JPH1167398A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure electrical connection between a contact terminal and a contact and to accurately and easily measured electrical characteristics of an IC by forking a contact part of a contact to be pressure contacted to an IC contact terminal in two ways and sliding the contact part of the pressure- contacted contact relatively with the contact terminal on a surface of the contact terminal. SOLUTION: To a reed member 4 of an IC3, a contact part provided at the tip end of a contact 2 of an IC socket 1 to be pressure-contacted thereto is forked in two. A contact part of the contact 2 is brought into contact with an IC lead member 4 by pressure-contact and is slid relatively on a surface of the IC reed member 4, and electric connection between a contact terminal of the reed member 4 and the contact 2 is ensured. When a material of the contact 2 is varied, foreign material removing properties and contact properties can be controlled, use of rigid material provides good contact, and forking the contact part into two provides resilience, while making contact.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an IC socket used for measuring electric characteristics of an IC.

[0002]

2. Description of the Related Art FIG. 11 shows an example of a conventional IC socket. In the figure, 1 is a socket, 2 is a contact, 3 is I
C and 4 are IC lead members. The IC 3 is inserted into a predetermined position of the socket. The IC 3 is pushed downward by a predetermined force by a socket lid or the like. Therefore, the lead 4 of the IC 3 is brought into contact with the contact 2 with a predetermined force. Contact 2
Are curved as shown in FIG. 2 and maintain contact with the lead 4 with a constant force. In this way, the leads 4 of the IC and the contacts 2 maintain electrical continuity.

However, according to the conventional method, a large area is required.
Since the lead 4 of the IC and the contact 2 are in contact with each other, it is necessary to make contact with a certain force or more in order to maintain good conduction.
As a result, there is a problem that the contact surface is damaged and soldering is generated. Also, if the pitch or width of the leads 4 is reduced, positioning becomes difficult, causing poor contact,
In addition, there is a problem that, for example, if a contact is made while the position is shifted, a foot bend or the like occurs.

[0004]

SUMMARY OF THE INVENTION The present invention relates to an IC socket having a contact portion which is in pressure contact with a contact terminal of an IC having a plurality of contact terminals and having a contact which can conduct with the contact terminal. It is an object of the present invention to obtain an IC socket capable of ensuring accurate and easy measurement by securing electrical connection between the contact and the contact.

[0005]

According to the first aspect of the present invention, there is provided an IC socket having a contact portion which is in pressure contact with an IC contact terminal having a plurality of contact terminals each comprising a lead member and which is capable of conducting with the contact terminal. In the one provided with, the contact portion of the contact is in a straddle shape, the contact portion of the contact is slid relatively to the surface of the contact terminal by pressure contact with the contact terminal, between the two This is to ensure the electrical connection.

According to a second aspect of the present invention, there is provided an IC socket comprising a plurality of contacts which have contact portions for contacting contact terminals of an IC having a plurality of contact terminals, respectively, and which are capable of conducting with the contact terminals. A movable plate having a plurality of holes through which the contacts are inserted is provided, and a contact terminal of the IC can be moved in a direction away from the contacts by pressing by the movable plate.

According to a third aspect of the present invention, there is provided an IC socket having a plurality of contacts which have contact portions for contacting the contact terminals of an IC having a plurality of contact terminals and are capable of conducting with the contact terminals. The plurality of contacts of the socket are arranged so as not to interfere with each other so that the contact terminals of the IC having the above contact terminals can be conducted without leakage.

According to a fourth aspect of the present invention, there is provided an IC socket having a plurality of contacts which have contact portions for contacting contact terminals of an IC having a plurality of contact terminals, respectively, and which are capable of conducting with the contact terminals. The contact which is not conducted to the contact terminal is connected to the grounding portion.

In an IC socket according to a fifth aspect of the present invention, a plurality of IC pressing portions for mounting an IC having an arbitrary shape are provided.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. FIG. 1 shows a first embodiment of the present invention. The figure shows the periphery of the contact in an enlarged manner. In FIG. 1, 1 is a socket body, 2 is a contact, 3 is an IC body,
Is a contact terminal formed of an IC lead member, 5 is a printed board, and 6 is a pattern wiring formed on the printed board. FIG. 1A shows a state immediately before the IC contacts the IC socket, and FIG. 1B shows a state where the IC sufficiently contacts the IC socket.

As described above, the contact portion provided at the tip of the contact 2 of the IC socket has a straddle shape, and the IC lead member 4
When the contact is made, the contact portion provided at the tip of the contact 2 slides on the IC socket in the horizontal direction, thereby removing foreign matters and realizing reliable contact with the IC lead member 4. That is, by pressing the contact 2 against the contact terminal formed of the IC lead member 4, the contact portion at the tip of the contact 2 is slid relatively to the surface of the contact terminal formed of the IC lead member 4, thereby making the IC lead. An electrical connection between the contact terminal made of the member 4 and the contact 2 is ensured.

By changing the material of the contact 2,
It is possible to control foreign matter removal and contact properties. For example, if a better contact is desired, this can be achieved by using a rigid material. In addition, the contact portion provided at the tip of the contact 2 has a straddle shape, so that a spring property at the time of contact can be obtained. If the contacts are made thinner as shown in the figure and a plurality of the contacts are brought into contact with one IC lead, better contact can be realized.

Embodiment 2 FIG. FIG. 2 is an overall view of the present socket. FIG. 3 shows an embodiment of the present socket.
The IC package 3 dropped into the socket by the IC package transport device is positioned by the lead guide member 7 so as to be in contact with the flat part of the lead member 4 of the IC package 3 and the needle-like contact 2 of the socket.

After that, the lead presser 8 of the transfer device
Upper movable plate 9 integrated with guide member 7
Is pushed downward, the contact 2 comes out above the movable plate 9, and the flat portion of the lead member 4 of the IC package 3 and the contact 2 come into contact. At this time, the upper surface of the flat part of the lead member 4 is in a state of being pressed by the work holder 8.

On the other side of the contact 2, a positioning pin 1 of a socket is attached to an electrode 6 on a test printed circuit board 5.
According to No. 1, it is possible to contact the correct position and obtain good electrical characteristics. After the measurement, the work clamp 8
Is released upward, the movable plate 9 pushes up the IC due to the reaction force of the spring 12 of the socket, and the IC package 3 can be easily removed from the socket (FIG. 4).

The following effects are obtained when pushing up an IC. A large amount of foreign matter accumulates in the contact 2 that has been repeatedly contacted several times, which causes a conduction failure. In this socket, every time the movable plate 9 is pushed up, the foreign matter 13 attached to the contact 2 is removed. The foreign matter 13 is removed by the air blow 14 or the like, so that the foreign matter 13 is not accumulated in the contact 2 (FIGS. 5 and 6).

Embodiment 3 7 and 8 show a third embodiment of the present invention. 7 and 8, reference numeral 15 denotes a QFP.
IC, 16 is QFP15 foot pattern, 17 is S
OP IC, 18 is SOP17 foot pattern, 19
Is a BGA IC, 20 is a BGA19 foot pattern,
1 is an IC socket, 21 is QFP15, SOP17, B
The foot pattern 16, 18, 20 of the GA 19 is superimposed, 22 is an insulating material, and 2 is a socket contact. Here, the foot pattern refers to a surface of a contact terminal (hereinafter, referred to as an IC terminal) made of an IC lead member or a ball grid, which is in electrical contact with the socket. Since the foot patterns 16, 18, and 20 differ greatly depending on the external shape of the ICs 15, 17, and 19, a socket is conventionally required for each external shape of the IC.

In the present invention, the foot patterns 16, 1
I, like a foot pattern 21 in which 8, 20 are superimposed
Regardless of where the C foot pattern is located, each contact of the socket can contact the IC terminal without interference. In addition, this socket can be made sufficiently large by arranging a number of contacts and insulating materials side by side, and can conduct without leakage to the IC terminals of an IC having a plurality of IC terminals. Thereby, it can be used regardless of the size of the IC outer shape. That is, in the third embodiment, the contacts 2 of the socket are arranged so as not to interfere with each other so that an IC having a large number of contact terminals can be conducted to all terminals at any place on the socket.

Embodiment 4 FIG. 9 shows a fourth embodiment of the present invention. In FIG. 9, 1 is an IC socket, 5 is a substrate, 16 is an IC foot pattern, and 23 is a ground (GN).
D), 24 is a signal wiring. Here, in an evaluation board used by bringing the IC socket 1 and the board 5 into contact with each other,
The state where the IC socket 1 is disconnected will be described. Wiring connecting the foot pattern 16 of the IC to be evaluated and its terminals to the evaluation device on the substrate 5 (wiring is not visible on the multilayer substrate)
A ground (GND) part 23 is made directly below the socket excluding
Place the socket 1 on it and fix it. This allows I
The portions other than the C foot pattern 16 are in a ground (GND) state, and the electrical characteristics of the signal can be improved.

Embodiment 5 FIG. 10 shows a fifth embodiment of the present invention. In FIG. 10, 1 is a socket, 5 is a board, 15 is a QFP IC, 17 is an SOP IC, 19
Denotes an IC of a BGA, and 24 denotes an IC presser of a handler which is a device for handling the IC. The socket 1, the board 5, and the like have the same configuration as in the third and fourth embodiments.

High versatility can be achieved simply by matching the handlers and substrates as devices for handling ICs with the external shape and foot pattern of the IC. For example, it is possible to simultaneously measure ICs having different external shapes.

[0022]

According to the first aspect of the present invention, there is provided an IC socket having a contact portion which is in pressure contact with a contact terminal of an IC having a plurality of contact terminals and having a contact which can conduct with the contact terminal.
It is possible to secure an electrical connection between the contact terminal and the contact, and obtain an IC socket that can perform accurate and easy measurement.

According to a second aspect of the present invention, there is provided an IC socket having a contact portion which is in pressure contact with a contact terminal of an IC having a plurality of contact terminals and having a contact which can conduct with the contact terminal.
It is possible to obtain an IC socket capable of easily removing C and removing dust generated on the contact by the movable plate.

According to the third aspect of the present invention, in an IC socket having a contact portion which is in pressure contact with a contact terminal of an IC having a plurality of contact terminals and provided with a contact which can conduct with the contact terminal, Even with an IC, it is possible to obtain an IC socket that can measure accurately and easily.

According to the fourth aspect of the present invention, there is provided an IC socket having a contact portion which is in pressure contact with a contact terminal of an IC having a plurality of contact terminals and having a contact which can conduct with the contact terminal. Thus, an IC socket capable of performing appropriate measurement can be obtained.

According to the fifth aspect of the present invention, there is provided an IC socket having a contact portion which is in pressure contact with a contact terminal of an IC having a plurality of contact terminals and having a contact which can conduct with the contact terminal. It is possible to obtain an IC socket that can simultaneously measure an IC.

[Brief description of the drawings]

FIG. 1 is a sectional view showing Embodiment 1 of the present invention.

FIG. 2 is a sectional view showing a second embodiment of the present invention.

FIG. 3 is a sectional view showing Embodiment 2 of the present invention.

FIG. 4 is a sectional view showing Embodiment 2 of the present invention.

FIG. 5 is a sectional view showing a second embodiment of the present invention.

FIG. 6 is a sectional view showing a second embodiment of the present invention.

FIG. 7 is a sectional view showing a third embodiment of the present invention.

FIG. 8 is a perspective view showing a third embodiment of the present invention.

FIG. 9 is a plan view showing a fourth embodiment of the present invention.

FIG. 10 is a perspective view showing a fifth embodiment of the present invention.

FIG. 11 is a sectional view showing a conventional IC socket.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 IC socket, 2 contacts, 3 IC, 4 IC lead members, 5 printed circuit board, 6 electrode part composed of pattern wiring formed on printed circuit board, 7 guide member, 8 lead holder, 9 movable plate, 10 fixed Plate, 11 positioning pin, 12 spring, 13 foreign matter, 1
4 air blow, 15 QFP, 17 SOP, 19
BGA, 16, 18, 20, 21 Foot pattern of IC, 22 insulating material, 23 ground (GND) part, 24 IC holder of handler.

Continued on the front page (72) Inventor Shigeru Takada 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsubishi Electric Corporation

Claims (5)

[Claims] 1. An apparatus having a contact portion for press-contacting a contact terminal of an IC having a plurality of contact terminals formed of a lead member and having a contact capable of conducting with the contact terminal, wherein the contact portion of the contact is covered. The contact portion of the contact is slid relative to the surface of the contact terminal by press contact with the contact terminal to secure an electrical connection between the contact terminal and the contact terminal. IC socket. 2. An IC having a plurality of contact terminals and having a plurality of contacts each having a contact portion for contacting a contact terminal of an IC having a plurality of contact terminals, the plurality of holes through which the contact terminals are inserted. Wherein the contact terminal of the IC can be moved in a direction away from the contact by pressing by the movable plate.
socket. 3. An IC having a plurality of contact terminals and having a plurality of contacts that have contact portions for contacting the contact terminals of the IC having a plurality of contact terminals, respectively, and having a plurality of contacts that can conduct with the contact terminals. An IC socket characterized by arranging a plurality of contacts of a socket so as not to interfere with each other so that the terminals can be conducted without leakage. 4. An apparatus having a plurality of contacts having contact portions for contacting contact terminals of an IC having a plurality of contact terminals, the plurality of contacts being capable of conducting with the contact terminals. An IC socket connected to a grounding part. 5. A plurality of ICs on which ICs of any shape can be mounted.
5. The IC socket according to claim 3, further comprising a holding portion.