JPH1150032A - 回路用接続部材及び回路板 - Google Patents

回路用接続部材及び回路板

Info

Publication number
JPH1150032A
JPH1150032A JP20952097A JP20952097A JPH1150032A JP H1150032 A JPH1150032 A JP H1150032A JP 20952097 A JP20952097 A JP 20952097A JP 20952097 A JP20952097 A JP 20952097A JP H1150032 A JPH1150032 A JP H1150032A
Authority
JP
Japan
Prior art keywords
circuit
connecting member
connection terminal
epoxy resin
circuit connecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP20952097A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1150032A5 (https=
Inventor
Itsuo Watanabe
伊津夫 渡辺
Kenzo Takemura
賢三 竹村
Akira Nagai
朗 永井
Kazuhiro Isaka
和博 井坂
Osamu Watanabe
治 渡辺
Kazuyoshi Kojima
和良 小島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP20952097A priority Critical patent/JPH1150032A/ja
Publication of JPH1150032A publication Critical patent/JPH1150032A/ja
Publication of JPH1150032A5 publication Critical patent/JPH1150032A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP20952097A 1997-08-04 1997-08-04 回路用接続部材及び回路板 Withdrawn JPH1150032A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20952097A JPH1150032A (ja) 1997-08-04 1997-08-04 回路用接続部材及び回路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20952097A JPH1150032A (ja) 1997-08-04 1997-08-04 回路用接続部材及び回路板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007122765A Division JP2007305994A (ja) 2007-05-07 2007-05-07 回路用接続部材及び回路板

Publications (2)

Publication Number Publication Date
JPH1150032A true JPH1150032A (ja) 1999-02-23
JPH1150032A5 JPH1150032A5 (https=) 2005-07-21

Family

ID=16574160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20952097A Withdrawn JPH1150032A (ja) 1997-08-04 1997-08-04 回路用接続部材及び回路板

Country Status (1)

Country Link
JP (1) JPH1150032A (https=)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001064619A (ja) * 1999-09-01 2001-03-13 Hitachi Chem Co Ltd 回路接続用フィルム状接着剤
JP2002097439A (ja) * 2000-09-21 2002-04-02 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、回路接続用接着剤組成物、接続体及び半導体装置
JP2002203871A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
WO2003099952A1 (en) * 2002-05-27 2003-12-04 Ajinomoto Co., Inc. Adhesive film and prepreg
JP2005194413A (ja) * 2004-01-08 2005-07-21 Hitachi Chem Co Ltd 回路接続用接着フィルム及び回路接続構造体
JP2006137954A (ja) * 2005-11-16 2006-06-01 Hitachi Chem Co Ltd 回路接続用接着剤
JP2007009022A (ja) * 2005-06-29 2007-01-18 Sekisui Chem Co Ltd シート状接着剤、電子部品装置の製造方法及び電子部品装置
JP2008084545A (ja) * 2006-09-25 2008-04-10 Sumitomo Electric Ind Ltd 電極接続用接着剤
JP2009124076A (ja) * 2007-11-19 2009-06-04 Asahi Kasei Electronics Co Ltd 接続構造体及び接続構造体の製造方法
CN100509981C (zh) 2001-11-16 2009-07-08 日立化成工业株式会社 电路连接用粘结剂
CN100509983C (zh) 2001-11-16 2009-07-08 日立化成工业株式会社 电路连接用粘结剂
CN100509984C (zh) 2001-11-16 2009-07-08 日立化成工业株式会社 电路连接用薄膜状粘结剂
CN100509982C (zh) 2001-11-16 2009-07-08 日立化成工业株式会社 电路连接用粘结剂
CN100513507C (zh) 2001-11-16 2009-07-15 日立化成工业株式会社 电路连接用粘结剂
JP2009275102A (ja) * 2008-05-14 2009-11-26 Hitachi Chem Co Ltd 回路接続材料
US7795325B2 (en) 2002-11-29 2010-09-14 Hitachi Chemical Co., Ltd. Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
KR20130072156A (ko) 2011-12-21 2013-07-01 히타치가세이가부시끼가이샤 회로 접속 재료, 접속체 및 접속체를 제조하는 방법
TWI448532B (https=) * 2001-11-14 2014-08-11
KR20200108439A (ko) 2018-01-17 2020-09-18 히타치가세이가부시끼가이샤 접착제 조성물, 접속 구조체 및 그의 제조 방법
US11384266B2 (en) 2005-02-17 2022-07-12 3M Innovative Properties Company Surfacing and/or joining method
KR20220162734A (ko) 2020-04-10 2022-12-08 쇼와덴코머티리얼즈가부시끼가이샤 접착제 조성물, 접착제 필름, 접속 구조체 및 그 제조 방법

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001064619A (ja) * 1999-09-01 2001-03-13 Hitachi Chem Co Ltd 回路接続用フィルム状接着剤
JP2002097439A (ja) * 2000-09-21 2002-04-02 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、回路接続用接着剤組成物、接続体及び半導体装置
JP2002203871A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
TWI448532B (https=) * 2001-11-14 2014-08-11
CN100509983C (zh) 2001-11-16 2009-07-08 日立化成工业株式会社 电路连接用粘结剂
CN100513507C (zh) 2001-11-16 2009-07-15 日立化成工业株式会社 电路连接用粘结剂
CN100509982C (zh) 2001-11-16 2009-07-08 日立化成工业株式会社 电路连接用粘结剂
CN100509984C (zh) 2001-11-16 2009-07-08 日立化成工业株式会社 电路连接用薄膜状粘结剂
CN100509981C (zh) 2001-11-16 2009-07-08 日立化成工业株式会社 电路连接用粘结剂
WO2003099952A1 (en) * 2002-05-27 2003-12-04 Ajinomoto Co., Inc. Adhesive film and prepreg
US7795325B2 (en) 2002-11-29 2010-09-14 Hitachi Chemical Co., Ltd. Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
JP2005194413A (ja) * 2004-01-08 2005-07-21 Hitachi Chem Co Ltd 回路接続用接着フィルム及び回路接続構造体
US11384266B2 (en) 2005-02-17 2022-07-12 3M Innovative Properties Company Surfacing and/or joining method
JP2007009022A (ja) * 2005-06-29 2007-01-18 Sekisui Chem Co Ltd シート状接着剤、電子部品装置の製造方法及び電子部品装置
JP2006137954A (ja) * 2005-11-16 2006-06-01 Hitachi Chem Co Ltd 回路接続用接着剤
JP2008084545A (ja) * 2006-09-25 2008-04-10 Sumitomo Electric Ind Ltd 電極接続用接着剤
JP2009124076A (ja) * 2007-11-19 2009-06-04 Asahi Kasei Electronics Co Ltd 接続構造体及び接続構造体の製造方法
JP2009275102A (ja) * 2008-05-14 2009-11-26 Hitachi Chem Co Ltd 回路接続材料
KR20130072156A (ko) 2011-12-21 2013-07-01 히타치가세이가부시끼가이샤 회로 접속 재료, 접속체 및 접속체를 제조하는 방법
KR20200108439A (ko) 2018-01-17 2020-09-18 히타치가세이가부시끼가이샤 접착제 조성물, 접속 구조체 및 그의 제조 방법
KR20250039505A (ko) 2018-01-17 2025-03-20 가부시끼가이샤 레조낙 접착제 조성물, 접속 구조체 및 그의 제조 방법
KR20220162734A (ko) 2020-04-10 2022-12-08 쇼와덴코머티리얼즈가부시끼가이샤 접착제 조성물, 접착제 필름, 접속 구조체 및 그 제조 방법

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