JPH11354998A - Component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting device which can mount components with narrow mounting distances, while the completion precision of an object on which the components are mounted is maintained. SOLUTION: A component feeding unit 11 which feeds components P to be mounted, an XY table 12 which supports an object PB on which the components are mounted, a transfer means 13 which transfers the component from the component feeding unit to the predetermined position of the object by using a chuck nozzle 13b, a control unit 20 by which the component feeding unit, the XY table and the transfer means are controlled to drive, a component misalignment detecting means 15 which detects the misalignment (d) of the component from the chuck nozzle while the component is transferred by the transfer means, etc., are provided. If the misalignment (d) exceeds a predetermined value, the transfer means is controlled to drive and the component is discarded.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for transporting a component such as an electronic component and mounting it on an object such as a circuit board.

[0002]

2. Description of the Related Art Generally, components for surface mounting are supplied as component tapes 1 as shown in FIG. 5 or FIG. The component tape 1 includes a carrier tape 2 formed in a strip shape of paper or plastic and having a feed hole 2a formed along a side edge, a top tape 3 or a bottom tape 4 for covering the carrier tape 2. And a reel 5 for winding these. The components are filled one by one into a box-shaped section provided in the carrier tape 2, that is, a mounting hole 2b formed by a square hole or a mounting hole 2c formed by an emboss, and an open upper part is covered by a top tape 3; In the case of the mounting hole 2b, the open lower part is covered with the bottom tape 4 and the reel 5
It is supplied in a state of being wound around.

A component mounting apparatus using such a component tape 1 is configured, for example, as shown in FIG. In FIG. 7, the component mounting device 6 includes a component supply unit 7 for transporting components to be mounted, an XY table 8, a rotary head unit 9, and a component supply unit 7, an XY table 8, and a rotary head unit 9. And a control unit (not shown) for driving control. As shown in FIG. 8, the component feeder 7 has a set of parts feeders 7a arranged side by side for the required number of parts, and a left and right (ZA axis or (ZB axis).

The parts feeder 7a is provided on the carrier tape 2 of the parts tape 1 by a ratchet mechanism (not shown) by housing the parts tape 1 in a reel holder 7e and pressing a feed lever 7f as shown in FIG. The carrier tape 2 is fed out by the pitch dimension in which the components are arranged using the feed hole 2a as a guide. In addition to supplying the component to the component suction portion 7g, the component can be taken out by peeling off the top tape 3 of the component sent to the front end by the peeling mechanism 7k having the slit 7i and the shutter 7j shown in FIG. Then, as shown in FIG. 11, the peeled top tape 3 is wound around a winding portion 7h.

The XY table 8 has a circuit board PB on which components are to be mounted fixedly held at a predetermined position, and is driven along two horizontal axes (not shown) orthogonal to each other, ie, the X axis and the Y axis. Is configured. The rotary head unit 9 includes a plurality of, in the illustrated case, twelve component suction units 9a at equal angular intervals. The rotary head unit 9 sequentially rotates intermittently, so that each of the component suction units 9a is one by one. It is configured to shift.

Each of the component suction sections 9a has a plurality of suction nozzles 9b, in the illustrated case, five suction nozzles 9b. These suction nozzles 9b are connected to suction means such as a vacuum pump (not shown), and are configured to suction a component supplied from the component tape 1 to the nozzle tip by the suction force. Further, each of the component suction sections 9a is sequentially rotated from the component supply section 7 clockwise in FIG. 12 by the intermittent rotation of the rotary head section 9 to 12 stages, that is, S1, S2, S3,. .., S11 and S12. Here, among the stages, stage S1 is a suction stage, stage S4 is a component recognition stage, stage S6 is a rotation correction stage, stage S7 is a mounting stage, stage S9 is a component discarding stage, and stage S10 is a nozzle selection stage. I have.

[0007] According to the component mounting apparatus 6 configured as described above, when components are mounted on the circuit board PB, the following operations are performed. At the suction stage S1, the component supply unit 7
One component from one of the parts feeders 7a is sucked by the selected suction nozzle 9b of the component suction unit 9a. When the component suction unit 9a is moved to the component recognition stage S4 by the intermittent rotation of the rotary head unit 9, image processing of the component suction-held by the suction nozzle 9b of the component suction unit 9a is performed. By recognizing the pattern of the shape of the component and the position and direction of the component, the rotation correction angle and the XY correction value with respect to the predetermined position are obtained.

Subsequently, in the rotation correction stage S6, angle correction is performed by adjusting the rotation of the component suction section 9a itself based on the rotation correction angle. Further, at the mounting stage S7, XY correction is performed by XY adjustment of the XY table 8 based on the XY correction values, and the suction means (not shown) is stopped, so that the components are released from the suction nozzle 9b and the XY table is released. 8 is mounted on a predetermined position of the circuit board PB.

With the above operation, one component is mounted on the circuit board, and the intermittent rotation of the rotary head 9 causes the component suction unit 9a to move the component discarding stage S9.
Is moved to the component suction unit 9 for some reason.
If a component remains in the suction nozzle 9b of a, the suction nozzle 9b releases and discards the component. And
When the component suction unit 9a is moved to the nozzle selection stage S10, the suction nozzle 9 suitable for the next component to be mounted is set.
b is selected. Subsequently, the component suction section 9a is moved to the suction stage S1, whereby the component is sucked again.

In this way, each component suction unit 9a sequentially suctions and holds the component to the suction nozzle 9b selected in the suction stage S1 based on the mounting data set in advance, and the mounting stage S7 By releasing and mounting the components at predetermined positions on the circuit board PB on the XY table 8,
The mounting of the parts is repeated. After the last component is mounted on the circuit board PB, the circuit board PB on the XY table 8 is transported to the next step by a transport mechanism (not shown), and the next circuit board PB is placed on the XY table 8. It will be transported. Thus, the circuit board P
Component mounting on B is performed.

[0011]

The components mounted by the component mounting device 6 are, for example, at least about 1 mm × 0.5 mm, and the minimum of mounting these components on the circuit board PB is the minimum. The interval is, for example, 0.5
mm. Therefore, when the suction nozzle 9 b of the component suction unit 9 a of the rotary head unit 9 suctions the component by the component supply unit 7, a positional shift may occur. For this reason, in order to cope with a further increase in the density of the circuit board PB, if the minimum interval of component mounting is to be further reduced, when the suction nozzle 9b moves to a predetermined position on the circuit board PB,
It may interfere with components already mounted on the circuit board PB.

For example, as shown in FIGS. 13 and 14, two lands P provided side by side on a circuit board PB are provided.
When mounting components P1 and P2 on B1 and PB2, respectively, first mount component P1 on land PB1, and then mount component P2 on land PB2.
Depending on the suction state of the component P2, the suction nozzle 9b may interfere with the already mounted component P1, or the component P2 may interfere with the component P1. Therefore, the interference between the suction nozzle 9b or the component P2 and the already mounted component P1 will eventually hinder the completion accuracy of the circuit board PB. For this reason, it has been difficult to narrow the mounting interval of the components of the circuit board while maintaining the completion accuracy of the circuit board PB.

SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to provide a component mounting apparatus capable of narrowing a component mounting interval while maintaining the completion accuracy of an object on which a component is mounted.

[0014]

According to the present invention, there is provided a component supply unit for supplying a component to be mounted, an XY table for supporting an object to which the component is mounted, and a component supply unit. Moving means for conveying and mounting the component at a predetermined position on the object by means of a suction nozzle, a control unit for controlling the drive of the component supply unit, the XY table and the moving means, and during transport of the component by the moving means A component displacement detection unit that detects a displacement of the component with respect to the suction nozzle, wherein the control unit controls the moving unit when the displacement is equal to or more than a predetermined amount. This is achieved by controlling the drive and discarding the part.

According to the above construction, when the component is mounted, the component to be mounted is transported from the component supply section toward the predetermined position on the object by the moving means, and during this transport, the component position determining means is used. The displacement of the component with respect to the suction nozzle is detected. Based on the detected position shift, the control unit, when the position shift is less than a predetermined amount arbitrarily set, drives and controls the moving means to move the part to a predetermined position on the object. It is transported toward and mounted on a predetermined position on the object. On the other hand, when the displacement is equal to or more than the predetermined amount, the control unit
The driving means is driven and discarded without mounting the component. Thus, if the suction nozzle protrudes greatly from the edge of the component, the component is not mounted, and the component sucked by the suction nozzle or the component sucked by the suction nozzle and another component already mounted on the target object are removed. The interference with the data is avoided. Therefore, even if the component mounting interval of the target object is narrowed, the component to be mounted is surely mounted at a predetermined position on the target object, maintaining the completion accuracy of the target object and mounting the component on the target object. Higher density is possible.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention,
Although various technically preferable limits are given, the scope of the present invention is not limited to these embodiments unless otherwise specified in the following description.

FIG. 1 shows an embodiment of a component mounting apparatus according to the present invention. In FIG. 1, a component mounting device 10
A component supply unit 11 for transporting a component to be mounted;
It includes an XY table 12, a rotary head unit 13, and a control unit 20 for controlling the drive of the component supply unit 11, the XY table 12, and the rotary head unit 13. The component supply unit 11 includes the part feeders 7a shown in FIG.
It is configured to be movable in the A-axis or ZB-axis direction.

The XY table 12 has a circuit board PB on which components are to be mounted fixedly held at a predetermined position, and is driven along two horizontal axes (not shown) orthogonal to each other, ie, the X axis and the Y axis. Is configured. The rotary head unit 13 includes a plurality of, in the illustrated case, twelve component suction units 1.
3a are provided at equal angular intervals, and the rotary head 13
Are sequentially intermittently rotated, so that each component suction portion 13a
Are shifted one by one. Each of the component suction sections 13a includes a plurality of suction nozzles 13b, in the illustrated example, five suction nozzles 13b. These suction nozzles 13b are
It is connected to suction means such as a vacuum pump (not shown),
The component supplied by the component supply unit 11 is sucked to the nozzle tip by the suction force.

Further, each of the component suction sections 13a is sequentially rotated from the component supply section 7 clockwise by 12 stages, ie, S1, S2, S3,. ., S11 and S12. Here, of each stage,
Stage S1 is a suction stage, stage S4 is a component recognition stage, stage S6 is a rotation correction stage, stage S7 is a mounting stage, stage S9 is a component discarding stage, and stage S10 is a nozzle selection stage.

The control unit 20 controls the driving of the component supply unit 11, the XY table 12, and the rotary head unit 13 based on preset mounting data, that is, data indicating the order of components to be mounted. The component is sucked from the component supply unit 11 by the selected suction nozzle 13b of the component suction unit 13a of the rotary head unit 13, and is fixed and held on the XY table 12 by the relative movement between the XY table 12 and the rotary head unit 13. The circuit board PB is configured to be transported to a predetermined position and mounted.

The above configuration is almost the same as that of the conventional component mounting apparatus 1 shown in FIG. 5 or FIG. 10, but in the component mounting apparatus 10 according to the present embodiment, the component recognition stage S4 is the same as that of FIG. As shown in FIG.
The image pickup device 15 includes a CD camera or the like. The component P sucked and held by the suction nozzle 13 b by the image pickup device 15, the image processing board 16 and the CPU board 17 in the control unit 20 connected to the image pickup device 15. Is performed, and the shape of the component P is pattern-recognized.

The component mounting apparatus 10 according to the present embodiment is configured as described above. When the component P is mounted on the circuit board PB, the control unit 20 controls the driving of the XY table 12 and the rotary head unit 13. Thus, the components are mounted as described below. That is, the suction stage S
At 1, the first component P is sucked from one of the parts feeders (not shown) of the component supply unit 11 to the selected suction nozzle 13b of the component suction unit 13a.

Then, the component suction section 13a is rotated by the intermittent rotation of the rotary head section 13 so that the component recognition stage S4
Is moved by the imaging means 15 to the component suction unit 1.
The component P sucked and held by the suction nozzle 13b of 3a is imaged. Then, as shown in the flowchart of FIG.
The image processing board 16 receives the data of the component P from the CPU board 17 (step S1), receives the image data, performs image processing, and recognizes the shape of the component P as a pattern (step S2). The image processing board 16 compares the data of the component P with the shape of the component P to determine whether they are the same (step S3), and if they are the same, transmits the center coordinates of the component P to the CPU board 17 (step S4). ). Then, when the suction means (not shown) stops at the mounting stage S7, the component P is released from the suction nozzle 13b and mounted on a predetermined position of the circuit board PB on the XY table 12.

On the other hand, when the data of the part P and the shape of the part P are different, the image processing board 16
The data is transmitted to the board 17 (step S5). Then, by determining the position and the direction of the component P, a rotation correction angle and an XY correction value with respect to a predetermined position, for example, as shown in FIG. The protrusion amount d of 13b is obtained. If the protruding amount d is smaller than the preset position deviation determination amount, the rotation correction stage S6 performs angle correction by adjusting the rotation of the component suction unit 13a itself based on the rotation correction angle. . Then, on the mounting stage S7, the XY table 12
The XY correction is performed by the adjustment, and the suction means (not shown) is stopped, so that the components are released from the suction nozzle 13b and mounted on the XY table 12 at a predetermined position of the circuit board PB.

With the above operation, one component P is mounted on the circuit board PB, and the component suction portion 13a is moved to the nozzle selection stage S10 by the intermittent rotation of the rotary head portion 13. The suction nozzle 13b suitable for the component to be mounted is selected. Subsequently, the component suction section 13a is moved to the suction stage S1, whereby the components are suctioned again.

On the other hand, if the protruding amount d exceeds the preset positional deviation determination amount, the rotation correction stage S6 and the mounting stage S7 respectively perform rotation correction and component mounting for the component suction portion 13a. Do not do. Then, when the component suction unit 13a is moved to the component discarding stage S9, the suction nozzle 13b of the component suction unit 13a releases the component P and discards it. In addition, the component P discarded as having a poor suction in this way is suction-held again in the suction stage S1.

In this manner, each component suction portion 13a
Based on the mounting data set in advance, the components are sequentially sucked and held by the suction nozzles 13b selected by the suction stage S1, and the components are placed at predetermined positions of the circuit board PB on the XY table 12 by the mounting stage S7. By releasing and mounting, the mounting of components is repeated. After the last component is mounted on the circuit board PB, the XY table 1
The circuit board PB on 2 is transported to the next step by a transport mechanism (not shown), and the next circuit board PB is transported onto the XY table 12, and components are sequentially mounted on the circuit board PB.

In the above-described embodiment, the rotary head is used as a moving means for transporting components from the component supply unit to a predetermined position on the circuit board.
However, the present invention is not limited to this, and the present invention can be applied to a moving unit having another configuration as long as it is a moving unit that sucks a component by a suction head.

[0029]

As described above, according to the present invention, the component mounting interval can be reduced while maintaining the completion accuracy of the object on which the component is mounted.

[Brief description of the drawings]

FIG. 1 is a schematic view showing an embodiment of a component mounting apparatus according to the present invention.

FIG. 2 is a schematic diagram illustrating an example of an imaging device of the component mounting device of FIG. 1;

FIG. 3 is a flowchart illustrating an operation example of the imaging apparatus of FIG. 2;

FIG. 4 is a schematic view showing a component suction state of a suction nozzle by the component mounting apparatus of FIG. 1;

FIG. 5 is a schematic perspective view showing an example of a conventional component tape.

FIG. 6 is a schematic perspective view showing another example of a conventional component tape.

FIG. 7 is an exploded perspective view showing an example of a conventional component mounting apparatus.

8 is a schematic perspective view of a component supply unit in the component mounting device of FIG.

FIG. 9 is a schematic perspective view showing a configuration of a parts feeder used in the parts supply unit of FIG.

FIG. 10 is a partially enlarged perspective view showing a top tape peeling mechanism in the parts feeder of FIG. 9;

11 is a schematic perspective view showing a state when a component tape is set in the parts feeder of FIG. 9;

FIG. 12 is a schematic diagram schematically showing the configuration of the component mounting apparatus of FIG. 7;

13 is a schematic diagram illustrating an example of a component suction state by a suction nozzle of the component mounting apparatus of FIG. 12;

FIG. 14 is a schematic diagram showing another example of a component suction state by a suction nozzle of the component mounting apparatus of FIG. 12;

[Explanation of symbols]

10: Component mounting device, 11: Component supply unit, 12
... XY table, 13 ... Rotary head part, 1
3a: a component suction unit; 13b: a suction nozzle;
... lens tube, 15 ... imaging means, 16 ... image processing board, 17 ... CPU board, 20 ... control unit,
S1: suction stage, S4: component recognition stage, S6: rotation correction stage, S7: mounting stage, S9: component disposal stage, S10: nozzle selection stage, PB ... Circuit board, d: protrusion amount (position shift), D: diameter of suction nozzle

Claims (3)

[Claims] A component supply unit for supplying a component to be mounted; an XY table for supporting an object on which the component is mounted; and a suction nozzle for holding the component at a predetermined position on the object from the component supply unit. A moving unit for carrying and mounting; a control unit for controlling the drive of the component supply unit, the XY table and the moving unit; and detecting a displacement of the component with respect to the suction nozzle while the component is being conveyed by the moving unit. A component mounting apparatus comprising: a component displacement detection unit, wherein the control unit, when the displacement is equal to or more than a predetermined amount, drives and controls the moving unit to discard the component. Component mounting equipment. 2. The component mounting apparatus according to claim 1, wherein the predetermined amount of the displacement can be set arbitrarily. 3. The component mounting apparatus according to claim 1, wherein said component position deviation detecting means is an imaging means for determining a position and a direction of said component with respect to said suction nozzle.