JP2001021611A - Semi-conductor testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To carry out the contact check of a semi-conductor testing device without using any special unit for contact check. SOLUTION: The device 200 for carrying out test is mounted on the IC socket of a burn-in board. A device deriver 100 impresses a voltage to a prescribed pin 221-1 to be contact-checked. When the contact of the burn-in board with the device 200 does not have any problem, a P channel transistor of the input protecting circuit 210 of the device 200 is inversely biased according to the voltage impression, and currents are outputted to a power source line, and a prescribed output voltage is detected at an output terminal 310 on the power source line. Thus, the contact check is carried out by judging whether or not the device 200 is correctly mounted on the burn-in board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor test apparatus, and more particularly to a semiconductor test apparatus for checking a contact of a semiconductor device.

[0002]

2. Description of the Related Art Conventionally, a large number of semiconductor devices (hereinafter, referred to as a semiconductor device)
Inspection of the device is performed by an aging device which wears the device and applies thermal stress or electrical stress to the device. A burn-in device for performing an aging test on such a device will be described. FIG.
1 is a schematic view of a dynamic burn-in device. The dynamic burn-in apparatus 400 controls a plurality of chamber baths 410-1, 410-2,..., 410-N for mounting a plurality of burn-in substrates 500 on which devices are mounted, and thermal stress and electrical stress applied to the devices. And a controller unit 420 that performs the operation. The burn-in substrate 500 on which a number of devices to be inspected are mounted is installed in the chamber tank 410-N, and subjected to thermal stress and electrical stress according to the control of the controller 420.

Next, the burn-in substrate 500 will be described. FIG. 7 is a configuration diagram of the burn-in board. The burn-in board 500 includes a number of IC sockets 510 provided for mounting devices on the burn-in board 500, and a connector 520 for electrically connecting the burn-in board 500 to a burn-in device. The device to be tested is
It is mounted on the IC socket 510 and is electrically connected to the burn-in device main body by the connector 520.

In a burn-in apparatus for performing an aging test of such a device, a comparator unit or the like having a comparison operation function is added in order to check whether there is any problem in mechanical contact of a system to be tested.

[0005]

However, there is a problem that some of the conventional semiconductor test devices cannot execute a contact check for checking whether the device is correctly mounted on the measurement board.

For example, in a burn-in apparatus for performing an aging test of a device, when a large number of devices are mounted on a burn-in board, an ISVM (I Source) for checking whether or not the devices are correctly mounted is provided.
eV Measure) and VMIS (V Measure)
ure I Source) unit,
Some have only a driver for stress application. In this type of semiconductor test apparatus, it has not been possible to confirm whether the device is mounted correctly, that is, whether there is no problem with the contact.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a semiconductor test apparatus which performs device contact check without requiring a special unit for contact check.

[0008]

According to the present invention, there is provided a semiconductor test apparatus for testing a semiconductor device by mounting a semiconductor device having an input protection diode in an IC socket. Voltage applying means for applying a voltage to a signal pin of the IC socket which contacts a predetermined device pin of the device; and a current flowing to a power supply pin of the semiconductor device or a potential of the power supply pin in accordance with the voltage applied by the voltage application means Or a contact detecting means for detecting a current and a potential.

In the semiconductor test apparatus having such a configuration, after a semiconductor device is mounted on an IC socket, a voltage is applied to a signal pin of the IC socket for checking a contact with the mounted semiconductor device by a voltage applying means.
A semiconductor device generally includes an input protection diode. If there is no problem with the contact, a voltage is applied to a device pin of the semiconductor device corresponding to the signal pin of the IC socket, and a power supply pin is set according to the applied voltage. , A predetermined current flows. By detecting the current flowing through the power supply pin and / or the potential of the power supply pin by the contact detection means, it is checked whether there is any problem in the contact.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram of a semiconductor test apparatus according to one embodiment of the present invention. Here, a description will be given assuming that a device to be tested is mounted on the IC socket of the burn-in board described above and a contact check is performed. The semiconductor test apparatus according to the present invention includes a device driver 100 that is a voltage application unit that applies a voltage to a predetermined signal pin of an IC socket, and an output terminal 310 that is a contact detection unit. It is mounted on an IC socket (not shown). Device 2
00 indicates a plurality of device pins 221-n as required.
(N = 1, 2,..., N) and the ground (GN
D) 231 and a power supply pin (VCC) 232 are always provided. Further, inside the device 200, an input protection circuit 210 for protecting an internal element from a signal input through each device pin 221-n is provided. Device 2
00 is attached to the IC socket, the device pins 221-n and GND 231 of the device 200 and VCC2
Reference numeral 32 contacts the burn-in board via the signal pin of the corresponding IC socket. The device driver 100
Device 20 mounted in IC socket of burn-in board
A voltage is applied to the signal pin of the IC socket corresponding to the predetermined 0 device pin 221-n. Signal pins to which a voltage is applied can be sequentially selected. If there is no problem with the contact between the IC socket and the device 200, the voltage applied to the signal pin of the IC socket is applied to the device pin 221-n of the corresponding device 200. The output terminal 310 is connected to the power pin 232 of the device 200. A terminal for extracting a current flowing through the terminal, such as a check pin that can be probed.

The operation of the semiconductor test apparatus having such a configuration will be described. The device 200 to be tested is mounted on the IC socket of the burn-in board. Device driver 100
Is an IC corresponding to a contact check pin 221-1 which is a predetermined device pin for performing a contact check.
Apply voltage to the signal pins of the socket. If there is no problem with the contact between the burn-in board (IC socket) and the device 200, a voltage is applied to the device pin 221-1 which is a contact check pin, and the voltage is applied to the PN junction of the input protection circuit 210 of the device 200. On the other hand, a reverse bias is applied, and a current is output to the power supply line. This current is applied to VCC2 of device 200.
The signal is output from a signal pin of an IC socket contacting the IC 32 to a power supply line outside the device 200. The output voltage is measured at the output terminal 310 provided on the power supply line. If there is no problem with the contact between the device 200 and the IC socket, a predetermined output voltage value is detected at the output terminal 310. In this manner, a contact check is performed to determine whether the device 200 is correctly mounted on the burn-in board.

Next, the entire semiconductor test apparatus will be described. FIG. 2 is a configuration diagram of a semiconductor test apparatus according to an embodiment of the present invention. The same components as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted. On a burn-in board (not shown), n IC sockets for mounting n devices are provided, and device 1 (200a),
Device 2 (200b),..., Device n is mounted. The signal pins of the IC socket connected to each device have the corresponding pins connected to the same line, and the voltage output from the device driver 100 is applied to the same pin number of all the IC sockets at once. Device driver 100
Selects a line connected to a desired signal pin and applies a voltage. On the VCC line of each device, a contact point such as a check pin is provided so that a potential can be detected. The contact point may be anywhere on the burn-in substrate. For example, to facilitate the potential measurement, the VCC check pin of each device, the device 1 VCC,
The device 2 VCC,..., The device n VCC may be collectively provided in the vicinity.

The operation of the semiconductor test apparatus having such a configuration will be described. Device 1 (200a) for testing,
The device 2 (200b),..., Device n is mounted on the IC socket of the burn-in board. The device driver 100
A line connected to a signal pin to be subjected to a contact check is selected and a voltage is applied. If there is no problem with the contact, a voltage is simultaneously applied to the corresponding device pin of the device mounted on each IC socket, and the VC of each device is
C becomes a predetermined potential. This is the VCC check pin,
Measured at device 1 VCC, device 2 VCC, ..., device n VCC. If there is no problem with the contact, a predetermined potential is detected. The device driver 100
A voltage is sequentially applied to each signal pin to perform a contact check.

As described above, in the semiconductor test apparatus having such a configuration, the contact check can be performed without requiring a special unit for the contact check. For this reason, in a burn-in device provided with only a drive unit that could not perform a contact check conventionally, it is possible to check a contact of a mounted device.

Normally, the number of devices mounted on a semiconductor test apparatus, especially an aging apparatus, is large. Therefore, when the VCC check pins are provided as described above, the number of pins becomes enormous. Therefore, the work of measuring the potential of each check pin requires much labor. Therefore, an embodiment for facilitating the contact check will be described. FIG. 3 is a block diagram of a semiconductor test apparatus according to another embodiment of the present invention. 1 and 2 are denoted by the same reference numerals, and description thereof is omitted. The semiconductor test apparatus according to the present invention includes, for each device 200, contact display means 320 whose state changes depending on whether or not a current flows on the VCC line. As described above, when there is no problem with the contact between the device 200 and the IC socket, a current flows from VCC of the device 200 by applying a voltage to a predetermined device pin of the device driver 100. This is input to the contact display means 320, and the state of the contact display means 320 changes. In this way, a contact check is performed. Contact display means 3
Reference numeral 20 indicates the presence or absence of a current by changing the state according to the presence or absence of a current. For example, there are a light emitting diode (hereinafter, referred to as an LED) and a device that moves when a current flows.

A case where an LED is provided as the contact display means will be described. FIG. 4 is a block diagram of an LED section of a semiconductor test apparatus according to another embodiment of the present invention. 1, 2, and 3 are denoted by the same reference numerals, and description thereof is omitted. The LED 321 is provided on the VCC line of the device 1 (200a). Similarly, an LED 322 is provided on the VCC line of the next device, and thereafter, LEDs for the number of mounted devices are provided on the VCC line of each device. LED 321, 3
Reference numeral 22 turns on when a current flows through the VCC line, and turns off when no current flows. Therefore, by visually checking the blinking of the LED, the result of the contact check between the device and the IC socket can be confirmed.

Next, a description will be given of a contact check method in a semiconductor test apparatus provided with the LED described above. FIG. 5 is a flowchart of a contact check procedure in a semiconductor test apparatus according to another embodiment of the present invention. When the contact check is started (S1
1) A device pin to be checked for contact is set, and a voltage is applied to the device pin selected by the device driver (S12). A voltage is applied to all the device pins of the mounted device by the device driver, and an LED provided corresponding to a device having a normal contact is turned on. It is visually checked whether or not the LEDs for the number of mounted devices to which the devices are mounted are turned on (S13). If the LED is lit, there is no problem with the contact of the corresponding device, and the next process S1
The process proceeds to 5. If the LED does not light, the device is checked (S14). If the LED does not light, it means that the pin contact between the device pin and the IC socket is NG, so that check is made. When the check of the predetermined pins is completed, it is checked whether the contact check of all the pins is completed (S1).
5). If not completed, the next pin is selected and S12
Is repeated. If all the pins have been completed, the contact check processing ends (S16).

As described above, the result of the contact check between the device and the IC socket can be visually checked by blinking the light emitting diode, so that the contact check can be further facilitated. This is particularly effective when a large number of devices are checked at once.

[0019]

As described above, according to the present invention, a device to be inspected is mounted, and a voltage is applied to a signal pin of a predetermined IC socket to be contact-checked. The device generally has a diode for input protection, and if there is no problem with the contacts, the voltage is applied to the device,
A predetermined current flows through the power supply pin according to the applied voltage. Therefore, by detecting the current flowing through the power supply pin and / or the potential of the power supply pin, it is checked whether there is any problem in the contact. Thus, ISV
The contact check can be performed without requiring a device for contact check such as M. For this reason, it becomes possible to check the contact of the mounted device in an aging device of a device including only a drive unit which cannot perform a contact check conventionally, for example, a burn-in device. Of course, the present invention is not limited to the burn-in device, and enables a device contact check to be performed in a semiconductor test device having only other driver units.

[Brief description of the drawings]

FIG. 1 is a block diagram of a semiconductor test apparatus according to an embodiment of the present invention.

FIG. 2 is a configuration diagram of a semiconductor test apparatus according to an embodiment of the present invention.

FIG. 3 is a block diagram of a semiconductor test apparatus according to another embodiment of the present invention.

FIG. 4 is a block diagram of a light emitting diode unit of a semiconductor test device according to another embodiment of the present invention.

FIG. 5 is a flowchart of a contact check procedure in a semiconductor test apparatus according to another embodiment of the present invention.

FIG. 6 is a schematic view of a dynamic burn-in device.

FIG. 7 is a configuration diagram of a burn-in substrate.

[Explanation of symbols]

100: Device driver, 200: Device, 210: Input protection circuit, 221-1: Contact check pin (device pin), 221-n: Device pin, 231
... ground (GND), 232 ... power supply pin (VCC),
310 ... output terminal

Claims (6)

[Claims] 1. A semiconductor test apparatus for testing a semiconductor device by mounting a semiconductor device having an input protection diode in an IC socket, wherein a signal pin of the IC socket that contacts a predetermined device pin of the semiconductor device under test. Voltage applying means for applying a voltage, and contact detecting means for detecting a current flowing to a power supply pin of the semiconductor device or a potential of the power supply pin, or a current and a potential according to the voltage applied by the voltage applying means. A semiconductor test apparatus. 2. The semiconductor device according to claim 1, wherein the voltage applying means applies a voltage to signal pins of an IC socket corresponding to the predetermined device pins of all the semiconductor devices mounted on the semiconductor test apparatus. Claim 1
The semiconductor test apparatus according to the above. 3. The semiconductor test apparatus according to claim 1, wherein said voltage applying means selects a signal pin to which a voltage is applied from a plurality of signal pins provided on said IC socket. 4. The semiconductor device according to claim 1, wherein said contact detection means has a probing contact point at a predetermined position on a power supply line connected to a power supply pin of an IC socket which contacts a power supply pin of said semiconductor device. Item 2. A semiconductor test apparatus according to item 1. 5. The contact display means, wherein a state changes depending on whether or not a current has flowed to a predetermined position on a power supply line connected to a power supply pin of an IC socket contacting a power supply pin of the semiconductor device. The semiconductor test apparatus according to claim 1, further comprising: 6. The semiconductor test apparatus according to claim 5, wherein said contact display means is a light emitting diode which lights up at the time of normal contact.