an elastic modulus at −40 ° C. of 2 × 10 10 Pa or less and at least one other resin composition layer between the circuit and the circuit. The metal-based circuit board according to claim 1, wherein
である樹脂組成物層がエポキシ樹脂硬化体からなること
を特徴とする請求項1または請求項2記載の金属ベ−ス
回路基板。3. The metal base circuit according to claim 1, wherein the resin composition layer having an elastic modulus at −40 ° C. of 2 × 10 10 Pa or less is made of a cured epoxy resin. substrate.
度を有するゴム系高分子を含有してなることを特徴とす
る請求項1、請求項2または請求項3記載の金属ベ−ス
回路基板。4. The metal base according to claim 1, wherein the resin composition layer contains a rubber-based polymer having a glass transition temperature of 0 ° C. or less. Circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15853197A JPH118450A (en) | 1997-06-16 | 1997-06-16 | Metal base circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15853197A JPH118450A (en) | 1997-06-16 | 1997-06-16 | Metal base circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH118450A true JPH118450A (en) | 1999-01-12 |
Family
ID=15673774
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15853197A Pending JPH118450A (en) | 1997-06-16 | 1997-06-16 | Metal base circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH118450A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002076549A (en) * | 2000-08-24 | 2002-03-15 | Denki Kagaku Kogyo Kk | Metal base circuit board |
US6759098B2 (en) * | 2000-03-20 | 2004-07-06 | Axcelis Technologies, Inc. | Plasma curing of MSQ-based porous low-k film materials |
US7078628B2 (en) | 2002-11-26 | 2006-07-18 | Fujitsu Ten Limited | Substrate for circuit wiring |
US8535809B2 (en) | 2004-04-28 | 2013-09-17 | Nhk Spring Co., Ltd. | Electrical insulating resin composition, and laminate for circuit board |
JP2017022265A (en) * | 2015-07-10 | 2017-01-26 | 日清紡ケミカル株式会社 | Metal circuit board and method for manufacturing the same |
WO2021200895A1 (en) * | 2020-03-31 | 2021-10-07 | 三菱マテリアル株式会社 | Metal base substrate, electronic component mounting substrate |
-
1997
- 1997-06-16 JP JP15853197A patent/JPH118450A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6759098B2 (en) * | 2000-03-20 | 2004-07-06 | Axcelis Technologies, Inc. | Plasma curing of MSQ-based porous low-k film materials |
JP2002076549A (en) * | 2000-08-24 | 2002-03-15 | Denki Kagaku Kogyo Kk | Metal base circuit board |
US7078628B2 (en) | 2002-11-26 | 2006-07-18 | Fujitsu Ten Limited | Substrate for circuit wiring |
US8535809B2 (en) | 2004-04-28 | 2013-09-17 | Nhk Spring Co., Ltd. | Electrical insulating resin composition, and laminate for circuit board |
JP2017022265A (en) * | 2015-07-10 | 2017-01-26 | 日清紡ケミカル株式会社 | Metal circuit board and method for manufacturing the same |
WO2021200895A1 (en) * | 2020-03-31 | 2021-10-07 | 三菱マテリアル株式会社 | Metal base substrate, electronic component mounting substrate |
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