JPH1142648A5 - - Google Patents

Info

Publication number
JPH1142648A5
JPH1142648A5 JP1998140226A JP14022698A JPH1142648A5 JP H1142648 A5 JPH1142648 A5 JP H1142648A5 JP 1998140226 A JP1998140226 A JP 1998140226A JP 14022698 A JP14022698 A JP 14022698A JP H1142648 A5 JPH1142648 A5 JP H1142648A5
Authority
JP
Japan
Prior art keywords
substrate
substrate molding
base
molding die
die according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998140226A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1142648A (ja
JP3877870B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP14022698A priority Critical patent/JP3877870B2/ja
Priority claimed from JP14022698A external-priority patent/JP3877870B2/ja
Publication of JPH1142648A publication Critical patent/JPH1142648A/ja
Publication of JPH1142648A5 publication Critical patent/JPH1142648A5/ja
Application granted granted Critical
Publication of JP3877870B2 publication Critical patent/JP3877870B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP14022698A 1997-05-30 1998-05-21 基板成形金型、及び基板成形金型における成形基板の板厚調整方法 Expired - Fee Related JP3877870B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14022698A JP3877870B2 (ja) 1997-05-30 1998-05-21 基板成形金型、及び基板成形金型における成形基板の板厚調整方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP14265397 1997-05-30
JP9-142653 1997-05-30
JP14022698A JP3877870B2 (ja) 1997-05-30 1998-05-21 基板成形金型、及び基板成形金型における成形基板の板厚調整方法

Publications (3)

Publication Number Publication Date
JPH1142648A JPH1142648A (ja) 1999-02-16
JPH1142648A5 true JPH1142648A5 (enExample) 2005-09-08
JP3877870B2 JP3877870B2 (ja) 2007-02-07

Family

ID=26472823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14022698A Expired - Fee Related JP3877870B2 (ja) 1997-05-30 1998-05-21 基板成形金型、及び基板成形金型における成形基板の板厚調整方法

Country Status (1)

Country Link
JP (1) JP3877870B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HK1027253A2 (en) * 2000-07-31 2000-12-08 谢宁乐 Mould for injection moulding

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