JP3720548B2 - めっき前処理装置 - Google Patents

めっき前処理装置 Download PDF

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Publication number
JP3720548B2
JP3720548B2 JP26502797A JP26502797A JP3720548B2 JP 3720548 B2 JP3720548 B2 JP 3720548B2 JP 26502797 A JP26502797 A JP 26502797A JP 26502797 A JP26502797 A JP 26502797A JP 3720548 B2 JP3720548 B2 JP 3720548B2
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JP
Japan
Prior art keywords
plating
liquid
processing chamber
substrate
plating pretreatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP26502797A
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English (en)
Japanese (ja)
Other versions
JPH1180990A (ja
JPH1180990A5 (enExample
Inventor
文夫 栗山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP26502797A priority Critical patent/JP3720548B2/ja
Priority to DE69840975T priority patent/DE69840975D1/de
Priority to US09/145,500 priority patent/US6544585B1/en
Priority to KR1019980035982A priority patent/KR100586481B1/ko
Priority to EP98116569A priority patent/EP0901153B1/en
Publication of JPH1180990A publication Critical patent/JPH1180990A/ja
Publication of JPH1180990A5 publication Critical patent/JPH1180990A5/ja
Application granted granted Critical
Publication of JP3720548B2 publication Critical patent/JP3720548B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)
JP26502797A 1997-09-02 1997-09-11 めっき前処理装置 Expired - Lifetime JP3720548B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP26502797A JP3720548B2 (ja) 1997-09-11 1997-09-11 めっき前処理装置
DE69840975T DE69840975D1 (de) 1997-09-02 1998-09-02 Verfahren und Vorrichtung zum Aufbringen einer Schichten auf einen Körper
US09/145,500 US6544585B1 (en) 1997-09-02 1998-09-02 Method and apparatus for plating a substrate
KR1019980035982A KR100586481B1 (ko) 1997-09-02 1998-09-02 기판을도금하는방법
EP98116569A EP0901153B1 (en) 1997-09-02 1998-09-02 Method and apparatus for plating a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26502797A JP3720548B2 (ja) 1997-09-11 1997-09-11 めっき前処理装置

Publications (3)

Publication Number Publication Date
JPH1180990A JPH1180990A (ja) 1999-03-26
JPH1180990A5 JPH1180990A5 (enExample) 2005-04-07
JP3720548B2 true JP3720548B2 (ja) 2005-11-30

Family

ID=17411572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26502797A Expired - Lifetime JP3720548B2 (ja) 1997-09-02 1997-09-11 めっき前処理装置

Country Status (1)

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JP (1) JP3720548B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103276414A (zh) * 2013-06-08 2013-09-04 苏州市金翔钛设备有限公司 一种应用于高开孔率微小孔板的电铸装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008308708A (ja) * 2007-06-12 2008-12-25 Fujikura Ltd めっき形成方法およびめっき処理装置
KR101278438B1 (ko) * 2011-05-06 2013-06-24 삼성전기주식회사 기판의 에어 트랩 제거장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103276414A (zh) * 2013-06-08 2013-09-04 苏州市金翔钛设备有限公司 一种应用于高开孔率微小孔板的电铸装置

Also Published As

Publication number Publication date
JPH1180990A (ja) 1999-03-26

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