JPH11333356A - Coating device and coating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the correspondency to the fluctuation of viscosity of a coating liquid by providing a holding means for holding a substrate to be treated and a supply means for supplying a treating agent to plural positions on the surface of the substrate to be treated relatively freely movably and diffusing the treating agent on the surface of the substrate to be treated in a closed state to make the film uniformly thin. SOLUTION: A resist coating device for applying the treating agent such as a resist liquid on the glass substrate G for a liquid crystal display device is constituted of a rotor cup having a side wall part 11, a coating liquid supply device and a moving device 70. The coating liquid supply device is composed of a resist pipe 61 and leg members 64 and 65 and each of the leg members 64 and 65 is engaged respectively with guide rails 71 and 72 of the moving device 70. And a solvent pipe 62 and a gas pipe are arranged on both neighbor sides of the resist pipe 61 in the X direction and an actuator AC is vibrated in a state in which the coated resist liquid is separated in an island state to increase the flowability of the resist liquid and to connect the adjacent islands to each other and finally the film thickness is uniformalized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, a coating apparatus for applying a processing agent such as a resist solution onto a glass substrate for an LCD in a manufacturing process of a liquid crystal display (hereinafter, this liquid crystal display is referred to as "LCD"). And an application method.

[0002]

2. Description of the Related Art Conventionally, glass substrates for LCDs (hereinafter referred to as LCD substrates) have been used.
This glass substrate for LCD is simply referred to as “glass substrate”)
In order to apply a processing agent such as a resist solution thereon, a method called “spin coating method” was generally used.
In this spin coating method, a glass substrate is rotated at high speed in a horizontal plane, and a resist solution is dropped near the center of rotation,
This is a method in which the resist is applied to the entire glass substrate by the centrifugal force of the glass substrate, and the excess resist solution is shaken off and removed by the centrifugal force to make the film thin.

According to the spin coating method, there is an advantage that the coating can be performed by a coating apparatus having a relatively simple structure, but the resist liquid is applied to unnecessary portions because the resist liquid is spread over the entire glass substrate. In addition, there is a problem that a large amount of resist solution is required as compared with an area requiring resist coating.

[0004] Further, as the degree of integration of semiconductor elements formed on a substrate increases, it is required to reduce the thickness of a resist coating film. Since it is determined by the viscosity and the rotation speed of the glass substrate, there is naturally a limit to thinning.

Therefore, various proposals have been made to solve the problems of the spin coating method.

[0006] For example, Japanese Patent Application Laid-Open No. 4-118073 discloses that "a coating surface of a work to be coated has a slot for discharging a coating material, and the work is formed in a direction perpendicular to the extending direction of the slot. A slot coater that is relatively moved, and a spin that is juxtaposed to the slot coater and holds the work with the coating material applied to the coating surface at a high speed while holding the coating surface in a substantially horizontal state. Mold coating adjustment mechanism,
A coating apparatus comprising

According to this method, there is an advantage that coating can be efficiently performed with a small amount of coating material.

[0008]

However, the above-mentioned coating apparatus has the following problems.

That is, if the gap between the slot and the work (substrate) fluctuates, the thickness of the coating film fluctuates, or the thickness at the time of ejection at the center and the end of the slot differs. There is a problem that high-precision control is required so that the gap between the slot and the substrate is narrow and constant.

Further, in this coating apparatus, since the coating material is discharged in a liquid film state from the slot toward the work, it is necessary to use a coating material having a somewhat high viscosity so as to form this liquid film. As described above, the solution having a relatively high viscosity is apt to dry, so that there is a problem that the clogging of the slot is easily caused.

Further, since a liquid having a relatively high viscosity, such as this coating material, has a low solvent content and is liable to fluctuate in viscosity, there is a problem that the viscosity must be controlled with high precision.

Further, it is necessary to rotate the high-viscosity coating material discharged onto the work surface at a high speed in order to make the coating material thinner or uniform in film thickness. However, because it is difficult to rotate a large-screen LCD at high speed,
There is also a problem that it cannot be used for a large LCD.

Further, when rotating using a high-viscosity coating material, excess coating material is dropped off by centrifugal force and adheres to the inner wall of the rotor cup. However, there is also a problem that it is difficult to remove the coating material due to the high viscosity. is there.

Further, since a continuous groove having a large size is required as a groove for forming the slot, there is a problem that the strength of the die must be maintained and the die head becomes large.

The present invention has been made to solve the above problems.

That is, an object of the present invention is to provide a coating apparatus and a coating method capable of relaxing conditions of mechanical accuracy and operational accuracy such as a gap between a nozzle and a substrate.

Another object of the present invention is to provide a coating apparatus and a coating method which can use a low-viscosity treating agent.

[0018]

In order to solve the above-mentioned problems, a coating apparatus according to a first aspect of the present invention includes a holding unit for holding a substrate to be processed, and a plurality of positions on a surface of the substrate to be processed at a plurality of positions separated by a predetermined distance. Supply means for supplying a treatment agent, means for relatively moving the holding means and the supply means, and thinning means for diffusing the treatment agent onto the surface of the substrate to be processed in a sealed state to make the film uniform. And

The coating apparatus according to a second aspect is the coating apparatus according to the first aspect, wherein the thinning means is means for swinging the substrate to be processed.

A third aspect of the present invention is the coating apparatus according to the first aspect, wherein the thinning means is means for rotating the substrate to be processed.

According to a fourth aspect of the present invention, in the coating apparatus according to any one of the first to third aspects, an interval between the processing agents supplied adjacent to each other is adjusted by the thinning means. The spacing is such that the processing agents are integrated on the substrate surface.

A coating apparatus according to a fifth aspect is the coating apparatus according to any one of the first to fourth aspects, further comprising means for supplying a solvent to the surface of the substrate before the processing agent is supplied. It is characterized by having.

According to a sixth aspect of the present invention, there is provided the coating apparatus, wherein the holding member holds the substrate to be processed, and is provided at predetermined intervals in a first direction across the surface of the substrate to be processed and directed to the surface of the substrate to be processed. A plurality of processing agent nozzles, a processing agent supply system for supplying the processing agent to the processing agent nozzle, and a second direction different from the first direction, the holding member or the processing agent nozzle being movable. A supporting system, a moving system for relatively moving the holding member and the processing agent nozzle, and an actuator disposed on the holding member,
The container includes the container that stores the holding member and the actuator, a lid that seals the container, and a control unit that synchronously drives the processing agent supply system, the moving system, and the actuator.

According to a seventh aspect of the present invention, a spin chuck for rotatably holding a substrate to be processed, a container for accommodating the spin chuck, a lid for sealing the container, and a surface facing the surface of the substrate to be processed. A plurality of processing agent nozzles provided at predetermined intervals in a first direction across the surface of the substrate to be processed, a processing agent supply system configured to supply a processing agent to the processing agent nozzle, and a processing agent different from the first direction. A guide disposed in a second direction to movably support the spin chuck or the processing agent nozzle, a moving system for relatively moving the spin chuck and the processing agent nozzle, and the processing agent supply system , A control unit that drives the moving system and the spin chuck in synchronization with each other.

The coating apparatus according to claim 8 is the coating apparatus according to claim 6 or 7, wherein the solvent nozzle is disposed adjacent to the processing agent nozzle on the upstream side in the moving direction of the substrate to be processed. It is characterized by further comprising a solvent supply system for supplying a solvent, and a control unit for driving the moving system.

A coating apparatus according to a ninth aspect is the coating apparatus according to any one of the sixth to eighth aspects, wherein an interval between the processing agents supplied adjacent to each other is reduced by the thinning means. The spacing is such that the processing agents are integrated on the substrate surface.

A coating apparatus according to a tenth aspect is the coating apparatus according to any one of the sixth to ninth aspects, wherein a standby position adjacent to the holding member or the spin chuck, and the processing agent nozzle facing surface at the standby position. A pressure sensor that detects the discharge pressure of each processing agent nozzle, and a monitoring device that monitors the operation state of each processing agent nozzle based on the detected discharge pressure,
Is further provided.

[0028] In the coating method according to the eleventh aspect, the processing agent may be supplied to a plurality of positions at predetermined intervals on the surface of the substrate, and the processing agent may be rotated by rotating the substrate in a sealed state. Connecting and integrating.

According to a twelfth aspect of the present invention, there is provided a coating method comprising the steps of: supplying a processing agent to a plurality of positions at predetermined intervals on the surface of a processing substrate; And a step of rotating the substrate to be processed and uniformly thinning the processing agent.

Next, the meaning of the terms in the claims will be described.

The "plurality of positions separated by a predetermined distance" for supplying the coating liquid is based on the premise that the processing agent supplied to the surface of the substrate to be processed is spread, and is not the entire upper surface. .

For example, if it is assumed that the spread is to the left and right, the ink is supplied in a linear manner, and if the spread is assumed to be in four directions, the ink is ejected in the form of dots.

The term "supply" includes both continuous supply and intermittent supply.

"Treatment agents" include those for forming a coating film, those for cleaning a substrate, a solvent and a treatment liquid.
It also includes various liquids from high to low viscosity.

The term "relatively move" means not only the case where the supply means is moved without moving the holding means, or the case where the holding means is moved without moving the supply means, but also where both means are moved in the opposite direction. And moving both means in the same direction at different speeds. In addition, the direction of movement is generally linear, but also includes a case where the direction of movement is rotational or a meandering.

Hereinafter, the operation of the present invention will be described.

In the coating apparatus according to the first aspect, the supply of the treatment agent and the thinning of the treatment agent are divided into separate operations, and the supply of the treatment agent is performed by the treatment supply means. It was done by means. Therefore, the conditions of the mechanical accuracy and the operational accuracy required in each of the operation steps are relaxed.

That is, it is not necessary to control the shape and size of the nozzle, the gap between the processing agent nozzle and the substrate to be processed more strictly than in the continuous slot.

Since the processing agent is supplied to a plurality of positions with respect to the surface of the substrate to be processed, a processing agent having a relatively low viscosity can be used. Therefore, since the solvent content is high and the treating agent is hard to dry, nozzle clogging does not easily occur.

Further, since the viscosity of the treating agent has a small effect on the film thickness, the viscosity of the treating agent can be easily controlled.

Also, since a low-viscosity treating agent can be used,
Even when the film is rotated and thinned after the processing, the film can be thinned at a low rotation speed and can be applied to a large LCD substrate.

Furthermore, because of its low viscosity, it can be easily removed even if it adheres to the rotor cup.

Also, since it is supplied separately to a plurality of positions,
It is not necessary to use a processing agent nozzle having a large opening such as a slot, and the processing agent nozzle does not increase in size. Further, since the film is thinned by being rotated in a closed state, an airflow is not disturbed, and a coating film having a uniform film thickness can be obtained.

In the coating apparatus according to the second aspect, since the means for oscillating the substrate to be processed is adopted as the thinning means, the thinning can be surely achieved with a simple structure.

Here, the "oscillation" means that the actuator is vibrated in a linear direction by using an actuator (vibrating body) or the like, or that the spin chuck is inverted in a very short cycle within a very small angle range. Includes both cases of angular vibration.

In the coating apparatus according to the third aspect, since the means for rotating the substrate to be processed is adopted as the means for thinning, the thin film can be reliably formed with a simple structure.

For example, when a spin chuck is used, the conventional apparatus can be used as it is, and there is no need to add new parts and elements, so that it is not necessary to make new capital investment, and the production cost can be increased almost. Absent.

When a spin chuck is used,
After the application of the processing agent is rocked by angular vibration within a small angle, the spin chuck can be rotated at a high speed to shake off and remove the excess processing agent.

According to a fourth aspect of the present invention, in the coating apparatus according to any one of the first to third aspects, the processing agent supplied adjacently is treated on the surface of the substrate by the thinning means. They are supplied at an interval such that they are integrated. Therefore, since the processing agent supplied onto the processing target machine board is surely integrated, a uniform and thin coating film is more reliably formed.

The coating apparatus according to the fifth aspect further includes means for supplying a solvent to the surface of the substrate before the processing agent is supplied. By supplying this solvent, the surface of the substrate to be treated is wetted with the solvent in advance, and the treatment agent and the substrate to be treated are easily blended, and the treatment agent runs on the surface of the substrate to be treated through the solvent layer and is rapidly diffused. As a result, the coating film can be more reliably made uniform.

According to a sixth aspect of the present invention, there is provided the coating apparatus, as means for swinging the substrate to be processed, comprising an actuator disposed on the holding member, and a control unit for driving the actuator. Therefore, the coating film can be reliably made uniform with a simple structure.

In the coating apparatus of the present invention, a rotatable spin chuck is employed as the holding means, and this spin chuck is also used as the thinning means. Therefore, the coating film can be surely made uniform without adding components.

It is also possible to use this spin chuck as the rocking means and to rotate it at high speed after angular vibration within a small angle range. By doing so, the coating film can be made even more uniform and the film can be made thinner.

In the coating apparatus according to the eighth aspect, the sixth or seventh aspect is provided.
And a solvent nozzle for supplying a solvent to the surface of the substrate to be processed. By supplying this solvent, the surface of the substrate to be treated is wetted with the solvent in advance, and the treatment agent and the substrate to be treated are easily blended, and the treatment agent runs on the surface of the substrate to be treated through the solvent layer and is rapidly diffused. With this configuration, in addition to the function of the sixth or seventh aspect, the coating film can be more reliably made uniform.

According to a ninth aspect of the present invention, in the coating apparatus according to any one of the sixth to eighth aspects, the processing agent supplied adjacently is treated on the surface of the substrate by the thinning means. They are supplied at an interval such that they are integrated. Therefore, since the processing agent supplied onto the processing target machine board is surely integrated, a uniform and thin coating film is more reliably formed.

According to a tenth aspect of the present invention, a standby position is provided adjacent to the holding member or the spin chuck, and a pressure sensor is disposed on the processing agent nozzle facing surface at the standby position. The discharge pressure of the agent nozzle is detected. Then, a monitoring device for monitoring the operation state of each of the processing agent nozzles based on the detected discharge pressure is provided.

Since the operating state of each processing agent nozzle is constantly monitored by this monitoring device, if any one of the processing agent nozzles is clogged, the clogged processing agent nozzle can be found quickly, and there is a problem with the processing agent nozzle. Since the production is prevented from being performed as it is, the yield is improved, and the production efficiency and the production cost are improved.

In the coating method according to the eleventh aspect, the supply of the treatment agent and the thinning of the treatment agent are divided into separate operations, and the supply of the treatment agent is performed by the treatment supply means. It was done by means. Therefore, the conditions of the mechanical accuracy and the operational accuracy required in each of the operation steps are relaxed.

Further, since the processing agent is supplied to a plurality of positions with respect to the surface of the substrate to be processed, a processing agent having a relatively low viscosity can be used. Therefore, since the solvent content is high and the treating agent is hard to dry, nozzle clogging does not easily occur.

Further, since the viscosity of the treating agent has a small effect on the film thickness, the viscosity of the treating agent can be easily controlled.

Since a low-viscosity treating agent can be used,
Even when the film is rotated and thinned after the processing, the film can be thinned at a low rotation speed and can be applied to a large LCD substrate.

Further, because of its low viscosity, even if it adheres to the rotor cup, it can be easily removed.

Also, since it is supplied separately to a plurality of positions,
It is not necessary to use a processing agent nozzle having a large opening such as a slot, and the processing agent nozzle does not increase in size. Further, since the film is thinned by being rotated in a closed state, an airflow is not disturbed, and a coating film having a uniform film thickness can be obtained.

A coating method according to a twelfth aspect of the present invention, in addition to the coating method according to the eleventh aspect, further comprises a step of rotating the substrate to be processed to make the processing agent thinner uniformly. Therefore, a uniform and thin coating film is more reliably formed.

[0065]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a perspective view of a coating and developing apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view thereof.

The coating / developing apparatus 1 has a cassette station C / S at one end.

On the other end of the coating / developing apparatus 1, an LCD glass substrate G (hereinafter, the LCD glass substrate is abbreviated as “substrate”) is provided between the coating / developing apparatus 1 and an exposure apparatus (not shown). An interface unit I / F for performing transfer is provided.

The cassette station C / S has an LC
A plurality, for example, four sets of cassettes 2 containing substrates G such as substrates for D are mounted. Cassette station C / S
A front arm of the cassette 2 is provided with an auxiliary arm 4 for carrying and positioning the substrate G as a substrate to be processed, and holding the substrate G and transferring it to and from the main arm 3. .

The interface unit I / F is provided with an auxiliary arm 5 for transferring the substrate G to and from an exposure apparatus (not shown). The interface unit I / F includes an extension section 6 for transferring the board G to and from the main arm 3 and a board G.
Is temporarily placed in a standby state.

Two main arms 3 are arranged in series so as to be movable in the center of the coating / developing apparatus 1 in the longitudinal direction.
And a second processing unit group B are disposed. Between the first processing unit group A and the second processing unit group B, a relay section 8 for temporarily holding and cooling the substrate G is disposed.

In the first processing unit group A, a cleaning processing unit SCR for cleaning the substrate G and a developing processing unit DEV for performing a developing process are provided beside the cassette station C / S.
And are juxtaposed. Further, the cleaning unit SCR and the developing unit D sandwich the transport path of the main arm 3 therebetween.
On the opposite side of the EV, two heat treatment units HP vertically arranged in two stages and a UV processing unit UV and cooling unit COL arranged vertically in two stages are arranged adjacent to each other.

In the second processing unit group B, a coating processing unit COT for performing a resist coating processing and an edge remove processing is arranged. On the opposite side of the coating unit COT with the conveyance path of the main arm 3 therebetween, an adhesion unit AD and a cooling unit COL for hydrophobically embedding substrates G arranged in two stages vertically and two stages vertically. Heat treatment unit HP and cooling unit COL arranged
And two sets of heat treatment units HP arranged vertically in two stages are arranged adjacent to each other. Heat treatment unit HP
When the cooling unit COL and the cooling unit COL are arranged vertically in two stages, the thermal interference is avoided by arranging the heat treatment unit HP on the upper side and the cooling unit COL on the lower side. This enables more accurate temperature control.

The main arm 3 includes an X-axis driving mechanism, a Y-axis driving mechanism, and a Z-axis driving mechanism, and further includes a rotation driving mechanism that rotates about the Z-axis. The main arm 3 appropriately travels along the central passage of the coating / developing device 1 to transport the base slope G between the processing units. Then, the main arm 3 loads the unprocessed substrate G into each processing unit, and unloads the processed substrate G from each processing unit.

In the coating / developing apparatus 1 of the present embodiment, by integrating and integrating the processing units as described above, it is possible to save space and increase processing efficiency.

In the coating / developing apparatus 1 configured as described above, first, the substrate G in the cassette 2 is
Then, the wafer is transferred to the cleaning unit SCR via the main arm 3 and subjected to the cleaning process.

Next, it is conveyed to the adhesion unit AD via the main arm 3, the relay section 8 and the main arm 3 and subjected to a hydrophobic treatment. Thereby, the fixability of the resist is improved.

Next, it is conveyed to the cooling unit COL via the main arm 3 and cooled. Thereafter, the resist is transferred to the coating unit COT via the main arm 3 and coated with the resist.

Next, the substrate G is conveyed to the heat processing unit HP via the main arm 3 and is subjected to a pre-baking process. Then, the cooling unit CO is supplied via the main arm 3.
After being conveyed to L and cooled, it is conveyed to the exposure device via the main arm 3 and the interface I / F, where a predetermined pattern is exposed.

The substrate G that has been exposed again is carried into the apparatus 1 via the interface unit I / F, conveyed to the heating unit HP via the main arm 3, and subjected to post-exposure bake processing. .

Thereafter, the substrate G is carried into the cooling unit COL via the main arm 3, the relay section 8, and the main arm 3, and is cooled. Then, the substrate G is carried into the development processing unit DEV via the main arm 3 and subjected to development processing, and a predetermined circuit pattern is formed. The developed substrate G is carried into the post-bake processing unit HP via the main arm 3 and subjected to post-bake processing.

Then, the post-baked substrate G
Are stored in a predetermined cassette 2 on a cassette station C / S via a main arm 3 and an auxiliary arm 4.

Next, the coating unit (COT) according to the present embodiment will be described. 3 is a plan view of the coating unit (COT) according to the present embodiment, FIG. 4 is a side view, and FIG. 5 is a perspective view.

As shown in FIG. 3, a resist coating apparatus RC and an edge remover ER are arranged adjacent to each other in the coating processing unit (COT). Among them, the resist coating device RC is a device for applying a processing agent such as a resist solution to the surface of the substrate G that has been subjected to the pre-processing such as the cleaning process and the pre-baking, and the edge remover ER is a resist coating device RC. This is an apparatus for peeling and removing a resist coating film on an outer peripheral portion (edge) of the substrate G on which a resist coating film is formed.

In the case where a coating film is selectively formed only on a portion of the surface of the substrate G which requires a resist coating, the edge remover ER is not always necessary and can be omitted.

In the resist coating device RC, a rotor cup 10 as a substrate holding device for rotatably holding a substrate G as a substrate to be processed,
A coating liquid supply device 60 for supplying a resist solution or a solvent from the upper surface of the substrate G held by the substrate G, and a moving device 70 for moving the coating liquid supply device 60 with respect to the rotor cup 10.

The outer appearance of the rotor cup 10 is composed of a cylindrical tubular side wall 11 having a vertical axis, and a lid 12 for closing the upper end surface of the side wall 11, and an elevating arm 13 is attached to and detached from the lid 12. Mounted as possible.

FIG. 3 shows the lid 1 of the coating unit (COT).
FIG. 4 is a plan view showing a state in which the coating processing unit 2 is closed, and FIG. 4 is a vertical sectional view of the coating processing unit (COT).

The space inside the rotor cup 10 contains the substrate G
And a rotation drive mechanism for rotating the spin chuck 15 are provided.

An annular cup CP is disposed inside the rotor cup 10, and a spin chuck 15 is disposed inside the cup CP. The spin chuck 15 is configured to rotate with the rotational driving force of the driving motor 16 in a state where the substrate G is fixedly held by vacuum suction.

An actuator (vibrator) AC for swinging the substrate G is provided on the surface of the spin chuck 15 which is in contact with the substrate G. The actuator AC is a vibrating body that vibrates when a voltage is applied. The applied voltage is controlled via a control unit 100 described later, and the actuator AC vibrates to swing the substrate G held on the upper surface of the spin chuck 15. Let it.

The drive motor 16 transmits a rotational driving force to a rotary shaft 18 via a gear train 17, and the rotary shaft 18 is moved by a vertical drive unit 19 along a vertical guide unit 20 in the figure. It is mounted so that it can move up and down.

At the time of resist application, as shown in FIG.
The spin chuck 15 is lowered to a position lower than the upper end of the cup CP. On the other hand, when the substrate G is transferred between the spin chuck 15 and the main arm 4 when the substrate G is taken in and out of the rotor cup 10, the elevating drive unit 19 raises the rotating shaft 18 and the spin chuck 15 upward. And the spin chuck 15 is displaced to a position higher than the upper end of the cup CP.

On the other hand, a coating liquid supply device 60 for discharging a resist liquid onto the substrate G set on the spin chuck 15 is provided so as to straddle the rotor cup 10 in the Y direction.

In the coating liquid supply device 60, a resist pipe 61 is disposed in parallel with the upper end face of the rotor cup 10, and is disposed so as to cross the upper surface of the substrate G in the Y direction, and both ends of the resist pipe 61. It comprises leg members 64 and 65 for closing the portion and supporting the resist pipe 61. These leg members 64 and 65 are engaged with guide rails 71 and 72 of a moving device 70 described later, respectively.

The moving devices 70 and 70 are elongated box-shaped members, and are disposed one by one on both sides of the rotor cup 10 in the Y direction.
From the position of the edge remover ER to the position of the edge remover ER. Two elongated grooves are provided on the upper surface of the moving device 70 along the X direction.

These grooves are respectively provided in the coating liquid supply device 6
Guide rails 71 with which the 0 leg members 64 and 65 engage,
Guide rail 7 with which 72 and conveying members 80 and 81 engage
3,74.

Inside these moving devices 70, 70,
A known moving mechanism (not shown) such as a belt driving mechanism that transmits the driving force of the driving motor by an endless belt is provided, and the driving force of the driving motor is transmitted to the leg members 64 and 65, and the conveying members 80 and 81. Are independently moved in the X direction.

As shown in FIG. 3, a solvent pipe 62 and a gas pipe 63 are respectively disposed on both sides of the resist pipe 61 in the X direction. Each of the resist pipe 61, the solvent pipe 62, and the gas pipe 63 has a hollow tubular structure, and a plurality of predetermined pipes are provided at predetermined intervals in the Y direction on the lower surface, that is, the surface facing the substrate G held on the spin chuck 15. Openings are respectively provided to constitute resist nozzles 61a, 61b, 61c, solvent nozzles 62a, 62a, and gas nozzles 63a, 63a, respectively. These resist pipes 61,
The solvent supply pipe 62 and the gas pipe 63 have a resist supply pipe 6.
6. A solvent supply pipe 67, a gas supply pipe 68 are provided, and are respectively connected to a resist supply system, a solvent supply system, and a gas supply system (not shown). Resist solution,
A solvent and a gas containing a solvent vapor are supplied.

FIG. 6 is a partially enlarged vertical cross-sectional view of the substrate G and the coating liquid supply device 60. FIG. 7 shows these resist pipes 61, solvent pipes 62, and gas pipes 63 as viewed from below. It is a figure showing a state.

As shown in FIG. 6, the resist pipe 61
Has, for example, a trapezoidal or deformed hexagonal cross-sectional shape in which the lower part of a rectangular pipe is narrowed to form a taper, and the plurality of resist nozzles, for example, 3
Two resist nozzles 61a, 61b, 61c are provided at predetermined intervals in the Y direction. The resist nozzles 61a and 61b, and 61b and 61
When the processing agent supplied from the adjacent resist nozzles, that is, 61a and 61b, and 61b and 61c, respectively, is supplied to the substrate G, the processing agent and the processing agent supplied adjacent to each other in the Y direction. Is an interval that is connected and integrated on the substrate to be processed. The specific value of this interval is a design matter, and the viscosity of the processing agent,
The size is determined by the relationship between the size of the resist nozzle 61c, the gap between the resist nozzles 61a to 61c and the substrate G, the resist supply speed, and other parameters.

Each of the solvent pipe 62 and the gas pipe 68 is a round pipe, and has a plurality of openings formed on the lower surface side similarly to the resist pipe 61.
2a, 62a... And gas nozzles 63a, 63a.

In the rotor cup 10, the upper opening of the rotor cup body 10 is covered by a lid 12, and the lid 12 is detachably held by a lifting arm 13.

As shown in FIG. 3 and FIG.
Are two arms 13a, 1 holding the lid 12 at its tip.
3b and a connecting member 14 disposed between the two arms 13a and 13b and connecting the two arms 13a and 13b.

Then, the base side of the lifting arm 13, that is, the lid 12
Is extended to the inside of the cup lifter 30, and the lid 12 can be moved up and down by a lid elevating mechanism built in the cup lifter 30. For convenience of explanation, the lifting arm 13 and the cup lifter 30 are omitted in FIG.

A washing bath 20 for washing the resist nozzle 61a is provided between the rotor cup 10 and the cup lifter 30. The cleaning bath 20 will be described later.

FIG. 8 is a block diagram illustrating a control system of the coating processing unit (COT) according to the present embodiment.

As shown in FIG. 8, the rotor cup 10, the actuator AC, the coating liquid supply device 60, the moving device 70 for moving the coating liquid supply device 60, and the resist liquid for supplying the resist liquid to the coating liquid supply device 60. Supply system R
S, gas supply system G for supplying gas to coating liquid supply device 60
S and a solvent supply system SS for supplying a solvent to the coating liquid supply device 60 are connected to the control unit 100.
00 is controlled collectively.

The operation of the coating unit (COT) according to this embodiment will be described below.

In the coating processing unit (COT), the formation of the resist coating film on the substrate G is performed in two operations, that is, the operation of supplying the resist solution and the operation of diffusing the supplied resist solution.

First, the resist liquid is supplied onto the substrate G by moving the rotor cup 10 and the coating liquid supply device 60 relatively from the resist nozzles 61a to 61c so as to be substantially perpendicular to the surface of the substrate G. This is performed by discharging a liquid. In this operation, the resist liquid is applied to the substrate G
It is only necessary to cover the entire surface of the substrate.

FIG. 9 is a vertical sectional view in the Y direction schematically showing a state where the resist liquid is continuously supplied from the resist pipe 61 to the substrate G.

As shown in FIG. 9, the moving device 30 is operated to move the coating liquid supply device 60 and the rotor cup 10 in directions opposite to each other.
The substrate G is relatively moved with respect to a to 61c in the direction of the arrow in the figure.

In this state, the resist nozzles 61a to 61c
To supply a resist solution.

In this embodiment, the resist solution is supplied continuously. FIG. 10 is a view of the AA cut surface in the state of FIG. 9 viewed from the X direction. FIG. 11 is a view of the BB cut surface of the state of FIG.
FIG. 12 is a diagram of the CC cut surface in the state of FIG. 9 viewed from the X direction.

As shown in FIGS. 9 and 10, when the viscosity of the resist solution is appropriate, the resist solution continuously flows from each of the resist nozzles 61a to 61c of the resist pipe 61 to the surface of the substrate G.

At this time, as shown in FIG. 10, the resist liquid supplied to the surface of the substrate G is applied to each of the resist nozzles 61a to 61a.
The swelling occurs immediately below the portion 61c to form three resist solution islands separated from each other. Since the resist solution is not directly supplied to the portion between the islands, the surface of the substrate G is exposed.

As shown in FIG. 11, on the BB section,
The surface of the resist solution is rounded due to the surface tension and gravity of the resist solution, and although the space between the islands of the adjacent resist solution is somewhat narrowed, the surface of the substrate G still does not adhere to the surface and remains unified. It remains exposed.

Next, a swing operation is performed to diffuse the supplied resist liquid.

In the coating processing unit according to the present embodiment,
The swinging operation is performed by operating an actuator AC that is provided on the surface of the spin chuck 15 and contacts the lower surface of the substrate G in the drawing.

As shown in FIG. 11, when a voltage is applied to the actuator AC while the resist solution is placed on the surface of the substrate G in a state of being separated into three islands, the actuator AC generates vibration. Then, the substrate G in contact with the actuator AC and the resist liquid placed thereon are swung. Due to this swing, the resist liquid increases its fluidity, and its height in the Z direction decreases and spreads in the horizontal direction. At this time, as described above, the intervals at which the resist liquid is supplied onto the substrate G are such that the resist liquids are integrated on the surface of the substrate G by a thinning means such as an actuator.

Therefore, when the actuator is oscillated by the vibration from the actuator AC, the islands of the adjacent resist solution are connected to each other at their ends. At the same time, the exposed portion of the substrate G disappears, and the entire surface of the substrate G is covered with the resist solution. FIG. 12 shows this state. However, at this stage, the surface of the resist liquid is still wavy, and the film thickness is still thick and the uniformity is insufficient.

When the swinging is further continued, the film thickness is made uniform in the horizontal direction. FIGS. 13 and 14 show how the film thickness is reduced uniformly.

As shown in FIGS. 13 and 14, the film thickness is made uniform with the passage of time, and the film thickness is made uniform over the entire horizontal direction.

Although not used in this embodiment,
By using the solvent pipe 62 and the gas pipe 63 together, it is possible to reliably and uniformly form a thin film in a shorter time. FIG. 15 is a vertical sectional view schematically showing a state in which the gas pipe 22 and the solvent pipe 23 are operated.

That is, when the solvent is supplied from the solvent pipe 62 to the surface of the substrate G before the application of the resist to wet the substrate G, the solvent has a low surface tension, so that the solvent is widely diffused over the surface of the substrate G and the film is spread on the substrate surface. A thin solvent layer is formed. This solvent layer improves the compatibility between the resist solution to be supplied next and the substrate G. Next, a resist pipe 6 is formed on the solvent layer.
When the resist solution is supplied from No. 1, the resist solution quickly diffuses along the surface of the solvent layer and spreads throughout the solvent layer.

Therefore, the resist nozzles 61a to 61c
The resist liquid discharged from the substrate G onto the surface of the substrate G easily spreads on the surface of the substrate G within a very short time after the discharge.

As a result, in this state, the actuator 15
When it is swung by such a thinning means as described above, it spreads easily over the entire substrate G, and the adjacent resist liquids are connected and integrated to form a thin and uniform resist film.

On the other hand, when a gas containing a solvent vapor is ejected from the gas pipe 63, pressure acts on the liquid surface of the resist liquid supplied onto the substrate G, and the resist liquid is spread over the surface of the substrate G. Therefore, it is easier and faster to form a uniform and thin coating film.

In this case, it is effective to apply a gas to the ridge-shaped portion of the resist coating film having the corrugated shape and to spread the gas. Therefore, the opening of the gas pipe 63 is formed in the width direction of the substrate G in the width direction. It is preferable to dispose it at the same position as the opening of the resist pipe 61 in the (Y direction). Alternatively, the solvent or gas supplied from the solvent pipe 62 or the gas pipe 63 may be heated in advance, and the heat may be used to reduce the viscosity of the resist solution. Further, although omitted in the present embodiment, a heater such as a nichrome wire is built in the spin chuck 15 for holding the substrate G, and the substrate G is heated by this heater, and the resist solution is supplied onto the substrate G. It is also possible to make the viscosity lower when it is performed. In this case, it is preferable to use a rectangular spin chuck that is slightly larger than the substrate G so as to uniformly heat the rectangular substrate G, and to dispose a heater so that the entire spin chuck is uniformly heated.

As described above, in the coating processing unit according to this embodiment, the supply of the resist solution and the thinning of the supplied resist coating film are performed in separate operations, and the actual thinning is performed on the substrate G by the resist solution. Is performed after is supplied.

Therefore, the resist nozzles 61a to 61c
It is sufficient that the resist liquid discharged from the substrate G can be supplied to the surface of the substrate G, and since operations such as processing are not performed between the resist nozzles 61a to 61c and the substrate G, the machine of the resist nozzles 61a to 61c such as the shape and diameter of the nozzles is not performed. Accuracy and control accuracy such as a discharge amount and a discharge speed are not so strictly required.

Even if a large number of small-diameter nozzles are opened, the degree of losing the rigidity of the nozzle pipe 61 is low, so that the nozzle pipe 61 is hardly deformed.
It is easy to secure the dimensional accuracy of 1a to 61c.

Further, since a low-viscosity resist solution can be used, the problem of nozzle drying hardly occurs.

The present invention is not limited to the embodiment described in this specification.

For example, in the present embodiment, the resist nozzles 61a to 61c having three openings formed on the lower surface of the square resist pipe 61 are used. May be arranged in a line.

Further, in the first embodiment, circular nozzles 61a to 61c are used as the nozzles of the resist pipe 61. In addition, for example, a slit-shaped nozzle 61b as shown in FIG. It may be provided.

Further, in the first embodiment, only one resist pipe 61 is used, but two or more resist pipes 61, 61 'may be provided in the moving direction of the substrate G. In that case, as shown in FIG. 17, it is preferable that the opening position of the resist nozzle 61a be alternated between the two resist pipes 61 and 61 '. This is because, by adopting such an arrangement, the density of the swelling of the liquid surface of the resist liquid supplied onto the substrate G is reduced, and it is easy to make the film thickness uniform in the subsequent thinning step, which is convenient.

Next, a nozzle inspection mechanism mounted on the resist coating unit of this embodiment will be described. FIG. 18 is a perspective view showing a state where the solvent bath 20 is cut.

As shown in FIG. 18, the solvent bath 20 is provided with a housing 21 having a rectangular cross section. A washing roll 22 is disposed inside the housing 21 on the left side in the X direction in the figure. A discharge table 25 is provided on the right side.

The cleaning roll 22 extends over the entire Y direction of the housing 21 and has a size slightly larger than that of the resist pipe 61 where the resist nozzles 61a to 61c are provided. The cleaning roll rotates around a rotation shaft 22a fixed to the housing 21, and rotates in a direction indicated by an arrow in the drawing by a driving force transmitted from a driving force transmission mechanism (not shown). . Although not shown in FIG. 18, a solvent is accommodated inside the solvent bath 20, and the height of the liquid surface is determined by a discharge table 2 to be described later.
5 is high enough to expose the upper surfaces of the pressure sensors 26, 26,.

A wiper 23 for removing the resist solution on the surface of the cleaning roll 22 is provided at a position diagonally to the left of the cleaning roll 22 in the drawing. The wiper 23 is housed in the wiper box 24 so as to be able to protrude and retract, and in response to a signal from the control unit 100, the tip of the wiper 23 is brought into contact with the surface of the cleaning roll 22 or housed in the wiper box 24. And so on.

On the other hand, the discharge table 25 is a low shelf-shaped member disposed at the right side of the housing 21 in the figure, and has a plurality of pressure sensors 26, 2 on the upper surface thereof in the Y direction.
6 are arranged. These pressure sensors 26, 26
Are arranged at positions corresponding to the respective resist nozzles 61a to 61c. When the resist pipe 61 comes to a position immediately above the discharge table 25, the resist nozzle 61a
.. Are arranged at positions where each of the pressure sensors 26, 26. Each of these pressure sensors 26, 26,... Is separately connected to the control unit 100, and the control unit 100 detects the discharge pressure detected by each of these pressure sensors 26, 26,. It has become recognizable.

Next, the operation of the nozzle inspection mechanism will be described.

When the discharge of the resist onto the substrate G is completed, the control unit 100 drives the moving device to move the resist pipe 61.
To the cleaning position, that is, the position where the resist nozzles 61a to 61c are located directly above the rotation shaft 22a of the cleaning roll 22. In this state, the resist liquid is discharged from the resist nozzles 61a to 61c toward the surface of the cleaning roll 22, and the resist liquid is attached to the surface of the cleaning roll 22. At this time, the cleaning roll 22 is rotating, and the cleaning roll takes up the excess resist liquid adhering to the surfaces of the resist nozzles 61a to 61c with the adhering resist liquid as a tip.
On the other hand, at this time, the wiper 23 protrudes from the wiper box 24, and its tip is in contact with the surface of the cleaning roll. Therefore, the excess resist liquid taken up from the resist nozzles 61a to 61c is stripped off by the wiper 23, and the surface of the cleaning roll without the resist liquid faces the resist nozzles 61a to 61c, and the extra resist liquid is wound again. And remove it.

After cleaning is performed at the cleaning position for a predetermined time, the resist pipe 61 is moved rightward in the figure,
That is, the resist nozzles 61a to 61c are
Are moved to a position facing 6, 26. In this state, dummy dispense, that is, discharge of a resist solution is performed from the resist nozzles 61a to 61c, and the pressure sensors 26 and
The resist liquid is discharged toward 26. Each of the pressure sensors 26, 26,.
The discharge pressure of the resist liquid discharged from c is detected, and the result is transmitted to the control unit 100.

In the control section 100, the pressure sensors 26, 26,.
From each of the resist nozzles 61a to 61
The discharge pressure of c is recognized. Then, it is determined whether or not each ejection pressure is within a specified range, and each of the registration nozzles 61a to 61c is determined.
Understand the state of. As a result, when it is determined that the discharge pressure is low and any one of the resist nozzles 61a to 61c is clogged, the resist pipe 61 is returned to the above-described cleaning position again, and the cleaning operation is performed again. This operation is repeated until the result of the dummy dispensing at the standby position is good.

On the other hand, as a result of the dummy dispensing, if none of the resist nozzles 61a to 61c has the above, the resist pipe 61 is moved in the X direction in the drawing to supply the resist liquid to the substrate G.

If there is an abnormality in the nozzle 21a,
A warning by light or sound may be issued.

As described above, according to this nozzle inspection mechanism, it is possible to detect whether or not the resist nozzles 61a to 61c are clogged before the resist is discharged onto the substrate G. The production of defective products can be prevented beforehand, and the yield can be improved, and the production cost per product can be reduced.

(Second Embodiment) Next, a coating unit according to a second embodiment of the present invention will be described.

The description of the portions of the coating processing unit according to the second embodiment that are common to the coating processing unit according to the first embodiment will be omitted.

[0153] The coating unit (CO
In T), instead of disposing an actuator (vibrator) on the surface of the upper surface of the spin chuck 15 that contacts the substrate G,
By rotating the spin chuck 15 at high speed, the thickness of the resist coating film on the substrate G is reduced and made uniform.

The coating unit (CO
In T), the substrate G is held on the spin chuck 15, and in this state, the resist liquid is discharged onto the substrate while moving the resist pipe 61 in the X direction in FIG.

In this state, the resist coating film formed on the substrate is a coating film having an uneven thickness as shown in FIG.

Next, the control unit sends the spin chuck 1
A voltage is applied to the motor 16 for driving the substrate 5 to rotate the substrate G and the resist coating film formed on the surface thereof at a high speed. By this high-speed rotation, the thickness of the resist coating film is reduced and made uniform, and the thickness as shown in FIG.
In addition, a resist film having a uniform thickness can be obtained.

In this embodiment, the spin chuck 1
5, the substrate G is rotated at a high speed. Before the high-speed rotation, the spin chuck 15 itself is inverted around the rotation axis 18 at a small angle and in a short cycle to thereby reverse the rotation with the actuator. Similarly, the substrate G can be swung. In this case, since it is not necessary to use an additional member called an actuator, it is preferable in terms of structure and cost. (Third Embodiment) Next, a coating processing unit according to a third embodiment of the present invention will be described.

The description of the portions of the coating processing unit according to the third embodiment that are common to the coating processing unit according to the above embodiment will be omitted.

FIG. 18 is a vertical sectional view schematically showing a structure around a resist pipe 61 of a coating unit (COT) according to the second embodiment of the present invention.

In this coating unit (COT), the supply of the resist solution from the resist pipe 61 is performed intermittently, and the solvent pipe 62 is located upstream of the resist pipe 61 in the direction of movement of the substrate G (left side in the figure). ).

As shown in FIG. 18A, the coating unit (COT) has a structure in which the solvent is first discharged from the solvent nozzle 62a onto the surface of the substrate G, and then the resist liquid is discharged and supplied. .

Hereinafter, the manner in which the resist liquid discharged from the resist nozzle 61a is uniformly thinned on the substrate G will be described in chronological order.

FIGS. 19 (a) to 20 (f) are vertical cross-sectional views schematically showing changes until the resist liquid discharged from the resist pipe 61 is thinned on the substrate G. FIG.

The substrate G held on the spin chuck 15
A predetermined amount of solvent is discharged from the solvent nozzle 62a onto the upper surface of the substrate. The discharged solvent spreads on the surface of the substrate G and forms a thin solvent layer.

Next, the resist pipe 61 and the solvent pipe 6
2 is moved to the left in the figure. For convenience of explanation,
FIGS. 19 and 20 are described assuming that the substrate G is moved rightward in the figure.

With the above movement, the substrate G is moved to the resist pipe 6
1 and to the right with respect to the solvent pipe 62 in the figure. With this movement, the solvent layer moves to a position immediately below the resist nozzle 61a. In this state, the resist liquid is discharged from the resist nozzle 61a (FIG. 19).
(B)). When the resist liquid discharged from the resist nozzle 61a comes into contact with the solvent layer, the resist liquid is immediately diffused into the solvent layer and spreads on the surface of the substrate G along the solvent layer (FIG. 19 (c)). Dissolve completely with the above resist solution,
A spread resist film is formed on the surface of the substrate G. (Figure 2
0 (d)) Similarly, a solvent is discharged on the left side of the substrate G in the drawing to form a thin solvent layer, and a resist solution is discharged from above, and a thin resist coating film is sequentially formed from right to left in the drawing. It is formed (FIG. 20E). On the other hand, during this time, the resist coating film formed on the substrate G spreads on the substrate G,
The resist coatings adjacent to each other in the X direction and the Y direction overlap each other at the ends thereof and are integrated (FIG. 20).
(F)) In this way, the resist coating films formed by the resist liquid intermittently discharged on the substrate G are connected to each other, and the film thickness becomes thinner and uniform, and the resist having a thin and uniform film thickness on the substrate G surface is formed. A coating film is formed (FIG. 20 (f)).

Thereafter, the film is made more uniform and thinner by swinging with the actuator AC or rotating the substrate G at a high speed by the spin chuck 15.

[0168]

As described above in detail, according to the first aspect of the present invention, the supply of the treatment agent and the thinning of the treatment agent are divided into separate operations, and the supply of the treatment agent is performed by the treatment supply means. On the other hand, the treatment agent was thinned by a thinning means.
Therefore, the conditions of the mechanical accuracy and the operational accuracy required in each of the operation steps are relaxed.

That is, it is not necessary to manage the shape and size of the nozzle, the gap between the processing agent nozzle and the substrate to be processed more strictly than in the continuous slot.

In addition, since the processing agent is supplied to a plurality of positions with respect to the surface of the substrate to be processed, a processing agent having a relatively low viscosity can be used. Therefore, since the solvent content is high and the treating agent is hard to dry, nozzle clogging does not easily occur.

Further, since the influence of the viscosity of the treating agent on the film thickness is low, the viscosity of the treating agent can be easily controlled.

Also, since a low-viscosity treating agent can be used,
Even when the film is rotated and thinned after the processing, the film can be thinned at a low rotation speed and can be applied to a large LCD substrate.

Furthermore, since it has a low viscosity, it can be easily removed even if it adheres to the rotor cup.

Further, since it is supplied separately to a plurality of positions,
It is not necessary to use a processing agent nozzle having a large opening such as a slot, and the processing agent nozzle does not increase in size. Further, since the film is thinned by being rotated in a closed state, an airflow is not disturbed, and a coating film having a uniform film thickness can be obtained.

According to the second aspect of the present invention, since the means for oscillating the substrate to be processed is employed as the thinning means, it is possible to surely reduce the thickness with a simple structure. In addition, the term “oscillation” used herein refers to a case where the actuator is vibrated in a linear direction using an actuator (vibrating body) or the like.
This includes both cases where the spin chuck is angularly vibrated in a minute angle range.

According to the third aspect of the present invention, since the means for rotating the substrate to be processed is adopted as the thinning means, the thinning can be surely achieved with a simple structure. For example, when a spin chuck is used, a conventional apparatus can be used as it is, and there is no need to add new parts or elements, so that there is no need for new capital investment and almost no increase in production cost.

When a spin chuck is used,
After the application of the processing agent is rocked by angular vibration within a small angle, the spin chuck can be rotated at a high speed to shake off and remove the excess processing agent.

According to the present invention as set forth in claim 4, claim 1 is as follows.
In the coating apparatus according to any one of the above (1) to (3), the processing agents supplied adjacent to each other are supplied at an interval such that the processing agents are integrated on the surface of the substrate to be processed by the thinning means. Therefore, since the processing agent supplied onto the processing target machine board is surely integrated, a uniform and thin coating film is more reliably formed.

According to the fifth aspect of the present invention, there is further provided a means for supplying a solvent to the surface of the substrate before the processing agent is supplied. By supplying this solvent, the surface of the substrate to be treated is wetted with the solvent in advance, and the treatment agent and the substrate to be treated are easily blended, and the treatment agent runs on the surface of the substrate to be treated through the solvent layer and is rapidly diffused. As a result, the coating film can be more reliably made uniform.

According to the present invention, as means for swinging the substrate to be processed, there is provided an actuator provided on the holding member, and a control section for driving the actuator. Therefore, the coating film can be reliably made uniform with a simple structure.

According to the present invention, a rotatable spin chuck is employed as the holding means, and this spin chuck is also used as the thinning means. Therefore, the coating film can be surely made uniform without adding components.

It is also possible to use this spin chuck as the rocking means and to rotate it at a high speed after oscillating it in a small angle range. By doing so, the coating film can be made even more uniform and the film can be made thinner.

According to the present invention described in claim 8, according to claim 6,
Or a solvent nozzle for supplying a solvent to the surface of the substrate to be processed. By supplying this solvent, the surface of the substrate to be treated is wetted with the solvent in advance, and the treatment agent and the substrate to be treated are easily blended, and the treatment agent runs on the surface of the substrate to be treated through the solvent layer and is rapidly diffused. With this configuration, in addition to the function of the sixth or seventh aspect, the coating film can be more reliably made uniform.

According to the ninth aspect of the present invention, a sixth aspect is provided.
In the coating apparatus according to any one of the above items (1) to (8), the processing agents supplied adjacent to each other are supplied by the thinning means at an interval such that the processing agents are integrated on the surface of the substrate to be processed. Therefore, since the processing agent supplied onto the processing target machine board is surely integrated, a uniform and thin coating film is more reliably formed.

According to the tenth aspect of the present invention, a standby position is provided adjacent to the holding member or the spin chuck, and a pressure sensor is disposed on the processing agent nozzle facing surface at the standby position. Detects the discharge pressure of each processing agent nozzle. Then, a monitoring device for monitoring the operation state of each of the processing agent nozzles based on the detected discharge pressure is provided.

Since the operating state of each processing agent nozzle is constantly monitored by this monitoring device, when one of the processing agent nozzles is clogged, the clogged processing agent nozzle can be found quickly, and there is a problem in the processing agent nozzle. Since the production is prevented from being performed as it is, the yield is improved, and the production efficiency and the production cost are improved.

According to the eleventh aspect of the present invention, the supply of the treatment agent and the thinning of the treatment agent are divided into separate operations, and the supply of the treatment agent is performed by the treatment supply means. ,
This was done by means of thinning. Therefore, the conditions of the mechanical accuracy and the operational accuracy required in each of the operation steps are relaxed.

In addition, since the processing agent is supplied to a plurality of positions with respect to the surface of the substrate to be processed, a processing agent having a relatively low viscosity can be used. Therefore, since the solvent content is high and the treating agent is hard to dry, nozzle clogging does not easily occur.

Further, since the influence of the viscosity of the treating agent on the film thickness is low, the viscosity of the treating agent can be easily controlled.

Further, since a low-viscosity treating agent can be used,
Even when the film is rotated and thinned after the processing, the film can be thinned at a low rotation speed and can be applied to a large LCD substrate.

Furthermore, since it has a low viscosity, it can be easily removed even if it adheres to the rotor cup.

Also, since it is supplied separately to a plurality of positions,
It is not necessary to use a processing agent nozzle having a large opening such as a slot, and the processing agent nozzle does not increase in size. Further, since the film is thinned by being rotated in a closed state, an airflow is not disturbed, and a coating film having a uniform film thickness can be obtained.

According to the twelfth aspect of the present invention, in addition to the coating method of the eleventh aspect, the method further comprises a step of rotating the substrate to be processed to make the treatment agent thinner uniformly. Therefore, a uniform and thin coating film is more reliably formed.

[Brief description of the drawings]

FIG. 1 is a perspective view of a coating and developing apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view of the coating / developing apparatus according to the first embodiment of the present invention.

FIG. 3 is a plan view of the resist coating unit according to the first embodiment of the present invention.

FIG. 4 is a side view of the resist coating unit according to the first embodiment of the present invention.

FIG. 5 is a perspective view of a resist coating unit according to the first embodiment of the present invention.

FIG. 6 is a vertical sectional view of the resist coating unit according to the first embodiment of the present invention.

FIG. 7 is a view of the application liquid supply device according to the first embodiment of the present invention as viewed from below.

FIG. 8 is a block diagram of a resist coating unit according to the first embodiment of the present invention.

FIG. 9 is a vertical sectional view of the resist pipe according to the first embodiment of the present invention.

FIG. 10 is a vertical sectional view of the resist coating unit according to the first embodiment of the present invention.

FIG. 11 is a vertical sectional view of the resist coating unit according to the first embodiment of the present invention.

FIG. 12 is a vertical sectional view of the resist coating unit according to the first embodiment of the present invention.

FIG. 13 is a vertical sectional view of the resist coating unit according to the first embodiment of the present invention.

FIG. 14 is a vertical sectional view of the resist coating unit according to the first embodiment of the present invention.

FIG. 15 is a vertical sectional view of the resist coating unit according to the first embodiment of the present invention.

FIG. 16 is a view showing a modification of the resist pipe according to the first embodiment of the present invention.

FIG. 17 is a view showing a modification of the resist pipe according to the first embodiment of the present invention.

FIG. 18 is a developed perspective view of the nozzle inspection mechanism according to the first embodiment of the present invention.

FIG. 19 is a vertical sectional view showing an operation state of the resist coating unit according to the third embodiment of the present invention.

FIG. 20 is a vertical sectional view showing an operation state of the resist coating unit according to the third embodiment of the present invention.

[Explanation of symbols]

 G substrate 10 rotor cup 15 spin chuck 20 solvent bath 26 pressure sensor 64, 65 leg member 60 coating liquid supply device 61 resist pipes 61a to 61c resist nozzle RS resist supply system AC actuator 70 moving device 71 to 74 guide rail 63 gas pipe GS Gas supply system 62 Solvent pipe SS Solvent supply system 100 Control unit COT coating unit

Continued on the front page. (72) Inventor Masafumi Nomura 272, Heisei, Takao, Otsu-cho, Otsu-cho, Kikuchi-gun, Kumamoto Prefecture Inside the Otsu Office of Tokyo Electron Kyushu Co., Ltd. 272-4 Tokyo Electron Kyushu Co., Ltd. Otsu Office (72) Inventor Oden Den Kumamoto Pref.

Claims (12)

[Claims] A holding unit for holding a substrate to be processed; a supply unit for supplying a processing agent to a plurality of positions on the surface of the substrate at predetermined intervals; A coating device comprising: means for moving the target agent; and a thinning means for diffusing the processing agent to the surface of the substrate to be processed in a closed state to uniformly thin the substrate. 2. The coating apparatus according to claim 1, wherein said thinning means is means for swinging said substrate to be processed. 3. The coating apparatus according to claim 1, wherein said thinning means is means for rotating said substrate to be processed. 4. The coating apparatus according to claim 1, wherein an interval between the processing agents supplied adjacent to each other is set such that the processing agents are arranged on the surface of the substrate to be processed by the thinning means. The coating device is characterized in that the intervals are such that the components are integrated. 5. The coating apparatus according to claim 1, further comprising: means for supplying a solvent to the surface of the substrate before the processing agent is supplied. Coating equipment. 6. A holding member for holding a substrate to be processed, and a plurality of processing agent nozzles directed to the surface of the substrate to be processed and provided at predetermined intervals in a first direction across the surface of the substrate to be processed. A treatment agent supply system that supplies a treatment agent to the treatment agent nozzle, a guide that is disposed in a second direction different from the first direction, and that movably supports the holding member or the treatment agent nozzle, A movement system that relatively moves the holding member and the processing agent nozzle, an actuator disposed on the holding member, a container that stores the holding member and the actuator, a lid that seals the container, And a control unit for synchronously driving the treatment agent supply system, the moving system and the actuator. 7. A spin chuck that rotatably holds a substrate to be processed, a container that houses the spin chuck, a lid that seals the container, and a surface of the substrate to be processed that is directed to a surface of the substrate to be processed. A plurality of processing agent nozzles provided at predetermined intervals in a first direction across the processing agent, a processing agent supply system for supplying a processing agent to the processing agent nozzle, and a processing agent supply system arranged in a second direction different from the first direction. A guide that movably supports the spin chuck or the processing agent nozzle; a moving system that relatively moves the spin chuck and the processing agent nozzle; a processing agent supply system, the moving system, and And a control unit for driving the spin chuck in synchronization with the control unit. 8. The coating apparatus according to claim 6, wherein a solvent nozzle is provided adjacent to the processing agent nozzle on the upstream side in the moving direction of the substrate to be processed, and a solvent supply for supplying a solvent to the solvent nozzle. A coating system, further comprising: a control unit configured to drive the moving system. 9. The coating apparatus according to claim 6, wherein an interval between the processing agents supplied adjacent to each other is set such that the processing agents are disposed on the surface of the substrate to be processed by the thinning means. The coating device is characterized in that the intervals are such that the components are integrated. 10. The coating apparatus according to claim 6, wherein: a standby position adjacent to the holding member or the spin chuck; and a processing agent nozzle facing surface at the standby position. A coating apparatus, further comprising: a pressure sensor that detects a discharge pressure of a processing agent nozzle; and a monitoring device that monitors an operation state of each of the processing agent nozzles based on the detected discharge pressure. 11. A step of supplying a processing agent to a plurality of positions at predetermined intervals on the surface of a substrate to be processed, and a step of rotating the substrate to be processed in a sealed state to connect the processing agents together to integrate them. And a coating method comprising: 12. A step of supplying a processing agent to a plurality of positions at predetermined intervals on the surface of a substrate to be processed, and swinging the substrate to be processed in a hermetically sealed state to connect and integrate the processing agents. A coating method, comprising: rotating the substrate to be processed to make the processing agent thinner evenly.