JP2008280436A - Adhesive sheet for fixation for use in electrical parts and method of fixing electrical parts - Google Patents
Adhesive sheet for fixation for use in electrical parts and method of fixing electrical parts Download PDFInfo
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Abstract
Description
本発明は、放熱性、応力緩和性に優れ、しかも絶縁信頼性に優れた電気部品固定用の接着シートに関する。 The present invention relates to an adhesive sheet for fixing an electrical component that is excellent in heat dissipation, stress relaxation, and insulation reliability.
近年、電子部品の小型化が要求され、高密度実装化および高性能化が要求され、更には、半導体素子等の小型化、ハイパワー化により、狭いスペースの中で、半導体素子等から発生した熱を如何に放熱するかといったことが問題となっている。例えば混成集積回路用途に用いられるプリント配線板の製造などにＢステージ状態のプリプレグが使用されている。 In recent years, electronic components have been required to be miniaturized, high density mounting and high performance have been demanded. Furthermore, due to miniaturization and high power of semiconductor devices, etc., they have been generated from semiconductor devices, etc. in a narrow space. The problem is how to dissipate heat. For example, a B-stage prepreg is used in the manufacture of printed wiring boards used for hybrid integrated circuit applications.
プリプレグの室温におけるハンドリング性を改善させるため、樹脂シート用の樹脂組成物に、ブタジエン−アクリロニトリル共重合ゴムを加えるＢステージ状態（半硬化状態）における可とう性（応力緩和性）に優れたプリプレグが公知となっているが、放熱性が乏しいため、発熱する分野では使用できない問題がある（特許文献１参照）。
一方、放熱性を改善させたシートとして、シリコーン樹脂に無機フィラーを充填した構成が提案されているが、Ｂステージ状態ではないため、加熱しても接着性が発現しないため、プリント配線板分野では使用できない問題がある。
本発明は、上記の事情に鑑みてなされたものであり、電気部品を固定するに際しては粘着性を有していて作業性が良く、その後加熱することで硬化させ、高い接着強度で電気部品を固定できる接着シートを提供することを目的としてなされたものである。 The present invention has been made in view of the above circumstances, and has an adhesive property when fixing an electrical component, has good workability, and is then cured by heating, so that the electrical component can be obtained with high adhesive strength. The purpose is to provide an adhesive sheet that can be fixed.
本発明は、無機フィラーを含有するエポキシ樹脂からなり、硬化後に、熱伝導率が１．５Ｗ／ｍＫ以上の硬化体を与えるＢステージ状態の接着シートであり、好ましくは、絶縁破壊耐力が５００Ｖ以上の硬化体を与え、その樹脂が、主鎖がポリエーテル骨格を有し直鎖状であるエポキシ樹脂であることを特徴し、更に無機フィラーが酸化ケイ素、酸化アルミニウム、窒化アルミニウム、窒化硼素からなる群から選ばれる１種以上であり、更に好ましくは、少なくとも一主面に熱可塑性樹脂フィルムからなるライナーを設けてなることを特徴とする。 The present invention is an adhesive sheet in a B stage state, which is made of an epoxy resin containing an inorganic filler and gives a cured product having a thermal conductivity of 1.5 W / mK or more after curing, and preferably has a dielectric breakdown strength of 500 V or more The resin is characterized in that the resin is an epoxy resin whose main chain has a polyether skeleton and is linear, and the inorganic filler is made of silicon oxide, aluminum oxide, aluminum nitride, boron nitride One or more selected from the group, and more preferably, a liner made of a thermoplastic resin film is provided on at least one main surface.
また、本発明は、電気部品と他の電気部品又は放熱部品若しくは筐体とを、前記の接着シートを介して接着し、１００℃以上に加熱することで接着シートを硬化することを特徴とする電気部品の固定方法である。 In addition, the present invention is characterized in that an electrical component and another electrical component or a heat dissipation component or a housing are adhered via the adhesive sheet, and the adhesive sheet is cured by heating to 100 ° C. or higher. This is a method of fixing electrical parts.
本発明の接着シートは、熱伝導性、絶縁性、低弾性率に優れる硬化体を与えるので、半導体素子等の小型化、ハイパワー化に発熱に対応でき、半導体素子、半導体装置、回路用金属板、前記金属板からなる回路、回路基板、混成集積回路分野といった電気部品の固定に使用することができる。また、本発明の電気部品の固定方法によれば、電気部品の固定作業を作業性良く、しかもしっかりと電気部品を固定できる。 The adhesive sheet of the present invention gives a cured product excellent in thermal conductivity, insulation, and low elastic modulus, so it can cope with heat generation in miniaturization and high power of semiconductor elements, etc., and semiconductor elements, semiconductor devices, circuit metals It can be used for fixing electrical components such as a plate, a circuit made of the metal plate, a circuit board, and a hybrid integrated circuit field. In addition, according to the method for fixing an electrical component of the present invention, the electrical component can be fixed firmly with good workability.
以下、本発明について詳細に説明する。 Hereinafter, the present invention will be described in detail.
本発明の接着シートは、無機フィラーを含有するエポキシ樹脂からなり、硬化後に熱伝導率が１．５Ｗ／ｍＫ以上である硬化体を与える、しかもＢステージ状態の接着シートである。また、好ましい実施態様に於いて、絶縁破壊耐力が５００Ｖ以上の硬化体を与える。従い、電気部品を他の電気部品や放熱部品若しくは筐体と接して固定することができ、しかも、当該電気部品と他の電気部品や放熱部品若しくは筐体と高い電気絶縁性を確保しながらも優れた伝熱特性を発揮し、電気部品が高い信頼性をもって稼働することができるようにする効果を発揮する。 The adhesive sheet of the present invention is an adhesive sheet made of an epoxy resin containing an inorganic filler, giving a cured product having a thermal conductivity of 1.5 W / mK or more after curing, and in a B-stage state. In a preferred embodiment, a cured product having a dielectric breakdown strength of 500 V or more is provided. Therefore, electrical components can be fixed in contact with other electrical components, heat dissipation components or housings, and while ensuring high electrical insulation between the electrical components and other electrical components, heat dissipation components or housings Exhibits excellent heat transfer characteristics and exhibits the effect of enabling electrical components to operate with high reliability.
エポキシ樹脂としては、例えばナフタレン型、フェニルメタン型、テトラキスフェノールメタン型、ビフェニル型、およびビスフェノールＡアルキレンオキサイド付加物型のエポキシ樹脂等があげられるが、このうち応力緩和性という理由で、主鎖がポリエーテル骨格を有し直鎖状であるエポキシ樹脂が好ましい。主鎖がポリエーテル骨格を有し主鎖状であるエポキシ樹脂としては、ビスフェノールＡ型、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＡ型の水素添加エポキシ樹脂、ポリプロピレングリコール型エポキシ樹脂、ポリテトラメチレングリコール型エポキシ樹脂、およびポリサルファイド変性エポキシ樹脂等が挙げられ、これらを複数組み合わせて用いることもできる。 Examples of the epoxy resin include naphthalene type, phenylmethane type, tetrakisphenolmethane type, biphenyl type, and bisphenol A alkylene oxide adduct type epoxy resins. A linear epoxy resin having a polyether skeleton is preferred. The epoxy resin whose main chain has a polyether skeleton and has a main chain shape includes bisphenol A type, bisphenol F type epoxy resin, bisphenol A type hydrogenated epoxy resin, polypropylene glycol type epoxy resin, polytetramethylene glycol type epoxy. Examples thereof include resins and polysulfide-modified epoxy resins, and a plurality of these can be used in combination.
エポキシ樹脂には硬化剤を添加することが一般的である。硬化剤としては、芳香族アミン系樹脂、酸無水物系樹脂、フェノール系樹脂及びジシアンアミドからなる群から選ばれる１種類以上好ましくを用いることができる。 It is common to add a curing agent to the epoxy resin. As the curing agent, one or more types selected from the group consisting of aromatic amine resins, acid anhydride resins, phenol resins, and dicyanamide can be preferably used.
硬化剤の添加量については、エポキシ樹脂１００質量部に対して、５〜５０質量部であることが好ましく、１０〜３５質量部であることが一層好ましい。 About the addition amount of a hardening | curing agent, it is preferable that it is 5-50 mass parts with respect to 100 mass parts of epoxy resins, and it is still more preferable that it is 10-35 mass parts.
必要に応じて硬化触媒を使用することもできるが、硬化触媒としては、一般にイミダゾール化合物、有機リン酸化合物、第三級アミン、第四級アンモニウム等が使用され、いずれか１種類以上を選択することができる。添加量については、硬化温度により変化するため特に制限はないが、一般にエポキシ樹脂１００質量部に対して０．０１質量部以上５質量部以下であることが好ましい。０．０１質量部以上ならば十分に硬化するし、５質量部以下ならばＢステージ状態からＣステージ状態にすぐに変化することもない。 Although a curing catalyst can be used as necessary, generally, as the curing catalyst, an imidazole compound, an organic phosphate compound, a tertiary amine, a quaternary ammonium, or the like is used, and any one or more are selected. be able to. Although there is no restriction | limiting in particular about addition amount, since it changes with hardening temperature, Generally it is preferable that they are 0.01 mass part or more and 5 mass parts or less with respect to 100 mass parts of epoxy resins. If it is 0.01 mass part or more, it will fully harden | cure, and if it is 5 mass parts or less, it will not change from a B stage state to a C stage state immediately.
エポキシ樹脂に含有される無機フィラーとしては、電気絶縁性で熱伝導性に優れるものであればどのようなものでも構わない。このような物質として、例えば酸化ケイ素、酸化アルミニウム、窒化アルミニウム、窒化硼素等が挙げられる。このうち窒化アルミウムおよび窒化硼素が高熱伝導性であるという理由で好ましい。更に、ハンドリング性および流動性を向上させるため、前記無機フィラーの粒子形状はアスペクト比が１に近いものが好ましい。球状粗粒子と球状微粒子を混ぜ合わせると破砕粒子や球状粒子を単独で用いた場合よりも高充填が可能となり、更に好ましい。 As the inorganic filler contained in the epoxy resin, any inorganic filler may be used as long as it is electrically insulating and excellent in thermal conductivity. Examples of such a substance include silicon oxide, aluminum oxide, aluminum nitride, boron nitride and the like. Of these, aluminum nitride and boron nitride are preferred because of their high thermal conductivity. Furthermore, in order to improve handling properties and fluidity, the inorganic filler preferably has a particle shape with an aspect ratio close to 1. When spherical coarse particles and spherical fine particles are mixed, higher packing is possible than when crushed particles or spherical particles are used alone, which is more preferable.
無機フィラーのエポキシ樹脂への配合割合は、エポキシ樹脂１００質量部に対して７０〜９５質量部が好ましく、８０〜９０質量部が一層好ましい。 70-95 mass parts is preferable with respect to 100 mass parts of epoxy resins, and, as for the mixture ratio of the inorganic filler to the epoxy resin, 80-90 mass parts is still more preferable.
本発明の接着シートは、前記エポキシ樹脂に無機フィラーと、必要に応じて、硬化剤、硬化促進剤を特定量配合することで得られ、Ｂステージ状態の接着シートである。
ここで、「Ｂステージ状態」とは、接着シートを構成するエポキシ樹脂が室温で乾いた状態を示し、高温に加熱すると再び溶融する状態を言うが、より厳密には、ＤＳＣ（示差走査型熱量計）を用いて、硬化時に発生する熱量から計算した値である硬化度が７０％未満の状態を示す。尚、絶縁層のＣステージ状態とは、エポキシ樹脂の硬化がほぼ終了している状態を示し、高温に加熱しても再度溶融することはない状態を言い、硬化度が７０％以上のである状態をいう。そして本発明の接着シートは、電気部品を固定する際に、位置決めができる程度の粘着性を発揮し、その結果作業性が格段に向上できる。
The adhesive sheet of the present invention is obtained by blending the epoxy resin with an inorganic filler and, if necessary, a specific amount of a curing agent and a curing accelerator, and is an adhesive sheet in a B-stage state.
Here, the “B stage state” means a state in which the epoxy resin constituting the adhesive sheet is dried at room temperature and melts again when heated to a high temperature, but more strictly speaking, DSC (differential scanning calorific value). The degree of cure, which is a value calculated from the amount of heat generated during curing, is less than 70%. In addition, the C-stage state of the insulating layer indicates a state in which the curing of the epoxy resin is almost finished, and refers to a state in which the epoxy resin does not melt again even when heated to a high temperature, and the degree of curing is 70% or more. Say. And the adhesive sheet of this invention exhibits the adhesiveness of the grade which can be positioned when fixing an electrical component, As a result, workability | operativity can be improved significantly.
さらに、本発明の接着シートは、硬化後に、熱伝導率が１．５Ｗ／ｍＫ以上の硬化体を与えるものである。そして、この特性を有しているが故に、電気不分を他の電気部品又は放熱部品若しくは筐体に強固に接着し熱放散路を形成し、半導体素子、半導体装置、回路、回路基板、混成集積回路などの電気部品からの放熱を促進し、当該電気部品の過熱を防止でき、信頼性高く稼働できるようにすることができる。熱伝導率が低くなると、電子部品の放熱が不足するため使用が限られてしまう。 Furthermore, the adhesive sheet of the present invention provides a cured product having a thermal conductivity of 1.5 W / mK or more after curing. And because it has this characteristic, the electric inseparability is firmly bonded to other electrical components or heat radiating components or housings to form heat dissipation paths, semiconductor elements, semiconductor devices, circuits, circuit boards, hybrids Heat dissipation from electrical components such as integrated circuits can be promoted, overheating of the electrical components can be prevented, and operation with high reliability can be achieved. If the thermal conductivity is low, the use of the electronic component is limited because of insufficient heat dissipation of the electronic component.
本発明の接着シートは、その好ましい実施態様において、絶縁破壊耐力が５００Ｖ以上の硬化体を与えることができる。この場合には、特に電気部品が回路基板、混成集積回路、あるいは回路、回路用金属板を含む場合に、高い電気的信頼性をもって電気部品を固定することができ、好ましい。特に、産業用用途では高電圧、高電流が印加されるため、１５００Ｖ以上あることがさらに好ましい。 In the preferable embodiment, the adhesive sheet of the present invention can give a cured product having a dielectric strength of 500 V or more. In this case, particularly when the electrical component includes a circuit board, a hybrid integrated circuit, a circuit, or a metal plate for a circuit, the electrical component can be fixed with high electrical reliability, which is preferable. In particular, since a high voltage and a high current are applied in industrial applications, it is more preferable that the voltage is 1500 V or higher.
接着シートはＢステージ状態であるため、通常は、少なくとも一主面にライナーを設けて取り扱いが容易とする。発明者検討によれば、前記ライナーとして樹脂フィルムを選択することがコストおよび作業性の理由から好ましい。 Since the adhesive sheet is in a B-stage state, it is usually easy to handle by providing a liner on at least one main surface. According to the inventors' study, it is preferable to select a resin film as the liner for reasons of cost and workability.
樹脂フィルムは、Ｂステージ化するときの耐熱性に問題なければ特に制限はなく、ＰＥ、ＰＥＴ、ＰＥＮ、ＯＰＰ等が用いられる。フィルムの厚さは、一般的に０．０２５〜０．５ｍｍものが用いられ、剥離性を考慮してシリコーン樹脂、フッ素樹脂、またはオレフィン樹脂の被覆、サンドブラスト処理、コロナ処理、プラズマ処理等の表面処理を施すことが好ましい。 The resin film is not particularly limited as long as there is no problem in heat resistance when it is made into a B stage, and PE, PET, PEN, OPP, etc. are used. The thickness of the film is generally 0.025 to 0.5 mm, and the surface of silicone resin, fluororesin, or olefin resin coating, sandblasting, corona treatment, plasma treatment, etc. is taken into consideration in consideration of peelability. It is preferable to perform the treatment.
本発明の接着シートは、１００℃以上で加熱することで硬化することが好ましい。一般に硬化温度と高くすることで硬化時間が短くすることができる。１００℃未満の場合は、５時間以上の硬化時間が必要となり生産性が低下する。１５０℃以上で硬化した場合は硬化時間が１時間程度となり生産性が格段によくなり一層好ましい。また、加熱温度の上限については、電気部品やエポキシ樹脂が劣化しないことを考慮して、××℃以下とすることが好ましい。
The adhesive sheet of the present invention is preferably cured by heating at 100 ° C. or higher. Generally, the curing time can be shortened by increasing the curing temperature. When the temperature is lower than 100 ° C., a curing time of 5 hours or more is required, and productivity is lowered. When cured at 150 ° C. or higher, the curing time is about 1 hour, and the productivity is remarkably improved. In addition, the upper limit of the heating temperature is preferably set to xx ° C. or less in consideration of the fact that the electrical components and the epoxy resin do not deteriorate.
接着シートの厚さは、硬化後に、電気部品と他の電気部品又は放熱部品若しくは筐体との電気絶縁性と熱放散性とを確保するために０．０５ｍｍ以上０．５ｍｍ以下にすることが好ましい。０．０５ｍｍ以上であれば電気絶縁性が確保できるし、０．５以下であればシート形成が難しくなることもない。 The thickness of the adhesive sheet may be 0.05 mm or more and 0.5 mm or less after curing in order to ensure electrical insulation and heat dissipation between the electrical component and another electrical component or heat dissipation component or housing. preferable. If it is 0.05 mm or more, electrical insulation can be secured, and if it is 0.5 or less, sheet formation does not become difficult.
（実施例１）
ポリプロピレングリコール型エポキシ樹脂（東都化成社製、「ＰＧ２０８ＧＳ」）とビスフェノールＡ型エポキシ樹脂（ジャパンエポキシレジン社製、「ＥＰ８２８」）を３５：６５の割合（質量比）とを混合し、前記エポキシ樹脂１０質量部に対して、フェノールノボラック系硬化剤（明和化成社製、「Ｈ−１」）を５質量部添加し、更に添加剤としてカップリング剤（信越化学工業社製、「ＫＢＭ４０３」）を１質量部添加し、更に、酸化アルミニウム（アドマテック社製、「ＡＯ８０２」）および窒化アルミニウム（電気化学工業社製）を硬化後の絶縁層中に６０体積％となるように充填（酸化アルミニウムと窒化アルミニウムとの配合（質量）比が６：４）して絶縁物組成物を作製した。さらに硬化触媒として２，３−ジヒドロ−１Ｈ−ピロロ（１，２−ａ）ベンズイミダゾール（四国化成社製、「ＴＢＺ」）を０．５重量部配合した。
Example 1
Polypropylene glycol type epoxy resin (manufactured by Toto Kasei Co., Ltd., “PG208GS”) and bisphenol A type epoxy resin (Japan Epoxy Resin Co., Ltd., “EP828”) are mixed in a ratio (mass ratio) of 35:65, and the epoxy resin is mixed. To 10 parts by mass, 5 parts by mass of a phenol novolac curing agent (Maywa Kasei Co., Ltd., “H-1”) is added, and a coupling agent (Shin-Etsu Chemical Co., Ltd., “KBM403”) is added as an additive. 1 part by mass is added, and aluminum oxide (manufactured by Admatech, “AO802”) and aluminum nitride (manufactured by Denki Kagaku Kogyo) are filled in the insulating layer after curing so as to be 60% by volume (aluminum oxide and nitriding). The composition (mass) ratio with aluminum was 6: 4) to produce an insulator composition. Further, 0.5 part by weight of 2,3-dihydro-1H-pyrrolo (1,2-a) benzimidazole (manufactured by Shikoku Kasei Co., Ltd., “TBZ”) was blended as a curing catalyst.
厚さ０．０７５ｍｍのＰＥＴフィルム上に、前記絶縁層組成物を硬化後の厚さが０．１５ｍｍとなるように塗布し、１３０℃１０分加熱乾燥して、前記絶縁層をＢステージ状態にし、接着シートを得た。 The insulating layer composition is applied onto a PET film having a thickness of 0.075 mm so that the thickness after curing is 0.15 mm and dried by heating at 130 ° C. for 10 minutes to bring the insulating layer into a B-stage state. An adhesive sheet was obtained.
つぎに、あらかじめ脱脂処理して付着部を除去した厚さ１．５ｍｍアルミニウム板上に、前記接着シートを介して厚さ０．０３５ｍｍの銅箔を配置し、３０ｋｇｆ／ｃｍ２の圧力をかけながら１５０℃６０分加熱することにより前記接着シートを熱硬化し、一体化させた。この接合体について、以下に示す方法で、（１）絶縁層の熱伝導率（２）耐電圧（３）接着強度（４）弾性率を測定、評価した。 Next, a copper foil having a thickness of 0.035 mm is disposed on the 1.5 mm-thick aluminum plate that has been degreased in advance to remove the adhering portion, and a pressure of 30 kgf / cm 2 is applied through the adhesive sheet. By heating at 150 ° C. for 60 minutes, the adhesive sheet was thermoset and integrated. With respect to this joined body, (1) thermal conductivity of the insulating layer (2) withstand voltage (3) adhesive strength (4) elastic modulus was measured and evaluated by the method described below.
（１）絶縁層の熱伝導率は、樹脂シートの樹脂を別途直径１０ｍｍ×厚さ２ｍｍの円板状硬化体に加工し、レーザーフラッシュ法により求めた。 (1) The thermal conductivity of the insulating layer was determined by a laser flash method by separately processing the resin of the resin sheet into a disk-shaped cured body having a diameter of 10 mm and a thickness of 2 mm.
（２）耐電圧は、接合体の銅箔部に直径２０ｍｍの円電極をエッチング法により作製し、ＪＩＳ Ｃ ２１１０に規定された段階昇圧法により、アルミ板と銅箔の間の耐電圧を測定した。 (2) Withstand voltage is measured by measuring the withstand voltage between the aluminum plate and the copper foil by a step-up method defined in JIS C 2110 by producing a 20 mm diameter circular electrode on the copper foil part of the joined body. did.
（３）接着強度（ピール強度）は、接合体の銅箔部を１０ｍｍ幅の帯状に加工し、ＪＩＳ Ｃ ６４８１に規定された方法により求めた。 (3) The adhesive strength (peel strength) was determined by a method defined in JIS C 6481 by processing the copper foil portion of the joined body into a 10 mm wide strip.
（４）弾性率は、動的粘弾性測定器（Ｔ＆Ａインスツルメント社製、ＲＳＡ３）を用い、周波数１０Ｈｚ、昇温速度１０℃／分の条件下で測定した。 (4) The elastic modulus was measured using a dynamic viscoelasticity meter (manufactured by T & A Instruments, RSA3) under conditions of a frequency of 10 Hz and a heating rate of 10 ° C./min.
これらの結果を表１に示した。 These results are shown in Table 1.
（実施例２）
ポリプレングリコール型エポキシ樹脂（阪本薬品工業社製、「ＳＲ−ＰＴＭＧ」）とビスフェノールＡ型エポキシ樹脂（ジャパンエポキシレジン社製、「ＥＰ８２８」）とビスフェノールＦ型エポキシ樹脂（ジャパンエポキシレジン社製、「ＥＰ４００４Ｐ」）を３５：３５：３０の割合（質量比）を用いる他は、実施例１と同様に試験した。結果を表１に示した。
(Example 2)
Polypropylene glycol type epoxy resin (Sakamoto Yakuhin Kogyo Co., Ltd., “SR-PTMG”), bisphenol A type epoxy resin (Japan Epoxy Resin Co., “EP828”) and bisphenol F type epoxy resin (Japan Epoxy Resin Co., Ltd., “ EP4004P ") was tested in the same manner as in Example 1 except that a ratio (mass ratio) of 35:35:30 was used. The results are shown in Table 1.
（実施例３）
ポリプレングリコール型エポキシ樹脂（阪本薬品工業社製、「ＳＲ−ＰＴＭＧ」）とビスフェノールＡ型エポキシ樹脂（ジャパンエポキシレジン社製、「ＥＰ８２８」）とビスフェノールＦ型エポキシ樹脂（ジャパンエポキシレジン社製、「ＥＰ４００４Ｐ」）を３５：３５：３０の割合（質量比）を用い、樹脂の組成の硬化触媒としてトリフェニルフォスフィン（北興化学社製、「ＴＰＰ」）を０．４質量部用いる他は、実施例１と同様に試験した。結果を表１に示した。
(Example 3)
Polypropylene glycol type epoxy resin (Sakamoto Yakuhin Kogyo Co., Ltd., “SR-PTMG”), bisphenol A type epoxy resin (Japan Epoxy Resin Co., “EP828”) and bisphenol F type epoxy resin (Japan Epoxy Resin Co., Ltd., “ EP4004P ") was used at a ratio (mass ratio) of 35:35:30, and 0.4 parts by mass of triphenylphosphine (manufactured by Hokuko Chemical Co.," TPP ") was used as a curing catalyst for the resin composition. Tested as in Example 1. The results are shown in Table 1.
（実施例４）
ポリプレングリコール型エポキシ樹脂（阪本薬品工業社製、「ＳＲ−ＰＴＭＧ」）とビスフェノールＡ型エポキシ樹脂（ジャパンエポキシレジン社製、「ＥＰ８２８」）とビスフェノールＦ型エポキシ樹脂（ジャパンエポキシレジン社製、「ＥＰ４００４Ｐ」）を３５：３５：３０の割合（質量比）を用い、樹脂の組成の硬化剤としてビスフェノールＡ型ノボラック樹脂（大日本インキ社製「ＶＨ４２４０」）を用いる他は、実施例１と同様に試験した。結果を表１に示した。
Example 4
Polypropylene glycol type epoxy resin (Sakamoto Yakuhin Kogyo Co., Ltd., “SR-PTMG”), bisphenol A type epoxy resin (Japan Epoxy Resin Co., “EP828”) and bisphenol F type epoxy resin (Japan Epoxy Resin Co., Ltd., “ EP4004P ") at a ratio of 35:35:30 (mass ratio) and bisphenol A type novolak resin (" VH4240 "manufactured by Dainippon Ink Co., Ltd.) is used as the curing agent for the resin composition. Tested. The results are shown in Table 1.
（実施例５）
ポリプレングリコール型エポキシ樹脂（阪本薬品工業社製、「ＳＲ−ＰＴＭＧ」）とビスフェノールＡ型エポキシ樹脂（ジャパンエポキシレジン社製、「ＥＰ８２８」）とビスフェノールＦ型エポキシ樹脂（ジャパンエポキシレジン社製、「ＥＰ４００４Ｐ」）を３５：３５：３０の割合（質量比）を用い、樹脂の組成の無機フィラーをアルミナ（昭和電工社製、「ＡＬ−１７３」）を用い総量を５０体積％になるように配合した以外は、実施例１同様に試験した。結果を表１に示した。
(Example 5)
Polypropylene glycol type epoxy resin (Sakamoto Yakuhin Kogyo Co., Ltd., “SR-PTMG”), bisphenol A type epoxy resin (Japan Epoxy Resin Co., “EP828”) and bisphenol F type epoxy resin (Japan Epoxy Resin Co., Ltd., “ EP4004P ") at a ratio of 35:35:30 (mass ratio) and inorganic filler of resin composition using alumina (" AL-173 "manufactured by Showa Denko KK) so that the total amount is 50% by volume. The test was conducted in the same manner as in Example 1 except that. The results are shown in Table 1.
（比較例１）
無機フィラーである酸化アルミニウムと窒化アルミニウムを除いたこと以外は、実施例１と同様に試験した。結果を表１に示した。
無機フィラーがないため放熱性が大幅に低下した。
(Comparative Example 1)
The test was performed in the same manner as in Example 1 except that the inorganic fillers aluminum oxide and aluminum nitride were removed. The results are shown in Table 1.
Since there was no inorganic filler, heat dissipation was greatly reduced.
本発明の接着シートは、特定組成のエポキシ樹脂からなるので、電位部品を他の電気部品や放熱部品若しくは筐体に容易に接着し、固定できるとともに、１００℃以上に加熱することで前記エポキシ樹脂が硬化して、放熱性、応力緩和性に優れ、しかも絶縁信頼性に優れた硬化体を提供できるので、電気部品の固定用としていろいろな用途に適用できるので、産業上非常に有用である。 Since the adhesive sheet of the present invention is made of an epoxy resin having a specific composition, the potential component can be easily bonded and fixed to other electrical components, heat dissipation components, or a casing, and the epoxy resin can be heated by heating to 100 ° C. or higher. Can be cured, and can provide a cured body having excellent heat dissipation and stress relaxation properties and excellent insulation reliability, and can be applied to various uses for fixing electrical components, and thus is very useful in industry.
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Cited By (13)
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| JP2010132840A (en) * | 2008-12-08 | 2010-06-17 | Asahi Kasei E-Materials Corp | Epoxy resin composition for adhesive sheet |
| WO2011048885A1 (en) | 2009-10-22 | 2011-04-28 | 電気化学工業株式会社 | Insulating sheet, circuit board, and process for production of insulating sheet |
| US20110261242A1 (en) * | 2010-01-29 | 2011-10-27 | Nitto Denko Corporation | Imaging device module |
| WO2012026012A1 (en) | 2010-08-26 | 2012-03-01 | 電気化学工業株式会社 | Resin composition, molded object and substrate material both obtained from the resin composition, and circuit board including the substrate material |
| JP2012114314A (en) * | 2010-11-26 | 2012-06-14 | Denki Kagaku Kogyo Kk | Heat dissipation substrate and electronic component |
| WO2012132926A1 (en) * | 2011-03-30 | 2012-10-04 | 日東電工株式会社 | Method for manufacturing thermally conductive sheet, and thermally conductive sheet |
| JP2013211556A (en) * | 2013-04-17 | 2013-10-10 | Denki Kagaku Kogyo Kk | Electronic component |
| US8592844B2 (en) | 2010-01-29 | 2013-11-26 | Nitto Denko Corporation | Light-emitting diode device |
| US8749978B2 (en) | 2010-01-29 | 2014-06-10 | Nitto Denko Corporation | Power module |
| KR20180048612A (en) | 2015-08-26 | 2018-05-10 | 덴카 주식회사 | Thermoconductive resin composition |
| WO2019030914A1 (en) | 2017-08-10 | 2019-02-14 | 株式会社寺岡製作所 | Adhesive sheet |
| CN112409757A (en) * | 2020-10-21 | 2021-02-26 | 江苏科化新材料科技有限公司 | High-thermal-conductivity epoxy plastic packaging material for high-power module packaging and preparation method thereof |
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| JP2010132840A (en) * | 2008-12-08 | 2010-06-17 | Asahi Kasei E-Materials Corp | Epoxy resin composition for adhesive sheet |
| WO2011048885A1 (en) | 2009-10-22 | 2011-04-28 | 電気化学工業株式会社 | Insulating sheet, circuit board, and process for production of insulating sheet |
| US9497857B2 (en) | 2009-10-22 | 2016-11-15 | Denka Company Limited | Insulating sheet, circuit board, and process for production of insulating sheet |
| US8749978B2 (en) | 2010-01-29 | 2014-06-10 | Nitto Denko Corporation | Power module |
| US20110261242A1 (en) * | 2010-01-29 | 2011-10-27 | Nitto Denko Corporation | Imaging device module |
| US8547465B2 (en) * | 2010-01-29 | 2013-10-01 | Nitto Denko Corporation | Imaging device module |
| US8592844B2 (en) | 2010-01-29 | 2013-11-26 | Nitto Denko Corporation | Light-emitting diode device |
| WO2012026012A1 (en) | 2010-08-26 | 2012-03-01 | 電気化学工業株式会社 | Resin composition, molded object and substrate material both obtained from the resin composition, and circuit board including the substrate material |
| US8921458B2 (en) | 2010-08-26 | 2014-12-30 | Denki Kagaku Kogyo Kabushiki Kaisha | Resin composition, molded object and substrate material both obtained from the resin composition, and circuit board including the substrate material |
| JP2012114314A (en) * | 2010-11-26 | 2012-06-14 | Denki Kagaku Kogyo Kk | Heat dissipation substrate and electronic component |
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| CN103430645A (en) * | 2011-03-30 | 2013-12-04 | 日东电工株式会社 | Method for manufacturing thermally conductive sheet, and thermally conductive sheet |
| JP2013211556A (en) * | 2013-04-17 | 2013-10-10 | Denki Kagaku Kogyo Kk | Electronic component |
| KR20180048612A (en) | 2015-08-26 | 2018-05-10 | 덴카 주식회사 | Thermoconductive resin composition |
| WO2019030914A1 (en) | 2017-08-10 | 2019-02-14 | 株式会社寺岡製作所 | Adhesive sheet |
| KR20200036872A (en) | 2017-08-10 | 2020-04-07 | 가부시키가이샤 데라오카 세이사쿠쇼 | Adhesive sheet |
| KR20230054477A (en) | 2017-08-10 | 2023-04-24 | 가부시키가이샤 데라오카 세이사쿠쇼 | Adhesive sheet |
| US11781042B2 (en) | 2017-08-10 | 2023-10-10 | Teraoka Seisakusho Co., Ltd. | Adhesive sheet |
| CN112409757A (en) * | 2020-10-21 | 2021-02-26 | 江苏科化新材料科技有限公司 | High-thermal-conductivity epoxy plastic packaging material for high-power module packaging and preparation method thereof |
| CN115141460A (en) * | 2021-03-30 | 2022-10-04 | 太阳油墨（苏州）有限公司 | Thermosetting resin composition, cured product, and electronic component |
| WO2022205582A1 (en) * | 2021-03-30 | 2022-10-06 | 太阳油墨（苏州）有限公司 | Thermosetting resin composition, cured product, and electronic component |
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