JPH1180990A5 - - Google Patents

Info

Publication number
JPH1180990A5
JPH1180990A5 JP1997265027A JP26502797A JPH1180990A5 JP H1180990 A5 JPH1180990 A5 JP H1180990A5 JP 1997265027 A JP1997265027 A JP 1997265027A JP 26502797 A JP26502797 A JP 26502797A JP H1180990 A5 JPH1180990 A5 JP H1180990A5
Authority
JP
Japan
Prior art keywords
liquid
substrate
plating
processing chamber
plating pretreatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997265027A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1180990A (ja
JP3720548B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP26502797A external-priority patent/JP3720548B2/ja
Priority to JP26502797A priority Critical patent/JP3720548B2/ja
Priority to EP98116569A priority patent/EP0901153B1/en
Priority to US09/145,500 priority patent/US6544585B1/en
Priority to KR1019980035982A priority patent/KR100586481B1/ko
Priority to DE69840975T priority patent/DE69840975D1/de
Publication of JPH1180990A publication Critical patent/JPH1180990A/ja
Publication of JPH1180990A5 publication Critical patent/JPH1180990A5/ja
Publication of JP3720548B2 publication Critical patent/JP3720548B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP26502797A 1997-09-02 1997-09-11 めっき前処理装置 Expired - Lifetime JP3720548B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP26502797A JP3720548B2 (ja) 1997-09-11 1997-09-11 めっき前処理装置
DE69840975T DE69840975D1 (de) 1997-09-02 1998-09-02 Verfahren und Vorrichtung zum Aufbringen einer Schichten auf einen Körper
US09/145,500 US6544585B1 (en) 1997-09-02 1998-09-02 Method and apparatus for plating a substrate
KR1019980035982A KR100586481B1 (ko) 1997-09-02 1998-09-02 기판을도금하는방법
EP98116569A EP0901153B1 (en) 1997-09-02 1998-09-02 Method and apparatus for plating a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26502797A JP3720548B2 (ja) 1997-09-11 1997-09-11 めっき前処理装置

Publications (3)

Publication Number Publication Date
JPH1180990A JPH1180990A (ja) 1999-03-26
JPH1180990A5 true JPH1180990A5 (enExample) 2005-04-07
JP3720548B2 JP3720548B2 (ja) 2005-11-30

Family

ID=17411572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26502797A Expired - Lifetime JP3720548B2 (ja) 1997-09-02 1997-09-11 めっき前処理装置

Country Status (1)

Country Link
JP (1) JP3720548B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008308708A (ja) * 2007-06-12 2008-12-25 Fujikura Ltd めっき形成方法およびめっき処理装置
KR101278438B1 (ko) * 2011-05-06 2013-06-24 삼성전기주식회사 기판의 에어 트랩 제거장치
CN103276414A (zh) * 2013-06-08 2013-09-04 苏州市金翔钛设备有限公司 一种应用于高开孔率微小孔板的电铸装置

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