JPH1183957A - Inspection device and inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To detect the opening failure of the power source and ground terminal of an IC on a mounted substrate. SOLUTION: This inspection device is provided with an environment test device 1 capable of changing a temperature inside an environment and the inspection device 2 for sending out boundary scanning inspection signals to the mounted substrate and judging a failure part from an inspected result obtained as a result. An inspection is performed by changing the temperature inside the environment to a low temperature, a normal temperature and a high temperature by the environment test device 1 and repeatedly sending out the boundary scanning inspection signals for simultaneously changing all the output and bidirectional terminal of a mounted integrated circuit from a low potential to a high potential or from the high potential to the low potential from the inspection device 2 to the mounted substrate 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring inspection on a mounting substrate and an inspection method.

[0002]

2. Description of the Related Art The necessity of interconnect inspection at a mounting board and system level is a very high priority in the industry, and in recent years, high integration of integrated circuit devices (hereinafter referred to as IC) and printed circuit boards have been required. The current circuit inspection method using a bed-of-nail (inspection probe) at the substrate level has largely lost its usefulness due to the high-density mounting of semiconductor devices.

Further, ICs have come to have an extremely large number of terminals due to the high integration of ICs. Currently, the power terminal,
It is common to have a plurality of ground terminals.

When a short-circuit fault occurs when the power supply terminal and the ground terminal of the IC are mounted on a board, a test method using an inspection probe, or simply measuring the resistance values of the power supply and the ground terminal are required. And can be easily detected. However, if the power supply or the ground terminal is not soldered to the board correctly (open fault), the inspection method using the inspection probe, the function inspection to actually operate the mounting board, or the optical or image processing It has been very difficult to detect a failure by an inspection method such as a soldering inspection.

[0005] Inspections and functional inspections using an inspection probe are performed by electrically operating an IC.
If C has a plurality of power and ground terminals, the IC will operate normally even if some of them are open. (Conversely, the IC has a plurality of power and ground terminals.) Is also for that). Inspection by optical and image processing is not limited to a power supply and a ground terminal, and it is difficult to detect a subtle open defect.

[0006]

As described above, even in the case where an open failure has occurred in the power supply and ground terminals of the IC, the mounting board and the electronic device often operate normally. This is a factor that makes inspection difficult.If the environment in which the equipment is used is poor, for example, if the equipment is used in a hot or humid place, the equipment will not operate properly due to open failure of the power supply and ground terminals. It can be unstable and is an important issue in equipment quality.

For this reason, an environmental test such as operating the device under a bad condition for a long period of time is currently performed. However, this test requires time, and it is impossible to inspect all the mounting boards and devices. Was. Also, bringing an inspection device using an inspection probe into the environmental test device is not realistic because the environment itself in the environmental test device affects the performance of the inspection device itself.

In view of the above problems, an object of the present invention is to easily and quickly detect an open failure of a power supply and a ground terminal of an IC on a mounting board.

[0009]

As means for solving the above problems, an inspection apparatus according to the present invention includes an environmental test apparatus capable of changing the temperature in an environment, and a power supply voltage supplied to a mounting board. A power supply device that can cause the mounting substrate to vibrate or impact, and an inspection device that sends a boundary scan inspection signal to the mounting substrate and determines a faulty part based on the inspection result obtained as a result. And
The environmental test equipment changes the temperature in the environment to low, normal, and high temperatures, and the power supply test equipment changes the power supply voltage supplied to the mounting board to low, normal, and high potentials. , The output of the integrated circuit and the bidirectional terminal simultaneously transmit a boundary scan inspection signal that changes from a low potential to a high potential or from a high potential to a low potential repeatedly, causing unstable operation of the integrated circuit. by doing,
An open fault of a power supply terminal and a ground terminal of an integrated circuit mounted on a printed circuit board can be easily and quickly detected.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention provides an environmental test apparatus capable of changing the temperature in an environment, and a boundary scan inspection signal sent to a mounting board to obtain an inspection result. This is an inspection device that has an inspection device to determine the location of a failure from the environment.The environmental test device changes the temperature in the environment to low, normal, and high temperatures, and the integrated device mounted on the mounting board by the inspection device. By repeatedly sending a boundary scan inspection signal in which all outputs and bidirectional terminals of the circuit change from a low potential to a high potential or from a high potential to a low potential at the same time to make the operation of the integrated circuit unstable, Open circuit failure of the power supply terminal and the ground terminal of the integrated circuit mounted on the integrated circuit can be easily and quickly detected.

According to a second aspect of the present invention, there is provided a power supply device capable of changing a power supply voltage to be supplied to a mounting substrate, and transmitting a boundary scan inspection signal to the mounting substrate, and detecting a failure from the inspection result obtained as a result. An inspection device having an inspection device for determining a location, a power supply voltage supplied to the mounting substrate by a power supply testing device is changed to a low potential, a normal potential, a high potential, and the inspection device with respect to the mounting substrate, All outputs and bidirectional terminals of the mounted integrated circuit repeatedly send a boundary scan inspection signal such that the potential changes from a low potential to a high potential or from a high potential to a low potential, thereby making the operation of the integrated circuit unstable. Thus, an open fault of the power supply terminal and the ground terminal of the integrated circuit mounted on the printed circuit board can be easily and quickly detected.

According to a third aspect of the present invention, there is provided a vibration device for applying vibration or impact to a mounting board, and a boundary scan inspection signal is transmitted to the mounting board to determine a faulty part from the inspection result obtained as a result. An inspection device having an inspection device for applying vibration or impact to the mounting board by a vibration device,
The inspection apparatus repeatedly sends a boundary scan inspection signal to the mounting board such that all outputs and bidirectional terminals of the mounted integrated circuit change from low potential to high potential or from high potential to low potential at the same time. By destabilizing the operation of the integrated circuit, an open failure of the power supply terminal and the ground terminal of the integrated circuit mounted on the printed circuit board can be easily and quickly detected.

According to a fourth aspect of the present invention, there is provided an environmental test apparatus capable of changing the temperature in an environment, a power supply apparatus capable of changing a power supply voltage supplied to a mounting board, and This is an inspection device that has an inspection device that sends a boundary scan inspection signal and determines the location of a failure based on the inspection result obtained.The environmental test device changes the temperature in the environment to low, normal, and high temperatures, and supplies power. The tester changes the power supply voltage supplied to the mounting board to a low potential, normal potential, or high potential, and all the outputs and bidirectional terminals of the integrated circuit mounted on the From the high potential, or from the high potential to the low potential, repeatedly sending a boundary scan inspection signal to destabilize the operation of the integrated circuit, thereby the power supply terminal of the integrated circuit mounted on the printed circuit board. And it has an effect of the open-circuit failure of the ground terminal can be detected easily and fast.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an inspection apparatus to which an embodiment of the present invention is applied. In FIG. 1, 1 is an environmental test device,
Reference numeral 2 denotes an inspection device for performing a boundary scanning inspection, and reference numeral 3 denotes a mounting board. The environmental test apparatus 1 can change the operating temperature range of the IC on the mounting board 3 from the lowest temperature to the highest temperature. The boundary scanning inspection device 2 sends a boundary scanning inspection signal to the mounting board 3 and can determine a faulty part from the inspection result obtained as a result.

FIG. 2 shows a procedure of a method of inspecting the mounting board 3. First, at the time of inspection of the mounting board 3, the environmental test apparatus 1 is set to normal temperature (25 ° C.). In this state, the mounting board 3 is placed in the environmental test apparatus 1 and the boundary scan inspection apparatus 2
The boundary scan inspection for detecting the open / short circuit failure of the signal terminal of the IC on the mounting board 3 is executed by using the above. This allows the signal terminals of the IC mounted on the mounting substrate 3 to be opened,
Short-circuit faults can first be detected. Repair is performed on the faulty part detected at this time, and the boundary scanning inspection is repeatedly performed until no faults occur in the signal terminals of all the ICs.

Next, the environmental test apparatus 1 is mounted on an IC
Is set to the highest temperature in the operating temperature range. After the high temperature state for a certain time, the environmental test apparatus 1 is mounted on the IC
Set the lowest temperature of the operating temperature range. After being kept in a low-temperature state for a certain period of time, the environmental test apparatus 1 is mounted on an IC
Is set to the highest temperature in the operating temperature range. In a high temperature state, the boundary scanning inspection is performed using the boundary scanning inspection device 2 to detect an open / short circuit failure of the signal terminal of the IC on the mounting substrate 3. By changing the environment test apparatus 1 between high temperature and low temperature, an incomplete soldering part may change to a failed part, which further causes an open / short-circuit failure of an IC signal terminal on the mounting board 3. Can be detected. Repair is performed on the faulty part detected at this time, and the boundary scanning inspection is repeatedly performed until no faults occur in the signal terminals of all the ICs.

Next, from the boundary scanning inspection device 2, the mounting substrate 3
All outputs and bidirectional terminals of the above IC repeatedly transmit a boundary scan inspection pattern that changes from a low potential to a high potential and from a high potential to a low potential at the same time. If many outputs and bidirectional terminals of the IC on the mounting board 3 change simultaneously, the IC
Momentary fluctuations in the reference potential are likely to occur due to the induction component of the internal power supply wiring. Assuming that the inductive component of the power supply wiring inside the IC is L, the current is i, and the fluctuating voltage is V, V = Ldi / dt. That is, the larger the current change, the larger the fluctuating voltage. When many outputs and bidirectional terminals of the IC change at the same time, the current flowing increases, and thus the fluctuation of the reference potential also increases. This greatly increases the possibility that the operation of the IC becomes unstable. In addition, an inspection is performed by the environmental test apparatus 1 at the highest temperature in the operating temperature range of the IC, and if a failure occurs in the power supply or the ground terminal, the possibility that the operation of the IC becomes unstable further increases. If an abnormality is detected in this boundary scan inspection, the operation of the IC has become unstable, and it is apparently reported that one of the signal terminals of the IC has failed. Since all the failures of the signal terminals have been detected by the boundary scan inspection for detecting the short-circuit failure, it is understood that this abnormality is caused by the failure of the power supply or the ground terminal.

If necessary, the temperature of the environmental test apparatus 1 is further changed, and the boundary scanning inspection is repeated, whereby a more accurate inspection can be performed. Since there are only four wirings for inspection from the boundary scanning inspection device 2 to the mounting board 3, it is not necessary to install the boundary scanning inspection device 2 inside the environmental test device 1. Therefore, the inspection can be performed without depending on the inspection accuracy of the environment of the environmental test apparatus 1. Further, since the boundary scanning inspection is very fast, the entire inspection time can be reduced. In addition, it is possible to easily create an inspection pattern in which all outputs and bidirectional terminals of the IC are simultaneously changed in order to make the operation of the IC unstable.

FIG. 3 shows an inspection apparatus to which an embodiment of the present invention is applied. In FIG. 3, reference numeral 4 denotes a power supply device, 2 denotes an inspection device for executing a boundary scanning inspection, and 3 denotes a mounting board. The power supply device 4 can change between the lowest voltage and the highest voltage in the operating voltage range of the IC on the mounting board 3. The boundary scanning inspection device 2 sends a boundary scanning inspection signal to the mounting board 3 and can determine a faulty part from the inspection result obtained as a result.

At the time of inspection of the mounting board 3, the power supply 4 is set to the recommended operating voltage of the mounting board 3. In this state, the mounting substrate 3 is mounted on the mounting substrate 3 using the boundary scanning inspection device 2.
A boundary scan inspection for detecting an open / short circuit failure of the signal terminal of the above IC is executed. As a result, an open or short circuit failure of the signal terminal of the IC mounted on the mounting board 3 can be detected first. Repair is performed on the faulty part detected at this time, and the boundary scanning inspection is repeatedly performed until no faults occur in the signal terminals of all the ICs.

Next, the power supply 4 is set to the lowest voltage in the operating voltage range of the IC on the mounting board 3. In this state, the boundary scanning inspection device 2 repeatedly sends out a boundary scanning inspection pattern in which all outputs and bidirectional terminals of the IC on the mounting substrate 3 simultaneously change from a low potential to a high potential and from a high potential to a low potential. . As described above, when all the outputs and the bidirectional terminals of the IC on the mounting board 3 change simultaneously, the reference potential fluctuates, and the operation of the IC becomes more likely to become unstable. In addition, if the operating voltage of the IC is lower than the recommended operating voltage, the possibility of unstable operation is further increased. In this state, if there is a failure in the power supply or the ground terminal, I
The possibility that the operation of C becomes unstable becomes extremely large. If an abnormality is detected in this boundary scan inspection, the operation of the IC has become unstable, and it is apparently reported that one of the signal terminals of the IC has failed. Since all the failures of the signal terminals have been detected by the boundary scan inspection for detecting the short-circuit failure, it is understood that this abnormality is caused by the failure of the power supply or the ground terminal.

By changing the voltage of the power supply 4 as necessary and repeating the boundary scanning inspection, a more accurate inspection can be performed. Further, since the boundary scanning inspection is very fast, the entire inspection time can be reduced. In addition, it is possible to easily create an inspection pattern in which all outputs and bidirectional terminals of the IC are simultaneously changed in order to make the operation of the IC unstable.

FIG. 4 shows an inspection apparatus to which one embodiment of the present invention is applied. In FIG. 4, 5 is a vibration device, 2 is an inspection device for performing a boundary scanning inspection, and 3 is a mounting board. The vibration device 5 can apply vibration or impact to the mounting substrate 3 or apply a force for twisting or bending the mounting substrate 3. The boundary scanning inspection device 2 sends a boundary scanning inspection signal to the mounting board 3 and can determine a faulty part from the inspection result obtained as a result.

At the time of inspection of the mounting board 3, the IC on the mounting board 3 is
Boundary scan inspection for detecting the open / short circuit failure of the signal terminals. As a result, an open or short circuit failure of the signal terminal of the IC mounted on the mounting board 3 can be detected first.
At this point, we will repair any faults detected,
The boundary scan inspection is repeatedly performed until no failure occurs in the signal terminals of all ICs.

Next, a physical impact such as a vibration, an impact, a twist, a bend, or the like is applied to the mounting substrate 3 by using the vibration device 5. Thereafter, the boundary scanning inspection is performed using the boundary scanning inspection device 2 to detect an open / short circuit failure of the signal terminal of the IC on the mounting substrate 3.

As a result, the incompletely soldered portion may change to a faulty portion, and this makes it possible to further detect an open or short circuit fault of the signal terminal of the IC on the mounting board 3. Repair is performed on the faulty part detected at this time, and the boundary scanning inspection is repeatedly performed until no faults occur in the signal terminals of all the ICs.

Next, from the boundary scanning inspection device 2, the mounting substrate 3
All outputs and bidirectional terminals of the above IC repeatedly transmit a boundary scan inspection pattern that changes from a low potential to a high potential and from a high potential to a low potential at the same time. As described above, when all the outputs and the bidirectional terminals of the IC on the mounting board 3 change simultaneously, the reference potential fluctuates, and the operation of the IC becomes more likely to become unstable. In addition, since a shock is applied to the mounting substrate 3, it is extremely likely that the incompletely soldered portions of the power supply and the ground terminal are defective.
If there is a failure in the power supply or ground terminal in this state,
The possibility that the operation of the IC becomes unstable becomes extremely large.
If an abnormality is detected in this boundary scan inspection, the operation of the IC has become unstable, and it is apparently reported that one of the signal terminals of the IC has failed. Since all the failures of the signal terminals have been detected by the boundary scan inspection for detecting the short-circuit failure, it is understood that this abnormality is caused by the failure of the power supply or the ground terminal.

By changing the voltage of the power supply 4 as necessary and repeating the boundary scanning inspection, a more accurate inspection can be performed. Further, since the boundary scanning inspection is very fast, the entire inspection time can be reduced. In addition, it is possible to easily create an inspection pattern in which all outputs and bidirectional terminals of the IC are simultaneously changed in order to make the operation of the IC unstable.

As described above, according to the present invention, an open failure of the power supply terminal and the ground terminal of the integrated circuit mounted on the printed circuit board can be detected easily and at high speed.

The structure of the inspection apparatus is shown in FIGS.
, The boundary test device, the power supply device, and the impact device described above may be appropriately combined.

When performing the inspection, it is not necessary to use a single mounting board. The inspection may be performed with a plurality of mounting boards or in a state where the inspection is incorporated in the device. The inspection may be performed while changing the temperature, the voltage, and the like.

[0032]

According to the present invention, an open fault of a power supply terminal and a ground terminal of an integrated circuit mounted on a printed circuit board, which has been very difficult in the past, can be detected easily and at high speed.

Since the inspection can be performed at a high speed, the number of mounting substrates to be inspected can be increased as compared with the related art, or in some cases, the total number of mounting substrates can be inspected, so that the quality of equipment is improved.

Further, the inspection time can be shortened, and the inspection cost can be reduced in terms of time. By using the boundary scanning inspection, an inspection pattern can be easily generated, and the operation under the worst condition in the operation of the IC, in which all outputs and bidirectional terminals are changed simultaneously, can be surely performed.

Further, since the boundary scanning inspection device can be constituted by an inexpensive device such as a personal computer, the inspection cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of an inspection apparatus according to an embodiment of the present invention.

FIG. 2 is a flowchart showing one embodiment of an inspection method according to the embodiment of the present invention.

FIG. 3 is a configuration diagram of an inspection apparatus according to an embodiment of the present invention.

FIG. 4 shows the same as above.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Environmental test device 2 Boundary scanning inspection device 3 Mounting board 4 Power supply device 5 Impact device

Claims (8)

[Claims] An environment test apparatus capable of changing the temperature in the environment, and an inspection apparatus for transmitting a boundary scan inspection signal to a mounting board and determining a fault location from the inspection result obtained as a result. Inspection equipment. 2. A power supply device capable of changing a power supply voltage supplied to a mounting substrate, and an inspection device for transmitting a boundary scan inspection signal to the mounting substrate and determining a faulty portion from the inspection result obtained as a result. Inspection equipment. 3. An inspection apparatus having a vibration device for applying vibration, impact, and the like to a mounting substrate, and an inspection device for sending a boundary scanning inspection signal to the mounting substrate and determining a faulty portion based on an inspection result obtained as a result. . 4. An environmental test apparatus capable of changing the temperature in the environment, a power supply apparatus capable of changing a power supply voltage supplied to the mounting board, a vibrating apparatus for applying vibration, impact, and the like to the mounting board; An inspection apparatus having an inspection apparatus for transmitting a boundary scanning inspection signal to a mounting board and determining a faulty portion from an inspection result obtained as a result. 5. An environment test apparatus, wherein the temperature in the environment is reduced to a low temperature.
Boundary where the temperature is changed to normal temperature or high temperature, and all outputs and bidirectional terminals of the mounted integrated circuit are simultaneously changed from low potential to high potential or from high potential to low potential from the inspection device to the mounting board. An inspection method characterized by easily and quickly detecting an open failure of a power supply terminal and a ground terminal of an integrated circuit mounted on a printed circuit board by repeatedly sending a scanning inspection signal to make the operation of the integrated circuit unstable. . 6. A power supply test apparatus changes a power supply voltage supplied to a mounting board to a low potential, a normal potential, and a high potential, and outputs all outputs of an integrated circuit mounted on the mounting board and both from the testing apparatus to the mounting board. By repeatedly sending a boundary scan inspection signal in which the direction terminal simultaneously changes from a low potential to a high potential or from a high potential to a low potential to make the operation of the integrated circuit unstable, the integrated circuit mounted on the printed circuit board is An inspection method characterized by easily and quickly detecting an open failure of a power terminal and a ground terminal. 7. A vibration device applies vibration or shock to a mounting substrate, and all outputs and bidirectional terminals of an integrated circuit mounted on the mounting substrate are simultaneously changed from a low potential to a high potential or from a testing device to the mounting substrate. By repeatedly sending a boundary scan inspection signal that changes from a high potential to a low potential and destabilizing the operation of the integrated circuit, open failure of the power supply terminal and the ground terminal of the integrated circuit mounted on the printed circuit board can be easily and easily performed. Inspection method characterized by high-speed detection. 8. An environment test apparatus for lowering the temperature in the environment to a low temperature,
The temperature is changed to normal temperature and high temperature, the power supply voltage supplied to the mounting board is changed to low potential, normal potential, and high potential by the power test device, and the mounting board is vibrated or shocked by the vibration device. On the other hand, all outputs and bidirectional terminals of the mounted integrated circuit repeatedly transmit a boundary scan inspection signal such that the potential changes from a low potential to a high potential or from a high potential to a low potential, and the operation of the integrated circuit is not performed. An inspection method characterized by easily and quickly detecting an open failure of a power supply terminal and a ground terminal of an integrated circuit mounted on a printed circuit board by making the circuit stable.