JPH11353433A - Checking device and method for non-contacting type ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To confirm the operation/function in a base sheet state for reducing the useless consumption of a card member by deciding the quality of an IC module, etc., based on the results of read/write communicating operations which are carried out with no contact for each inlet. SOLUTION: A detection head part 7 moves onto a communication object inlet 3 by an instruction of a controller 13, and an operation/function confirming instruction of the inlet 3 is sent to a reading/writing device 8 from the controller 13. Based on this instruction, the device 8 transmits a read or write signal to the part 7. This transmitted signal is connected to an antenna or a coil of the inlet 3 via the part 7 in terms of an electromagnetic or magnetic field, and the information stored in the inlet 3 and the write information of the device 8 communicate with the inlet 3. Then the device 8 judges a normal inlet and an abnormal inlet if the communication processing is carried out in the normal and abnormal ways respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a non-contact type information medium,
For more information, see Office Automation
n, so-called OA), factory automation (Fa
ctory Automat-ion (FA), or technology related to the production of non-contact IC cards used in the field of security, etc., where products with defective IC modules are mixed in the manufactured non-contact IC cards The present invention relates to a technique for preventing the occurrence of trouble caused by dripping or a defective inlet.

[0002]

2. Description of the Related Art In recent years, with the advent of a non-contact IC card incorporating a semiconductor memory or the like, the storage capacity has been dramatically increased as compared with a conventional magnetic card, and the card can be inserted into a slot of a read / write device. It became unnecessary and convenience was improved. A non-contact IC card is provided with a field of vibration energy such as a high-frequency electromagnetic field, ultrasonic waves, and light in a space, and absorbs and rectifies the energy to form a DC power source for driving an electronic circuit built in the card. Use the frequency of the AC component of the field as it is, or multiply or divide it as an identification signal, and transmit this identification signal to an information processing circuit of a semiconductor element via a non-contact transmission element such as an antenna or a coil or a capacitor. Is what you do. The terms antenna and coil used in the present specification have the following meanings. The former is an element that performs communication by radio waves, and its shape and material can be arbitrarily designed in accordance with standards and applications. The latter is an element that performs communication by a magnetic field, and is a device in which a conductive wire or a conductor pattern is wound in a so-called coil shape.

[0003] In particular, many non-contact IC cards for the purpose of authentication and simple counting data processing often use a battery and a CPU (Cent.
ral Processing Unit. Radio authentication (Radio Frequency IDentifica) of hard logic without central processing unit
tion. Hereinafter, this is simply referred to as RF-ID).
With the advent of this non-contact IC card, the security against forgery and tampering is increased as compared with the magnetic card, and when the card is passed through the gate, the card carrier should approach the communication function unit of the read / write device attached to the gate device. ,
All that is necessary is to touch the communication function section of the reading / writing device with the card carried, and the complexity for data communication of removing the card from the case and inserting the card into the slot of the reading / writing device has been reduced.

A non-contact IC card is an ISO (Intern
International Organization for Standar-disation). Generally, an IC card has an IC module such as a semiconductor memory and an antenna or a coil as a non-contact transmission element in a card body made of plastic or the like. Built-in. Then, an electromagnetic field or an AC magnetic field radiated from the communication function unit of the read / write device is detected by an antenna or a coil inside the card, and coupled to each other to exchange data with the read / write device.

[0005] Generally, the above-mentioned non-contact IC card is manufactured as follows. An antenna or coil made of metal foil for non-contact transmission is formed on the card base sheet by etching, and a pattern portion for connecting to an IC module is provided at an end of the antenna or coil. Then, the connection portion of the IC module to the antenna or coil is connected to the pattern portion by soldering or using a conductive adhesive or the like, and serves as a non-contact IC card inlet. In some cases, an IC chip is directly connected to a connection portion with an antenna or a coil to form an inlet. After that, the card base sheet on which the IC module is mounted and the inlet is formed is sandwiched between the front and back sheets and laminated to produce a card body.
Further, in order to increase the adhesive strength of the front and back sheets, a method of laminating while applying an adhesive to the front and back sheets may be considered. In addition, there is also a method of manufacturing a card body by sealing the inlet-formed card base sheet by injection (injection molding). As the non-contact transmission antenna or coil, it is conceivable to form the antenna or coil with a conductive wire provided with an insulating film in addition to the antenna or coil made of metal foil. Further, in order to manufacture a plurality of non-contact IC cards in the same process, and to improve the manufacturing efficiency, an antenna or a coil or an insulating material by etching a metal foil on a card base sheet having a size in which a plurality of inlets can be arranged and arranged. An antenna or a coil formed by a coated wire is arranged and arranged, an IC module is mounted on each antenna or a coil end portion, and a card base sheet constituting a plurality of inlets is formed. A method of manufacturing a card body by cutting it into a predetermined size after sandwiching and laminating it, is also introduced in JP-A-62-127290.

[0006] The non-contact IC card manufactured in this way utilizes a non-contact IC card read / write device in order to confirm the operation and function after completion, and is disclosed in, for example, JP-A-9-102221. The inspection device using such a communication device performs a final inspection in the non-contact IC card manufacturing process, and detects a malfunctioning or malfunctioning card.

[0007]

However, in such an inspection apparatus, since the inspection is performed after the completion of the card in the non-contact IC card manufacturing process, there is a connection failure in the connection between the IC module and the antenna or the coil. Or
Even when a defective IC module is mixed, card production is performed as usual, and the result is that the card is determined to be defective only after the card is completed. Therefore, members constituting the non-contact IC card, for example, a card base sheet forming an antenna or a coil, front and back sheets sandwiching the card base sheet, and the like are wasted, and the manufacturing cost is affected. In addition, the sorting operation after the completion of the card increases, and there is a risk that defective products are mixed due to a sorting error. Therefore, it is not very desirable in quality control. Therefore, before carding, that is, it is necessary to check the operation and function of a card base sheet in which a plurality of inlets in which an IC module and an antenna or a coil are integrated are arranged and arranged.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems. The present invention has been made to solve the above-mentioned problems. Even if there is a mixture, the operation and function can be checked in the state of a card base sheet in which a plurality of inlets before the carding process are arranged and aligned, preventing the production of defective cards and consuming unnecessary card members. It is an object of the present invention to provide an inspection apparatus and an inspection method that can reduce the risk of mixing in defective products after completion of the card and improve the quality, and can satisfy these requirements. And

[0009]

Means provided by the present invention to solve the above-mentioned problems are as follows: first, an IC module having a semiconductor IC chip and a non-contact transmission element as a non-contact transmission element. A plurality of non-contact IC card inlets each having an antenna or a coil integrated therewith are read and written in a non-contact manner with respect to each of the plurality of non-contact IC card inlets on a card base sheet arranged on a base sheet. A communication unit for inspection that performs a communication operation of (1) and a read / write determination processing unit for inspection that performs reading and writing via the communication unit for inspection and determines whether the IC module or the like is a normal product or a defective product based on the result. A non-contact IC card inspection device characterized by comprising: ADVANTAGE OF THE INVENTION According to this invention, in the manufacturing process of a non-contact IC card, even if connection failure of the connection part of an IC module and an antenna or a coil or mixing of a defective IC module occur, a plurality of inlets before a carding process are aligned. Since the operation and function are confirmed in the state of the arranged card base sheet, defective card production can be prevented, and wasteful card member consumption can be suppressed.

[0010] Preferably, as described in claim 2, the basic structure of claim 1 is provided, and in particular, the inspection communication means is one of the non-contact IC card inlets during a communication operation. A detection head unit equipped with a small antenna or a small coil having a communication area that does not receive interference from other inlets other than the inlet, and a non-contact IC card inlet provided on the base sheet, which will be inspected from now on A non-contact IC card inlet, a detection head unit moving device for moving the detection head unit, the detection head unit is communicably connected to the inspection read / write determination processing means, It is characterized by. ADVANTAGE OF THE INVENTION According to this invention, since the operation | movement and function of each inlet part can be confirmed reliably one by one, the reliability of an inspection improves.

More preferably, as described in claim 3, the device according to claim 1 has a basic configuration.
The inspection communication means includes a plurality of detection heads mounted with a small antenna or a small coil having a communication area that does not receive interference from other inlets other than those during the communication operation among the non-contact IC card inlets. Section, and each detection head section has a non-contact I on the base sheet.
The detection head units are individually arranged at positions corresponding to the C card inlets, and each detection head unit is communicably connected to the inspection read / write determination processing unit via a detection head switching device. A non-contact IC card inlet to be inspected is selected using a selection function of the apparatus, and then a communication operation with the non-contact IC card inlet is performed. According to the present invention, the operation and the function are confirmed by reliably and electrically switching each of the inlet portions, so that the reliability and speed of the inspection are improved.

According to a fourth aspect of the present invention, the apparatus according to any one of the first to third aspects has a basic configuration. In particular, the semiconductor IC chip is provided in either a non-contact IC card or a contact IC card. Is also a semiconductor IC chip having a function that can be used. The present invention can be suitably used even in the case of a semiconductor IC chip having a function compatible with both a non-contact IC card and a contact IC card.

According to another aspect of the present invention, a semiconductor IC is provided.
Non-contact IC in which an IC module having a chip and an antenna or a coil as a non-contact transmission element are integrated
Before entering a card forming step in which a plurality of C card inlets are arranged and arranged on the base sheet, the front and back surfaces of the card base sheet are covered with the sheet. A communication operation is performed for each non-contact IC card inlet in the state described above, and the operation of the IC module or the like is confirmed and inspected. ADVANTAGE OF THE INVENTION According to this invention, in the manufacturing process of a non-contact IC card, even if connection failure of the connection part of an IC module and an antenna or a coil or mixing of a defective IC module occur, a plurality of inlets before a carding process are aligned. Since the operation and function are confirmed in the state of the arranged card base sheet, defective card production can be prevented, and wasteful card member consumption can be suppressed.

According to a sixth aspect of the present invention, the inspection method according to the fifth aspect has a basic structure. In particular, when a communication operation is performed for each contactless IC card inlet, other than the inlet during the communication operation. Communication is performed using a small antenna or a small coil having a communication area that does not receive interference from the inlet. ADVANTAGE OF THE INVENTION According to this invention, since the operation | movement and function of each inlet part can be confirmed reliably one by one, the reliability of an inspection improves.

According to a seventh aspect of the present invention, the inspection method according to the sixth aspect has a basic configuration. In particular, when the communication operation is performed for each non-contact IC card inlet, the small antenna or the small coil is provided. A plurality of detection heads are prepared, and each of the detection heads is individually arranged at a position corresponding to each non-contact IC card inlet on the base sheet, and the detection head performing a communication operation is selectively switched. Thus, a plurality of non-contact IC card inlets are sequentially inspected. According to the present invention, the operation and the function are confirmed by reliably and electrically switching each of the inlet portions, so that the reliability and speed of the inspection are improved.

Then, as set forth in claim 8, the inspection method according to any one of claims 5 to 7 has a basic configuration,
In particular, the semiconductor IC chip is characterized in that it is a semiconductor IC chip having a function of supporting both a non-contact IC card and a contact IC card. Non-contact IC
The present invention can be suitably used even in the case of a semiconductor IC chip having a function compatible with both a card and a contact IC card.

[0017]

Embodiments of the present invention will be described below. FIG. 4 shows a non-contact IC module 1 and a non-contact transmission element 2 for improving the manufacturing efficiency of the non-contact IC card.
FIG. 2 is a diagram showing an outline of a non-contact IC card in which a card base sheet 4 in which a plurality of inlets 3 formed integrally with each other are arranged and arranged between a top sheet 5 and a back sheet 6 and laminated. The non-contact transmission element 2 has a metal foil antenna or coil for non-contact transmission formed on the card base sheet 4 by etching, and a pattern for connecting to the IC module 1 is provided at the end of the antenna or coil. A part is provided. Then, the connection portion of the IC module with the antenna or the coil is connected to the pattern portion using soldering or a conductive adhesive,
Inlet for non-contact IC card. In some cases, the IC chip is directly connected to a connection portion with an antenna or a coil to form the inlet 3.

As the non-contact transmission element 2, it is conceivable that an antenna or a coil is formed by a conductive wire provided with an insulating film in addition to an antenna or a coil made of a metal foil. Also,
In order to increase the adhesive strength of the front and back sheets 5 and 6, there is also a method of laminating while applying an adhesive to the front and back sheets 5 and 6. Then, after the laminating process, it is cut by die cutting or the like so as to have a predetermined card size, and finally a non-contact IC card is obtained. In addition to the laminating method, there is also a method in which the card base sheet 4 constituting the inlet 3 is sealed by an injection molding method, and the card body is manufactured by cutting such as die cutting.

Thereafter, the completed non-contact IC card 9
In order to confirm the operation and function of the non-contact IC, a read / write device 8 and a communication function unit 10 for the read / write device as shown in FIG.
It was a general method to inspect each card 9 one by one.

In the present invention, as shown in the schematic configuration diagram of the inspection apparatus for a non-contact IC card in FIG. 1, before the laminating process, the connection failure between the IC module and the antenna or the coil, the disconnection or short-circuit of the antenna or the coil. , IC
There is a feature in the inspection and the inspection means for the purpose of finding a defect or the like of the module itself. In FIG. 1, 1 is I
C module, 2 non-contact communication means, 3 inlet integrated IC module and antenna or coil,
Reference numeral 4 denotes a card base sheet in which a plurality of inlets are arranged and arranged, 7 denotes a detection head unit equipped with a small antenna or a small coil having a communication area that does not interfere with other inlets, 8 denotes a read / write device, and 13 denotes a personal computer. And so on.

The communication means for inspection used in the detection head unit 7 uses a relatively small antenna or coil as compared with the communication function unit 10 for the conventional read / write device, so that the communication area can be narrowed. it can. Therefore, when it is located near the center of the communication target inlet, it communicates only with the target inlet and does not interfere with other adjacent inlets. If the conventional read / write device communication function unit 10
In the case where is used, since the communication area is relatively large, an adjacent inlet other than the communication target inlet also reacts, causing interference and making communication impossible. Also,
Even in a read / write device capable of communicating with several non-contact IC cards in the same communication area, communication processing is performed for each card in the order of arrival, so even in this case, the target inlet and the peripheral inlet are sequentially processed. , The position of the target inlet cannot be specified.

Therefore, in order to avoid this phenomenon, it is necessary to widen the interval between the inlets so as not to affect each other. However, this means that the size of the card base sheet 4 is increased, which leads to a decrease in productivity and an increase in cost. In the present invention, since the detection head unit 7 is equipped with a small antenna or a small coil having a communication area which is not affected by interference of the adjacent inlet, the inlet interval on the card base sheet can be made relatively narrow. Is very economical.

Then, communication processing is performed with the communication target inlet, an operation / function check is performed, and if a result is obtained,
The detection head moves to the center of the adjacent inlet, starts communication processing again, and performs an operation / function test. In this way, the inspection head unit 7 moves sequentially between the inlets, and the operation and function are confirmed in the card base sheet shape before entering the card forming step of covering the front and back sheets, whereby the IC module failure , Antenna or coil failure,
A connection failure between the module and the antenna or coil can be found.

[0024]

FIG. 2 is a schematic diagram showing an embodiment of a non-contact IC card inspection apparatus according to the present invention. In FIG. 2, 1 is an IC module, 2 is a non-contact transmission element, 3 is I
C is an inlet in which a module and an antenna or a coil are integrated, 4 is a card base sheet in which a plurality of inlets are arranged and arranged, 7 is a small antenna or a small coil having a communication area that does not receive interference from other inlets. A detection head unit mounted, 8 is a read / write device, 11 is a detection head transport device that holds the detection head unit 7 and enables the detection head unit 7 to be moved to an arbitrary position on the surface of the card base sheet 4, and 12 is a detection unit A transport device controller 13 for controlling the position of the head transport device is constituted by a controller such as a personal computer for controlling the read / write device 8 and the transport device controller 12. In FIG. 2, although the detection head 7 is configured to move above the card base sheet 4,
It is good also as an arrangement composition which moves below.

The detection head unit 7 equipped with a small antenna or a small coil having a communication area that does not receive interference from the inlet adjacent to the communication target inlet is attached to the detection head transport device 11, and in accordance with an instruction from the controller 13, It can be arbitrarily moved to the center of the inlet on the card base sheet 4 via the transport device control unit 12. First, the detection head unit 7 moves over the communication target inlet according to an instruction from the controller 13, and then an instruction to confirm the operation and function of the inlet is sent from the controller 13 to the read / write device 8. The read / write device 8 sends a read signal or a write signal to the detection head unit 7 according to the instruction. The signal is electromagnetically or magnetically coupled to the antenna or coil of the communication target inlet via the detection head unit 7, and information in the communication target inlet is transmitted to the read / write device 8 or write information of the read / write device 8 is transmitted. Communication processing is performed with the target inlet.

If this communication process is performed in a predetermined manner, it is determined that the inlet is normal, and if communication is not possible or the communication process scheduled for the office is not performed, the read / write device 8 determines that the inlet is abnormal. Then, these information and the information inside the inlet are sent to the controller 13, and
The controller 13 operates to display the inspection result information on a display based on this information and to control an external device (not shown). When the operation and function of any communication target inlet have been confirmed and inspected in this way, the controller 13 sends an instruction to move to the next inlet to the transport device controller 12 and the detection head 7
Moves to the center of the next inspection target inlet, the same communication processing is performed again, and the operation and function of the inlet are confirmed and inspected. In this way, by sequentially moving the detection head unit 7 between the inlets by mechanical control and inspecting, it is possible to confirm the operation and function in a card base sheet state in which a plurality of inlets before the carding process are arranged and arranged. Become. Further, in the inspection apparatus of the present invention, if the card base sheet has a size within a range in which the detection head unit 7 can be moved, any inlet can be changed by a simple change of the position control program without depending on the arrangement of the inlets. Even a card base sheet having an arrangement configuration can be used without greatly changing the apparatus.

Next, another embodiment of the non-contact IC card inspection apparatus according to the present invention will be described with reference to FIG. In FIG. 3, reference numeral 1 denotes an IC module, 2 denotes a non-contact transmission element, 3 denotes an inlet in which an IC module and an antenna or a coil are integrated, 4 denotes a card base sheet in which a plurality of inlets are arranged and arranged, 7 denotes A detection head unit equipped with a small antenna or a small coil having a communication area that does not receive interference from other inlets, 8 is a read / write device, and 14 is a detection head switching device for electrically switching a plurality of detection head units 7. , 13 are constituted by a controller such as a personal computer for controlling the read / write device 8 and the detection head switching device 14. The plurality of detection heads 7 are respectively installed at positions corresponding to the center of each inlet. In FIG. 3, the plurality of detection heads 7 are arranged on the upper side of the card base sheet 4, but may be arranged on the lower side.

One of the plurality of detection heads 7 is connected to the read / write device 8 by the detection head switching device 14 in accordance with an instruction from the controller 13, and the inlet 3 and the read / write device 8 corresponding to the detection head 7 are connected to each other. Communication takes place between them. First, the detection head switching device 14 is operated by the instruction of the controller 13 to select the detection head unit 7 located at the communication target inlet, and is connected to the read / write device 8. Next, an instruction for confirming the operation and function of the inlet is sent from the controller 13 to the read / write device 8. The read / write device 8 sends a read signal or a write signal to the detection head unit 7 selectively connected in accordance with the instruction. The signal is electromagnetically or magnetically coupled to the antenna or coil of the communication target inlet via the detection head unit 7, and information in the communication target inlet is transmitted to the read / write device 8 or write information of the read / write device 8 is transmitted. Communication processing is performed with the target inlet.

As in the embodiment shown in FIG. 2, if this communication processing is performed in a predetermined manner, it is determined that the communication is normal. If communication is impossible or communication processing originally planned is not performed, an abnormal inlet is read and written. The device 8 makes a decision. Then, these information and the information inside the inlet are sent to the controller 13, and the controller 13 operates to display the inspection result information on the display based on the information and to control an external device (not shown). .

When the operation and function of an arbitrary communication target inlet have been confirmed and inspected in this manner, the controller 13 sends an instruction to change the connection to the next inlet to the detection head switching device 14, and The detection head unit 7 is connected to a read / write device 8. Then, the same communication processing is performed again, and the operation and function of the inlet are confirmed and inspected. In this way, the plurality of detection head units 7 are electrically and selectively switched between the inlets and inspected by the operation of the detection head switching device 14, and the inspection is performed.
The operation and function can be checked in a card base sheet state in which a plurality of inlets before the carding process are arranged and arranged.
Since the operation and function are confirmed by reliably and electrically switching the respective inlets one by one, the reliability and speed of the inspection are improved.

In the inspection apparatus according to the present invention, if the number of the detecting heads 7 is equal to the number of the inlets on the card base sheet, the number of the detecting heads 7 is set at the center of each inlet independently of the arrangement of the inlets. By simply changing the installation of the detection head unit 7 at the corresponding position and simply changing the switching control program, it is possible to handle card base sheets having any inlet arrangement without greatly changing the apparatus. Also, the embodiment of FIG. 2 and FIG.
For example, a configuration may be employed in which a small area, for example, only one row is used as electrical switching means, and movement between rows is used as mechanical moving means.

[0032]

According to the present invention as described in detail above, IC module failure, antenna or coil failure,
Since a defective connection between the IC module and the antenna or the coil can be found before carding, manufacturing of a defective card can be prevented and useless consumption of card members can be suppressed. In addition, the work of selecting defective cards after completion of the card is not required, and the risk of defective products being mixed due to an operation error is reduced, and troubles can be prevented.

For communication with each of the inlets, a detection head unit equipped with a small antenna or a small coil having a communication area small enough not to be interfered by the inlet adjacent to the communication target inlet is used. There is no danger of communication failure or interference as in the case of using the read / write device communication function unit. Further, in the present invention, it is not necessary to increase the size of the card base sheet in order to avoid the problem in the case of using the conventional communication function unit for a read / write device, and it is very economical. Then, by sequentially moving the detection head portion mechanically between the central portions of the inlets for inspection, each of the inlets is surely operated one by one.
Since the function is confirmed, the reliability of the inspection in the state of the card base sheet is improved.

As another means, a plurality of detection heads are used and arranged at positions corresponding to the center portions of the respective inlets, and one of them is connected to the read / write device by the operation of the detection head switching device. Communication is performed between the inlet corresponding to the detection head unit and the read / write device, and in the inspection method, since each of the inlets is reliably switched electrically one by one to confirm the operation and function, the reliability and reliability of the inspection are improved. Speed is improved. Therefore, by using the above-mentioned means, it is possible to confirm the operation and function in a card base sheet state in which a plurality of inlets before the carding step are arranged and arranged.

After all, according to the present invention, the inlet before the card-forming step is formed even when the connection between the IC module and the antenna or the coil is defective or the defective IC module is mixed in the card manufacturing process. Operation and operation in the state of multiple card base sheet
The function can be checked, preventing the production of defective cards, reducing the consumption of wasteful card members, suppressing the increase in production cost, and reducing the risk of defective products after card completion. It is possible to provide an inspection apparatus and an inspection method that can reduce the quality and improve the quality and satisfy the above requirements.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a non-contact IC card inspection apparatus according to the present invention.

FIG. 2 is a schematic configuration diagram showing an embodiment of a non-contact IC card inspection apparatus according to the present invention.

FIG. 3 is a schematic configuration diagram showing another embodiment of the non-contact IC card inspection apparatus according to the present invention.

FIG. 4 is a diagram showing a schematic configuration of a non-contact IC card.

FIG. 5 is a diagram showing a schematic configuration of a conventional non-contact IC card inspection apparatus.

[Explanation of symbols]

 1 IC module 2 Non-contact transmission element 3 Inlet 4 Card base sheet 5 Top sheet 6 Back sheet 7 Detecting head unit 8... Read / write device 9... Non-contact IC card 10. 14 ... Detection head switching device

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazuo Kobayashi Letterpress Printing Co., Ltd., 1-1-1, Taito, Taito-ku, Tokyo

Claims (8)

[Claims] A plurality of non-contact IC card inlets each comprising an integrated IC module having a semiconductor IC chip and an antenna or coil as a non-contact transmission element are arranged and arranged on a base sheet. An inspection communication means for performing a read / write communication operation in a non-contact manner with respect to a certain card base sheet for each of the non-contact IC card inlets; and a read / write operation via the inspection communication means. A non-contact IC card inspection apparatus, comprising: an inspection read / write judgment processing means for judging whether the product is a normal product or a defective product. 2. The communication means for inspection includes a small antenna or a small coil having a communication area of such a degree as not to be interfered by any other of the non-contact IC card inlets other than the communication operation inlet. A detection head unit, and a detection head unit moving device that moves the detection head unit to any non-contact IC card inlet to be inspected from among the non-contact IC card inlets provided on the base sheet. The inspection apparatus for a non-contact IC card according to claim 1, wherein the detection head unit is communicably connected to the read / write determination processing unit for inspection. 3. The inspection communication means includes a small antenna or a small coil having a communication area of such a degree as not to be interfered by any other of the non-contact IC card inlets other than the one during the communication operation. Wherein each of the detection heads is individually arranged at a position corresponding to each of the non-contact IC card inlets on the base sheet, and each of the detection heads is a detection head. A non-contact IC card inlet to be inspected by selecting a non-contact IC card inlet to be inspected by using a selection function of the detection head switching device; The non-contact IC card inspection device according to claim 1, wherein the inspection device performs a communication operation with the card inlet. 4. The semiconductor IC chip according to claim 1, wherein said semiconductor IC chip is a semiconductor IC chip having a function capable of supporting both a non-contact IC card and a contact IC card. The inspection device for a non-contact IC card according to claim 1. 5. A non-contact IC card inlet comprising an IC module having a semiconductor IC chip and an antenna or a coil as a non-contact transmission element are integrally arranged on a base sheet. Before entering a card forming step of covering the front and back surfaces of the card base sheet with a sheet for a certain card base sheet, each non-contact I
A non-contact IC card inspection method comprising: performing a communication operation for each C card inlet; and confirming and inspecting the operation of an IC module and the like. 6. When a communication operation is performed for each contact for a non-contact IC card, a small antenna or a small coil having a communication area that does not receive interference from other inlets other than the inlet during the communication operation is used. The inspection method for a non-contact IC card according to claim 5, wherein communication is performed. 7. When a communication operation is performed for each noncontact IC card inlet, a plurality of detection heads each having the small antenna or the small coil are prepared, and each of the detection heads is placed on the base sheet. A plurality of non-contact IC card inlets are sequentially inspected by individually arranging them at positions corresponding to the respective non-contact IC card inlets and selectively switching detection heads for performing a communication operation. An inspection method for a non-contact IC card according to claim 6. 8. The semiconductor IC chip according to claim 5, wherein said semiconductor IC chip is a semiconductor IC chip having a function capable of supporting both a non-contact IC card and a contact IC card. 3. The inspection method for a non-contact IC card according to 1.