JPH11352149A - Probing card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probing card by which a noise removal effect is enhanced and a high precision inspection can be performed, and in which a chip capacitor can be easily exchanged for one having a different capacity corresponding to a demand of a customer. SOLUTION: This probing card, equipped with a probing terminal for a power source 15 for applying a power source voltage on a semiconductor element 18 formed on a semiconductor wafer 17, a probing terminal for a signal 16 for testing an electric characteristic of the semiconductor element 18, a support 11 supporting the probe terminal for a power source 15 and the probe terminal for a signal 16, and a wiring board 13 fixed on the support 11 and having wiring connected to each probe terminal, has such characteristics that a recess part 19 is formed on the outer surface of the support 11, and that a chip capacitor 20 is buried in the recess part 19, and that the chip capacitor 20 and the periphery of the head of the probe terminal for a power source 15 are connected with solder 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probing card for inspecting electrical characteristics of a semiconductor device formed on a semiconductor wafer.

[0002]

2. Description of the Related Art A probing card is provided in a probe device for performing electrical characteristic inspection of a large number of semiconductor elements formed on a semiconductor wafer in a wafer state. As shown in FIG. 4, the probing card 1 has a power supply probing terminal 2 for applying a power supply voltage to a semiconductor device, a signal probing terminal for inputting / outputting a test signal to / from the semiconductor device, and a grounding probing. And terminals (both not shown). The probing terminals 2 are supported by a support 4 made of an insulating member.

A wiring board 5 having electric wiring is provided on the support 4, and the base end of each probing terminal 2 is electrically connected to the electric wiring of the wiring board 5. Also,
The tip of each probing terminal 2 comes into contact with an electrode pad of a semiconductor element 7 formed on a semiconductor wafer 6 to perform an electrical characteristic test.

By the way, noise is generated in the power supply line including the power supply probing terminal 2 during the above-described electrical characteristic inspection, and this noise propagates to the signal probing terminal arranged close to the power supply probing terminal 2. However, noise is generated at the signal probing terminal, which adversely affects the characteristic inspection result.

Therefore, it is known that a capacitor 9 for removing a noise component is provided between the power supply probing terminal 3 and the ground 8. For example, JP-A-59-21
Japanese Patent No. 5737 discloses a configuration in which a capacitor is provided on the ground plane side of a probe card, and this capacitor is connected to a probing terminal. Also, JP-A-2-216467.
In the publication, a notch is provided in a base block supporting a probing terminal, a capacitor is attached to the notch, and the capacitor and the probing terminal are connected.

In Japanese Patent Application No. 9-10585, a conductor is provided at the lower portion of a wiring board, and the conductor is connected to a power probing terminal via a capacitor. Further, Japanese Patent Application No. 9-344204 discloses that a pass capacitor is integrally provided on a support for supporting a probing terminal, one end of the pass capacitor is connected to a wiring board, and the other end is connected to a probing terminal for power supply. It was done.

All of these devices remove noise generated in a power supply line including a power supply probing terminal, and a capacitor connected to a portion closer to the tip of the probing terminal may have a higher noise removal effect. Are known.

[0008]

However, recently, since the pitch between the probing terminals of the probing card has become narrower with the miniaturization of the semiconductor element and the rapid increase in the degree of integration thereof, a capacitor has to be connected to the probing terminal for the power supply. Is connected, there remains a problem that noise is generated from the probing terminal before the capacitor.

[0009] In addition, although a contrivance has been made to connect the capacitor to a portion of the probing terminal as close to the tip as possible, as described above, since the pitch between the probing terminals of the probing card is reduced, the space for installing the capacitor is reduced. Therefore, it is difficult to secure a space for wiring and to secure a wiring space, and in fact, a capacitor must be installed at a position away from the tip of the probing terminal for power supply.

The present invention has been made in view of the above circumstances, and an object thereof is to improve the noise removing effect by attaching a chip capacitance to a portion closest to the tip of a power supply probing terminal. It is another object of the present invention to provide a probing card that can be easily replaced with a chip capacitance having a different capacity according to a customer's request.

[0011]

To achieve the above object, according to the present invention, there is provided a power supply probing terminal for applying a power supply voltage to a semiconductor element formed on a semiconductor wafer; A signal probing terminal for inspecting the electrical characteristics of the probe, a support for supporting the power supply probing terminal and the signal probing terminal, and a wire fixed to the support and connected to each of the probing terminals. In a probing card provided with a wiring board having the same, a chip capacitance is provided on an outer surface of the support, and the chip capacitance is connected to a vicinity of a tip of the power supply probing terminal.

A second aspect of the present invention is characterized in that a concave portion is provided on the outer surface of the support of the first aspect, and the chip capacitance is embedded in the concave portion. A third aspect of the present invention is characterized in that a concave portion is provided on an outer surface of the support according to the first aspect, the concave portion corresponding to the probing terminal for power supply, and the chip capacitance is embedded in the concave portion. The chip capacitance of claim 1 and the probing terminal for power supply are connected by solder.

According to the above construction, the chip capacitance can be attached to the support closest to the tip of the power supply probing terminal, and the electrical connection between the chip capacitance and the power supply probing terminal is facilitated. Applicable to narrow pitch.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 show a first embodiment. FIG. 1 is a longitudinal sectional side view showing a part of a probing card, and FIG. 2 is a side view seen from the direction of arrow A in FIG. As shown in FIGS. 1 and 2, a wiring board 1 having an electric wiring 12 provided on a support 11 made of a ceramic ring
3 is fixed.

An insulator 14 made of synthetic resin is integrally fixed to the lower surface of the support 11, and a plurality of power supply probing terminals 15 and signal probing terminals 16 made of, for example, a tungsten wire are fixed to the insulator 14. The middle part is supported diagonally. The base ends of the power supply probing terminal 15 and the signal probing terminal 16 are electrically connected to the electric wiring 12 of the wiring board 13, and the front end is bent so that the needle tip is vertical.

The tips of the power supply probing terminal 15 and the signal probing terminal 16 are connected to the semiconductor wafer 17.
The power supply voltage is applied to an electrode pad of the semiconductor element 18 formed on the substrate to perform an electrical characteristic test.

At the lower end of the outer surface of the support 11, a rectangular recess 19 is provided at a position corresponding to each of the power supply probing terminals 15. A chip capacitance 20 for removing electric noise is buried in these recesses 19, and the support 1 is attached with an adhesive or the like.
Fixed to 1. That is, the chip capacitance 20 is buried in the lower end of the support 11 closest to the tip of the power supply probing terminal 15.

One terminal 2 of the chip capacitance 20
0a is provided with a copper foil 21, and this copper foil 21
Thus, it is electrically connected to the vicinity of the tip of the power supply probing terminal 15. The other terminal 20 b of the chip capacitance 20 is electrically connected to a conductive film 23 that is plated with copper on the outer surface of the support 11.
Is connected to a beta land portion 25 via a copper foil 24 provided on the wiring board 13.

Therefore, the chip capacitance 20 is connected to the power probing terminal 15 by the copper foils 21 and 24, the conductive film 23 and the solder 22 without passing through a lead wire or the like.
In addition, it is electrically connected to the beta land portion 25 to simplify the wiring.

Next, the operation of the first embodiment will be described. When an electrical characteristic test of a semiconductor element 18 formed on a semiconductor wafer 17 is performed, a power supply probing terminal 15 and a signal probing terminal 1 of a probing card are used.
6 contacts the electrode pads of the semiconductor element 18. And
After a power supply voltage is applied to each semiconductor element 18 via the power supply probing terminal 15 and an input signal is input to the semiconductor element 18 via the signal probing terminal 16, an output signal is output from the semiconductor element 18 to the signal probing terminal 1.
6 is output.

At this time, even if electric noise is generated in the power supply line, this noise can be absorbed by the chip capacitance 20 connected near the front end of the power supply probing terminal 15. Chip capacitance 20 closest to the tip
Therefore, the noise can be effectively absorbed, and the noise can be prevented from propagating to the signal probing terminal 16 to perform a highly accurate inspection.

Moreover, by forming the concave portion 19 in the support 11 and burying the chip capacitance 20 in the concave portion 19, the positioning of the chip capacitance 20 at the time of assembling is easy, and the chip capacitance 20 can be assembled with high precision. Further, by providing the recessed portion 19 corresponding to each power supply probing terminal 15, there is an effect that chip capacitances 20 having different capacities can be replaced for each power supply probing terminal 15 according to customer's request. .

FIG. 3 shows a second embodiment, in which a support 11
At the lower end of the outer surface of the
The chip capacitance 20 is fixed at a position corresponding to 5 by an adhesive or the like.

Therefore, also in this embodiment, even if electric noise is generated in the power supply line, this noise can be absorbed by the chip capacitance 20 connected near the tip of the power supply probing terminal 15, and Since the noise is absorbed by the chip capacitance 20 at the position closest to the tip of the probing terminal 15 for signal, the noise absorption effect is high, and the noise can be prevented from being propagated to the probing terminal 16 for signal, thereby enabling a highly accurate inspection.

[0025]

As described above, according to the first aspect of the present invention, the chip capacitance is attached to the portion closest to the tip of the power supply probing terminal to enhance the noise removing effect, and high-precision inspection is possible. In addition, there is an effect that the chip capacitance having a different capacity can be easily exchanged according to the request of the customer.

According to claims 2 and 3, in addition to claim 1,
By embedding the chip capacitance in the concave portion of the support, positioning at the time of assembling is easy, and assembling workability can be improved. According to the fourth aspect, in addition to the first aspect, there is an effect that wiring by a lead wire becomes unnecessary, and electrical wiring can be simplified.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional side view of a part of a probing card according to a first embodiment of the present invention.

FIG. 2 is a side view as seen from the direction of arrow A in FIG. 1;

FIG. 3 is a longitudinal sectional side view of a part of a probing card according to a second embodiment of the present invention.

FIG. 4 is a vertical side view of a conventional probing card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 ... Support 13 ... Wiring board 15 ... Probing terminal for power supply 16 ... Probing terminal for signal 19 ... Depression 20 ... Chip capacitance

Claims (4)

[Claims] A power supply probing terminal for applying a power supply voltage to a semiconductor element formed on a semiconductor wafer;
A signal probing terminal for inspecting electrical characteristics of the semiconductor element, a support for supporting the power supply probing terminal and the signal probing terminal, fixed to the support and connected to each of the probing terminals; A probing card provided with a wiring substrate having a wiring, wherein a chip capacitance is provided on an outer surface of the support, and the chip capacitance is connected to a vicinity of a tip of the power supply probing terminal. 2. The probing card according to claim 1, wherein a concave portion is provided on an outer surface of the support, and the chip capacitance is embedded in the concave portion. 3. The probing card according to claim 1, wherein a concave portion is provided on an outer surface of said support corresponding to said probing terminal for power supply, and said chip capacitance is buried in said concave portion. 4. The probing card according to claim 1, wherein the chip capacitance and the power supply probing terminal are connected by solder.