CN105372578A - A non-contact chip test system and method - Google Patents

A non-contact chip test system and method Download PDF

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Publication number
CN105372578A
CN105372578A CN201510615689.3A CN201510615689A CN105372578A CN 105372578 A CN105372578 A CN 105372578A CN 201510615689 A CN201510615689 A CN 201510615689A CN 105372578 A CN105372578 A CN 105372578A
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CN
China
Prior art keywords
contactless chip
signal
coil
test
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510615689.3A
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Chinese (zh)
Inventor
肖金磊
陈凝
王生鹏
欧阳睿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Tongfang Microelectronics Co Ltd
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Beijing Tongfang Microelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Tongfang Microelectronics Co Ltd filed Critical Beijing Tongfang Microelectronics Co Ltd
Priority to CN201510615689.3A priority Critical patent/CN105372578A/en
Publication of CN105372578A publication Critical patent/CN105372578A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2856Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]

Abstract

The invention provides a non-contact chip test system and method. The system comprises an automatic transmission unit, a coil unit, a test unit and a terminal processing unit. The non-contact chip test method comprises the steps that: firstly, a data processing terminal sends a transmission command to the automatic transmission unit ; a non-contact chip signal is transmitted to the coil unit; after processing a received signal, the data processing terminal sends a non-contact test command to a non-contact card reader antenna; the antenna sends a radio frequency signal and is coupled to a non-contact chip coil; the signal is sent to a non-contact chip via a shield wire and a board card probe (contact) to realize operation of the non-contact chip; the processing of the non-contact chip is performed according to a feedback signal and a feedback signal is fed back to the data processing terminal by the same route, so that the marking or the processing for the tested non-contact chip are realized. The non-contact chip test system is low in cost and easy to operate and is consistent with application environments of non-contact chips and the method can realize repetitive production tests for non-contact chips.

Description

A kind of contactless chip test macro and method
Technical field
The present invention relates to wafer test and the finished product test field in integrated circuit wafer test and packaging body finished product test field, particularly contactless chip.
Background technology
Along with the popularization and application of integrated circuit, the application of contactless chip is more and more extensive, and contactless chip plays more and more important role in life.How to ensure the reliable and secure use of contactless chip, how to ensure that problem chip is effectively screened out in process of production, become the important step of contactless chip production test.
In integrated circuit testing link, the test of contactless chip is more difficult part of detecting always, present stage contactless chip test time, what disk or packaging body test adopted is integrated circuit automatic testing instrument, employ the signal of communication that digiboard snap gauge intends contactless card reader and chip, and be sent to the noncontact port of contactless chip by data line and probe or contact, thus realize the operation to chip; Meanwhile, the signal can beamed back by probe and data line reception contactless chip, by signal transacting such as digital channels, is discernible data signal resolution.
Its main Problems existing is, first, integrated circuit automatic testing instrument and board somewhat expensive thereof, easily hundreds thousand of U.S. dollar, test early investment is higher; Secondly, need during test in advance the test instruction of contactless chip to be converted to the discernible digital sequential of auto testing instrument and frequency, then auto testing instrument just can send a signal to contactless chip, thus realize contactless communication, during auto testing instrument Received signal strength, also will carry out contrary signal transacting, operation extremely bothers; Again, contactless chip environment for use is in the future card reader, coil, contactless communication, and auto testing instrument is then the sequential simulating non-contact signal, is not the contactless communication undertaken by the coil of reality, do not press close to applied environment, test untrue.
Summary of the invention
For the afunction of above-mentioned noncontact auto testing instrument, the object of this invention is to provide a kind of cost is lower, simple to operate, press close to contactless chip environment for use card reader testing system and method.
In order to reach foregoing invention object, technical scheme of the present invention realizes as follows:
A kind of contactless chip test macro, comprises automatic delivery unit, coil unit, test cell and terminal processing units;
Wherein, automatic delivery unit, comprise contactless chip and board probe (contact), for transmitting contactless chip to be measured to test section contactless chip is connected with board probe (contact), by board probe (contact) and shielding line, contactless chip signal is sent to coil unit, transmission signal is to terminal processes terminal simultaneously; In automatic delivery unit, board probe (contact) is board probe or board contact, namely when the contactless chip on disk uses board probe to test, is called board probe; When packaged independentwhen chip carries out contactless chip test, raw sheet card probe, is now called board contact.
Coil unit, comprises coil panel end point of fixity, contactless chip coil and shielding line, for sending from the signal of contactless chip and the signal received from contactless card reader.
Test cell, comprise card reader panel point of fixity, non-ly connect card reader and data line, non-ly connect card reader for receiving the test instruction that comes from data processing terminal and being sent to by data line, the non-card reader that connects sends radiofrequency signal and is coupled to contactless chip coil simultaneously.
Terminal processing units, comprise data line and data processing terminal, non-ly card reader is connect for sending noncontact instruction and being sent to by data line, receive the signal of feedback simultaneously, and judge contactless chip to be measured test by or failure, and tested contactless chip is marked and processes related data.
Preferably, automatic delivery unit is connected with data processing terminal by data line.
Preferably, the non-of contactless chip connects the board probe (contact) that port is connected to coil unit.
Preferably, contactless chip coil is fixed together by coil panel end point of fixity, and shielding line one end connects board probe (contact), and the other end is connected to contactless chip coil.
Preferably, the non-card reader that connects is fixed by card reader panel point of fixity, by data line connection data processing terminal.
Preferably, data processing terminal is connected with automatic delivery unit by data line.
A kind of contactless chip method of testing, the concrete steps of the method are as follows:
1) data processing terminal sends move instruction to automatic delivery unit by data line;
2) contactless chip signal to be measured is sent to coil unit by delivery unit automatically;
3) simultaneously, automatic delivery unit is sent to data processing terminal the signal transmitted by data line;
4), after data processing terminal receives signal, send non-contact testing instruction and be sent to by data line and non-ly connect card reader;
5) the non-card reader that connects is sent radiofrequency signal by the antenna of self and is coupled to contactless chip coil;
6) contactless chip coil transmits signals to contactless chip by shielding line and board probe (contact), realizes the operation to contactless chip;
7), after contactless chip processes according to the signal obtained, former for the signal of feedback road is fed back to data processing terminal;
8) data processing terminal according to feedback signal judge contactless chip to be measured test by or failure, and tested contactless chip is marked or processed, the instruction of next contactless chip to be measured of test is sent to automatic delivery unit by data line simultaneously, carries out the repeated test of next contactless chip.
The test macro of technical solution of the present invention, select cost lower, use contactless chip, card reader and coil manipulation chip to be measured, consistent with contactless chip applied environment, Touchless manipulation instruction does not need the form being converted to auto testing instrument, the commercial card reader instruction of direct use, simple to operate, test environment is with low cost; And the contactless chip method of testing of technical solution of the present invention, by the flow operations of automatic delivery unit, test cell, coil unit and terminal processing units, realize the production test of contactless chip repeatability, convenient and swift, cost-saving.
Accompanying drawing explanation
Below in conjunction with accompanying drawingthe invention will be further described with embodiment.
fig. 1for data transport stream journey of the present invention figure.
fig. 2for contactless chip test macro composition of the present invention signal figure.
fig. 3for contactless chip method of testing flow process of the present invention figure.
Embodiment
For the ease of the understanding of those skilled in the art, below in conjunction with accompanying drawingthe present invention is described further, but can not be used for limiting the scope of the invention.
By contactless chip test macro, adopt the method for testing of contactless chip practical service environment, data terminal sends the instruction of contactless communication, by cheap card reader and coil, is sent to contactless chip; During chip return data, aerial coil is sent data to by the non-port that connects of contactless chip, and be induced to card reader antenna, data terminal is fed back to after being understood by card reader, test terminal by data feedback to transfer equipment, processing surveying chip, identical test being continued to the chip do not tested simultaneously, thus realize the production test to chip.
as Fig. 1shown in, the present invention program, contactless chip test macro comprises four parts, automatic delivery unit 10, coil unit 20, test cell 30, terminal processing units 40.
as Fig. 1shown in, when test to the disk of volume production or packaging body, tested disk or packaging body, coil unit 20 is sent to by automatic delivery unit 10 as contactless chip 11 to be measured, the non-of contactless chip 11 to be measured connects the board probe (contact) of port by coil unit 20, and be connected to coil 22 end by shielding line 23, the non-card reader 32 that connects be fixed together with coil 22 end operates contactless chip 11 by card reader antenna, and by data line 33, data are sent to data processing unit 40, data processing unit 40 pairs of data judge, and by data line 43 by result feedback extremely automatic delivery unit 10, after automatic delivery unit 10 receives data, exact p-value complete and result is carried out mark or misfeed sample to failed areas, and testing sample is reached test section, thus realize the production test carrying out repeatability.
As shown in Figure 2, the present invention program's contactless chip test macro comprises automatic delivery unit 10, coil unit 20, test cell 30, terminal processing units 40 4 parts.Wherein automatic delivery unit 10, for automatically transmitting contactless chip to be measured to test section; Contactless chip to be measured is 11; Board probe (contact) 12, connects port for connecting the non-of contactless chip; In coil unit 20, coil panel end point of fixity 21 is for fixing contactless chip coil 22; Wherein contactless chip coil 22, can need the combination that can be designed as multiple coil to improve testing efficiency according to test.
Preferably, specific embodiment adopts coil to be the coil of 13.56MHz, such as the coil of 81mm*48mm*5 circle; Shielding line 23 is that coil is connected with contactless chip to be measured; Test cell 30, can be designed as multiple non-combination connecing card reader to improve testing efficiency according to testing requirement.Wherein non-ly connect card reader 32, comprise card reader main control chip and card reader antenna, in this specific embodiment, adopt that SDI10/SDI11 card reader or THM3060 card reader etc. are non-connects card reader.Wherein non-ly connect card reader 32 and contactless chip coil 22 one_to_one corresponding; Wherein card reader panel point of fixity 31, non-ly connects card reader 32 for fixing; Wherein data line 33, for connecting terminal processing units 40; Data processing terminal 42 is connected with automatic delivery unit 10 by data line 43, go forward side by side row data communication and control.Like this, effectively can save the construction cycle, in the reduction test development cycle at least 90%, chip testing and chip actual application environment similarity can reach more than 99%.
as Fig. 3shown in, preferably, adopt the coil that uses 13.56MHz and SDI10/SDI11 is non-connects card reader, implement contactless chip method of testing, concrete steps are as follows: data processing terminal 42 sends move instruction to automatic delivery unit 10 by data line 43, contactless chip 11 signal to be measured is sent to coil unit 20 by automatic delivery unit 10, and meanwhile, automatic delivery unit 10 is sent to data processing terminal 42 the signal transmitted by data line 43;
After data processing terminal 42 receives signal, send non-contact testing instruction and be sent to by data line 33 that SDI10/SDI11 is non-connects card reader 32, non-ly connect card reader 32-SDI10/SDI11 card reader 32, send radiofrequency signal by the antenna of self and be coupled to the coil 22 of contactless chip 13.56MHz, contactless chip coil 22 transmits signals to contactless chip 11 by shielding line 23 and board probe or contact 12, realizes the operation to contactless chip;
After contactless chip 11 processes according to the signal obtained, former for the signal of feedback road is fed back to data processing terminal 42, data processing terminal 42 according to feedback signal judge contactless chip 11 to be measured test by or failure, and tested contactless chip 11 is marked or processed, the instruction of next contactless chip 11 to be measured of test is sent to automatic delivery unit 10 by data line 43 simultaneously, carries out the repeated test of next contactless chip 11.Use this kind of method of testing, employ contactless card reader test instruction, do not need to be converted to auto testing instrument, so test does not exist sequential alignment issues, 80% testing efficiency and the non-contact testing coverage rate reaching 100% can be promoted.
More than that preferred embodiment of the present invention is illustrated, but the present invention is not limited to described embodiment, those of ordinary skill in the art can also make various equivalent or replacement under the prerequisite without prejudice to the object of the invention and spirit, these are equivalent or replacement, and the apparent technical scheme formed all should be included within claim limited range of the present invention.

Claims (7)

1. a contactless chip test macro, comprises automatic delivery unit, coil unit, test cell and terminal processing units, it is characterized in that,
Automatic delivery unit (10), comprise contactless chip (11) and board probe (contact) (12), for transmitting contactless chip to be measured (11) to test section contactless chip (11) is connected with board probe (contact) (12), by board probe (contact) (12) and shielding line (23), contactless chip (11) signal is sent to coil unit (20), transmission signal is to terminal processes terminal (42) simultaneously;
Coil unit (20), comprises coil panel end point of fixity (21), contactless chip coil (22) and shielding line (23), for sending from the signal of contactless chip (11) and the signal received from contactless card reader (32);
Test cell (30), comprise card reader panel point of fixity (31), non-ly connect card reader (32) and data line (33), non-ly connect card reader (32) for receiving the test instruction that comes from data processing terminal (42) and being sent to by data line (33), the non-card reader (32) that connects sends radiofrequency signal and is coupled to contactless chip coil (22) simultaneously;
Terminal processing units (40), comprise data line (41 and 43) and data processing terminal (42), non-ly card reader (32) is connect for sending noncontact instruction and being sent to by data line (41), receive the signal of feedback simultaneously, and judge contactless chip to be measured (11) test by or failure, and tested contactless chip (11) is marked and processes related data.
2. a kind of contactless chip test macro as claimed in claim 1, wherein, automatic delivery unit (10) is connected with data processing terminal (42) by data line (43).
3. a kind of contactless chip test macro as claimed in claim 1, wherein, the non-of contactless chip (11) connects board probe (contact) (12) that port is connected to coil unit (20).
4. a kind of contactless chip test macro as claimed in claim 1, wherein, contactless chip coil (22) is fixed together by coil panel end point of fixity (21), shielding line (23) one end connects board probe (contact) (12), and the other end is connected to contactless chip coil (22).
5. a kind of contactless chip test macro as claimed in claim 1, wherein, the non-card reader (32) that connects is fixed, by data line (33) connection data processing terminal (42) by card reader panel point of fixity (31).
6. a kind of contactless chip test macro as claimed in claim 1, wherein, data processing terminal (42) is connected with automatic delivery unit (10) by data line (43).
7. a contactless chip method of testing, is characterized in that, the concrete steps of the method are as follows:
Data processing terminal (42) sends move instruction to automatic delivery unit (10) by data line (43);
Contactless chip to be measured (11) signal is sent to coil unit (20) by automatic delivery unit (10);
Meanwhile, automatic delivery unit (10) is sent to data processing terminal (42) the signal transmitted by data line (43);
After data processing terminal (42) receives signal, send non-contact testing instruction and be sent to by data line (33) and non-ly connect card reader (32);
The non-card reader (32) that connects is sent radiofrequency signal by the antenna of self and is coupled to contactless chip coil (22);
Contactless chip coil (22) transmits signals to contactless chip (11) by shielding line (23) and board probe (contact) (12), realizes the operation to contactless chip;
Former for the signal of feedback road is fed back to data processing terminal (42) after processing according to the signal obtained by contactless chip (11);
Data processing terminal (42) according to feedback signal judge contactless chip to be measured (11) test by or failure, and tested contactless chip (11) is marked or processed, the instruction of next contactless chip to be measured (11) of test is sent to automatic delivery unit (10) by data line (43) simultaneously, carries out the repeated test of next contactless chip (11).
CN201510615689.3A 2015-09-24 2015-09-24 A non-contact chip test system and method Pending CN105372578A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106646039A (en) * 2016-12-02 2017-05-10 北京中电华大电子设计有限责任公司 Non-contact intelligent card testing device and method

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JPH11353433A (en) * 1998-06-05 1999-12-24 Toppan Printing Co Ltd Checking device and method for non-contacting type ic card
CN1312911A (en) * 1998-06-16 2001-09-12 奥伯技术有限公司 Non-contact test method and apparatus
JP2007115282A (en) * 2007-01-19 2007-05-10 Dainippon Printing Co Ltd Ic module for ic card used as both contact/non-contact types
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US20100025682A1 (en) * 2008-08-04 2010-02-04 Samsung Electronics Co., Ltd. Interface device for wireless testing, semiconductor device and semiconductor package including the same, and method for wirelessly testing using the same
CN103064011A (en) * 2012-12-27 2013-04-24 广州中大微电子有限公司 Radio frequency identification devices (RFID) reader chip process testing system and method
CN203350405U (en) * 2013-07-11 2013-12-18 武汉天喻信息产业股份有限公司 Contact and non-contact intelligent card chip general detection apparatus
CN203773959U (en) * 2014-02-25 2014-08-13 咏嘉科技股份有限公司 Wireless memory card testing device
CN104133169A (en) * 2013-05-03 2014-11-05 无锡华润微电子有限公司 Non-contact chip test system and method

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11353433A (en) * 1998-06-05 1999-12-24 Toppan Printing Co Ltd Checking device and method for non-contacting type ic card
CN1312911A (en) * 1998-06-16 2001-09-12 奥伯技术有限公司 Non-contact test method and apparatus
JP2007115282A (en) * 2007-01-19 2007-05-10 Dainippon Printing Co Ltd Ic module for ic card used as both contact/non-contact types
CN201242758Y (en) * 2008-03-03 2009-05-20 捷创科技股份有限公司 Apparatus for managing non-contact type probe card
US20100025682A1 (en) * 2008-08-04 2010-02-04 Samsung Electronics Co., Ltd. Interface device for wireless testing, semiconductor device and semiconductor package including the same, and method for wirelessly testing using the same
CN103064011A (en) * 2012-12-27 2013-04-24 广州中大微电子有限公司 Radio frequency identification devices (RFID) reader chip process testing system and method
CN104133169A (en) * 2013-05-03 2014-11-05 无锡华润微电子有限公司 Non-contact chip test system and method
CN203350405U (en) * 2013-07-11 2013-12-18 武汉天喻信息产业股份有限公司 Contact and non-contact intelligent card chip general detection apparatus
CN203773959U (en) * 2014-02-25 2014-08-13 咏嘉科技股份有限公司 Wireless memory card testing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106646039A (en) * 2016-12-02 2017-05-10 北京中电华大电子设计有限责任公司 Non-contact intelligent card testing device and method

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