JP4022282B2

JP4022282B2 - Coating device

Info

Publication number: JP4022282B2
Application number: JP08813597A
Authority: JP
Inventors: 幸治木▲崎▼; 由雄谷口; 一夫木瀬
Original assignee: Screen Holdings Co Ltd; Dainippon Screen Manufacturing Co Ltd
Current assignee: Screen Holdings Co Ltd; Dainippon Screen Manufacturing Co Ltd
Priority date: 1997-04-07
Filing date: 1997-04-07
Publication date: 2007-12-12
Anticipated expiration: 2017-04-07
Also published as: JPH10284381A

Description

【０００１】
【発明の属する技術分野】
本発明は、塗布装置、特に、基板の表面にフォトレジスト等の塗布液を塗布する塗布装置に関する。
【０００２】
【従来の技術】
基板表面に塗布液を塗布する装置として、特開平４−６１９５５号公報や特開平１−１３５５６５号公報に示されたスピンコータが知られている。このスピンコータでは、回転可能なスピンチャック上に基板が保持され、基板の中央部にノズルから処理液が滴下される。その後、基板をスピンチャックとともに回転させて基板表面中央部の塗布液を遠心力によって基板表面全体に拡散させるとともに、基板上の塗布液の膜が所望の厚みとなるように余剰の塗布液を基板外へ振り切る。これにより、基板表面全体に塗布液が塗布される。なお、遠心力によって基板中央から振り切られた塗布液は周囲に飛散し、塗布処理終了後に回収される。
【０００３】
このような従来のスピンコータでは、基板周囲に塗布液が飛散するので、基板表面に膜を形成するのに必要な塗布液の量よりも多めに塗布液を供給しなければならない。その結果、塗布液の消費量が多くなる。
【０００４】
そこで特開平７−２８４７１５号公報に示されるように、スリットノズル等で基板表面を走査することによって基板表面の全域よりもやや小さい所定の範囲に比較的薄く塗布液を供給しておき、その後、この基板を回転させ、前記塗布液を基板表面全体に拡散させる技術も提供されている。
【０００５】
【発明が解決しようとする課題】
前記のような技術によれば、予め比較的広い領域に塗布液を供給しているので、基板の回転で塗布液を基板面に塗り広げる必要がなく、そのため塗布液の供給を薄く少なくすることができ、塗布液の消費を抑えることができる。しかし、このような技術によっても、遠心力によって基板周囲に飛散する塗布液の量は少なくなく、さらなる消費量の低減が求められている。
【０００６】
本発明の課題は、基板表面に均一に塗布液を供給しつつ、塗布液の消費量を従来の装置に比較してさらに抑えることにある。
【０００７】
【課題を解決するための手段】
請求項１に記載の塗布装置は、基板を回転させて基板表面に塗布液を塗布するための塗布装置であって、塗布液供給手段と、移動手段と、間欠領域塗布手段と、回転手段とを備えている。塗布液供給手段は第１の方向に長い領域に所定の間隔をあけて又は連続的に塗布液を吐出可能な手段である。移動手段は塗布液供給手段を基板表面に対して第１の方向と交差する第２の方向に相対移動させる手段である。間欠領域塗布手段は塗布液供給手段を基板表面に対して相対移動させながら基板の回転中心を含む間欠領域に塗布液を塗布する手段である。回転手段は間欠領域に塗布液が塗布された基板を回転させて間欠領域に塗布された塗布液を基板の表面全体に拡散させる手段である。そして、塗布液供給手段は第１の方向に長い連続する領域に塗布液を供給するものである。また、間欠領域塗布手段は、塗布液供給手段の移動中に塗布液の吐出及び停止を繰り返して、第１の方向に長い塗布領域を第２の方向に間欠的に形成するものである。
【０００８】
この装置では、塗布液供給手段によって、基板表面における第１の方向に長い領域に所定の間隔をあけて又は連続的に塗布液が供給される。そして、この塗布液供給手段を第１の方向と交差する第２の方向に基板に対して相対移動させる。このとき、第１の方向に間隔をあけて塗布液が供給される場合は、相対移動の際に連続的に塗布液を供給することにより、第２の方向に長い塗布領域が第１の方向に間欠的に形成される。また、第１の方向に連続的に塗布液が供給される場合は、相対移動の際に間欠的に塗布液を供給することにより、第１の方向に長い塗布領域が第２の方向に間欠的に形成される。なお、いずれの場合も、回転手段で基板を回転させる際における基板の回転中心には塗布液が供給されるようにする。
【０００９】
このようにして間欠領域に塗布液が塗布された基板を回転させ、基板表面全体に均一に塗布液を拡散させる。ここでは、間欠領域に塗布液を供給するので、基板表面の全域よりもやや小さい範囲全部に塗布液を供給する前記公報に記載の場合に比較して、塗布液の消費量をさらに少なくすることが可能である。また、基板上に供給された塗布液は、基板の回転により基板上の未供給の領域へも塗り広げられ、むらなく塗布される。
【００１０】
請求項２に記載の塗布装置は、請求項１の装置において、塗布液供給手段は、第１の方向に長い連続するスリット状開口を有するノズルを有している。この場合は、連続するスリット状開口を有するノズルにより塗布液を供給するので、第１の方向における塗布液の供給量のバラツキを少なくでき、基板表面により均一に塗布液を供給できる。
【００１１】
請求項３に記載の塗布装置は、請求項１の装置において、塗布液供給手段は、第１の方向に沿って近接して配置された多数の小孔を有するノズルを有している。この場合は、連続するスリット状開口に比較して塗布液の消費量をより抑えることができる。
【００１２】
請求項４に記載の塗布装置は、基板を回転させて基板表面に塗布液を塗布するための塗布装置であって、請求項１の装置と同様の、塗布液供給手段と、移動手段と、間欠領域塗布手段と、回転手段とを備えている。そして、塗布液供給手段は、第１の方向に沿った長い領域に所定の間隔をあけて塗布液を供給するものであり、間欠領域塗布手段は、塗布液供給手段の移動中に塗布液の吐出及び停止を繰り返して、第１及び第２の両方向に間欠的な塗布領域を形成する。
【００１３】
この場合は、請求項１の装置と同様の作用に加え、第１及び第２の両方向に間欠的に塗布領域が形成されるので、基板の表面により均一に塗布できるとともに、塗布液の消費量をより抑えることができる。
【００１４】
請求項５に記載の塗布装置は、基板を回転させて基板表面に塗布液を塗布するための塗布装置であって、塗布液供給手段と、移動手段と、間欠領域塗布手段と、回転手段とを備えている。塗布液供給手段は第１の方向に長い領域に所定の間隔をあけて塗布液を吐出可能である。移動手段は塗布液供給手段を基板表面に対して第１の方向と交差する第２の方向に相対移動させる。間欠領域塗布手段は塗布液供給手段を基板表面に対して相対移動させながら基板の回転中心を含む間欠領域に塗布液を塗布する。回転手段は間欠領域に塗布液が塗布された基板を回転させて間欠領域に塗布された塗布液を基板の表面全体に拡散させる。そして、間欠領域塗布手段は、塗布液供給手段の移動中に塗布液を連続的に供給して第２の方向に長い塗布領域を第１の方向に間欠的に形成するものであり、塗布液供給手段は、第１の方向に間欠的に形成された複数のスリット状開口を有するノズルを有している。
【００１５】
この場合は、請求項１の装置と同様の作用に加え、１つのノズルに複数のスリット状開口が設けられているので、容易に間隔をあけて塗布液を供給できるとともに、各開口からの供給量を容易に均一にできる。
【００１６】
請求項６に記載の塗布装置は、基板を回転させて基板表面に塗布液を塗布するための塗布装置であって、塗布液供給手段と、移動手段と、間欠領域塗布手段と、回転手段とを備えている。塗布液供給手段は第１の方向に長い領域に所定の間隔をあけて塗布液を吐出可能である。移動手段は塗布液供給手段を基板表面に対して第１の方向と交差する第２の方向に相対移動させる。間欠領域塗布手段は塗布液供給手段を基板表面に対して相対移動させながら基板の回転中心を含む間欠領域に塗布液を塗布する。回転手段は間欠領域に塗布液が塗布された基板を回転させて間欠領域に塗布された塗布液を基板の表面全体に拡散させる。そして、間欠領域塗布手段は、塗布液供給手段の移動中に塗布液を連続的に供給して第２の方向に長い塗布領域を第１の方向に間欠的に形成するものであり、塗布液供給手段は、第１の方向に並べて配置されそれぞれ所定の長さのスリット状開口を有する複数のノズルを有している。
【００１７】
この場合は、請求項１の装置と同様の作用に加え、各ノズルの開口の形状等を調整することにより、例えば中心付近の供給量を周辺部分に比較して多くする等の、第１の方向の塗布液の供給量を容易に制御できる。
【００１８】
請求項７に記載の塗布装置は、請求項４の装置において、塗布液供給手段は、第１の方向に間欠的に形成された複数のスリット状開口を有するノズルを有している。この場合は、１つのノズルに複数のスリット状開口が設けられているので、容易に間隔をあけて塗布液を供給できるとともに、各開口からの供給量を容易に均一にできる。
【００１９】
請求項８に記載の塗布装置は、請求項４の装置において、塗布液供給手段は、第１の方向に並べて配置されそれぞれ所定の長さのスリット状開口を有する複数のノズルを有している。この場合は、各ノズルの開口の形状等を調整することにより、例えば中心付近の供給量を周辺部分に比較して多くする等の、第１の方向の塗布液の供給量を容易に制御できる。
【００２０】
請求項９に記載の塗布装置は、請求項６又は８の装置において、塗布液供給手段は、複数のノズルからの塗布液吐出量をそれぞれ制御するための吐出量制御手段をさらに有している。この場合は、各ノズルの開口の形状等が同じであっても、供給量を制御できる。
【００２１】
請求項１０に記載の塗布装置は、基板を回転させて基板表面に塗布液を塗布するための塗布装置であって、請求項１の装置と同様の、塗布液供給手段と、移動手段と、間欠領域塗布手段と、回転手段とを備えている。そして、塗布液供給手段は、それぞれ第１の方向に間欠的に形成された複数のスリット状開口を有し第２の方向に並べて配置された第１ノズル及び第２ノズルを有している。、また、間欠領域塗布手段は、第１ノズルによって基板上に第２の方向に長い連続した塗布領域を第１の方向に間欠的に形成した後、基板を９０゜回転させて第２ノズルによって基板上に第２の方向に長い連続した塗布領域を第１の方向に間欠的に形成する。
【００２２】
この場合は、請求項１の装置と同様の作用に加え、第１ノズルの開口の長さと第２ノズルの開口の長さを調節でき、基板の塗布領域の幅を、縦と横とで変えることができる。
【００２３】
請求項１１に記載の塗布装置は、請求項１０の装置において、基板は矩形形状であり、間欠領域塗布手段は、基板の回転中心を含む領域と、基板の一対の辺に沿った領域と、基板の一対の他の辺に沿った領域とで形成される間欠領域に塗布液を塗布する。
【００２４】
この場合は、後行程で基板を回転させて塗布液を拡散させる場合に、より容易に塗布液を均一に拡散させることができる。
【００２５】
請求項１２に記載の塗布装置は、請求項１から１１のいずれかの装置において、塗布液供給手段は回転手段に対向可能なように配置されている。
【００２６】
この場合は、回転手段に基板を保持させて間欠領域に塗布液を塗布することができ、１ステージで間欠領域の塗布及び回転による拡散が行えるので、装置全体のスペースが小さくなる。
【００２７】
請求項１３に記載の塗布装置は、基板を回転させて基板表面に塗布液を塗布するための塗布装置であって、請求項１の装置と同様の、塗布液供給手段と、移動手段と、間欠領域塗布手段と、回転手段とを備えている。そしてさらに、塗布液供給手段に対向可能で基板を保持する第１基板保持部と、間欠領域塗布手段によって塗布液が塗布された基板を保持して回転させる第２基板保持部とを備えている。
【００２８】
この場合は、請求項１と同様の作用に加え、間欠領域の塗布と回転による拡散とがそれぞれ別の場所で、すなわち、２ステージによって基板への塗布が行われることとなるので、１ステージにおける処理時間が短くなり、全体のスループットが向上する。
【００２９】
請求項１４に記載の塗布装置は、請求項１３の装置において、塗布液供給手段は、第１の方向に長い連続する領域に塗布液を供給するものであり、間欠領域塗布手段は、塗布液供給手段の移動中に塗布液の吐出及び停止を繰り返して、第１の方向に長い塗布領域を第２の方向に間欠的に形成する。
【００３０】
この場合も前記同様に、基板表面の全域よりも小さい範囲全部に塗布液を供給する場合に比較して、塗布液を消費量をさらに少なくすることが可能である。
【００３１】
請求項１５に記載の塗布装置は、請求項１３に記載の装置において、塗布液供給手段は、第１の方向に沿った長い領域に所定の間隔をあけて塗布液を供給するものであり、間欠領域塗布手段は、塗布液供給手段の移動中に塗布液を連続的に供給して第２の方向に長い塗布領域を第１の方向に間欠的に形成する。
【００３２】
この場合は、請求項１の場合と逆方向の間欠領域に塗布液が塗布されることになるが、同様に、塗布液の消費量を抑えることができる。
【００３３】
請求項１６に記載の塗布装置は、請求項１３に記載の装置において、塗布液供給手段は、第１の方向に沿った長い領域に所定の間隔をあけて塗布液を供給するものであり、間欠領域塗布手段は、塗布液供給手段の移動中に塗布液の吐出及び停止を繰り返して、第１及び第２の両方向に間欠的な塗布領域を形成する。
【００３４】
この場合は、第１及び第２の両方向に間欠的に塗布領域が形成されるので、基板の表面により均一に塗布できるとともに、塗布液の消費量をより抑えることができる。
【００３５】
請求項１７に記載の塗布装置は、請求項１３の装置において、間欠領域塗布手段は、基板表面の同心の複数の環状間欠領域に塗布液を塗布する。
【００３６】
この場合は、後行程で基板を回転させて塗布液を拡散させる場合に、より容易に塗布液を均一に拡散させることができる。
【００３７】
請求項１８に記載の塗布装置は、請求項１３の装置において、塗布液供給手段は第１の方向に長い領域に所定の間隔をあけて塗布液を吐出可能な第１ノズル部と、第２の方向に長い領域に所定の間隔をあけて塗布液を吐出可能な第２ノズル部とを有している。そして、移動手段は第１ノズル部を基板表面に対して第２の方向に相対移動させ、かつ第２ノズル部を基板表面に対して第１の方向に相対移動させるものである。
【００３８】
この場合は、塗布液供給手段を基板に対して相対移動させ、描画するように塗布領域を形成できる。したがって、同心の複数の環状間欠領域に塗布液を塗布すること等が自在に行える。
【００３９】
請求項１９に記載の塗布装置は、請求項１３の装置において、塗布液供給手段は、それぞれ第１の方向に間欠的に形成された複数のスリット状開口を有し第２の方向に並べて配置された第１ノズル及び第２ノズルを有している。また、間欠領域塗布手段は、第１ノズルによって基板上に第２の方向に長い連続した塗布領域を第１の方向に間欠的に形成した後、基板を９０゜回転させて第２ノズルによって基板上に第２の方向に長い連続した塗布領域を第１の方向に間欠的に形成する。
【００４０】
ここでは、第１ノズルの開口の長さと第２ノズルの開口の長さを調節でき、基板の塗布領域の幅を、縦と横とで変えることができる。
【００４１】
【実施の形態】
［第１実施形態］
図１において、本発明の第１実施形態が採用された塗布装置は、処理部１と、レジスト液圧送部２と、モータ機構２６とを主に備えている。この塗布装置では、図２に示すような矩形のガラス基板Ｐに対してフォトレジスト（以下、単にレジスト液と記す）が塗布され、コーティング処理が行われる。
【００４２】
処理部１は、基板Ｐを真空吸着し水平に保持し得る基板保持部４と、基板保持部４に保持された基板Ｐに対してレジスト液を供給するレジスト液供給部５とを備えている。基板保持部４は、回転自在であり、モータ機構２６によって水平回転させられるようになっている。基板保持部４の周囲には、回転時のレジスト液の飛散を防止するためのカップ６が配置されている。
【００４３】
レジスト液供給部５は、図２及び図３に示すように、基板Ｐの上面に沿って基板Ｐの短辺方向（図１の奥行き方向；第１の方向）に延びるノズル部７を有している。ノズル部７は、図４に示すように断面が倒立家型の部材である。ノズル部７の底面は、基板Ｐの長手方向両端から中央に向かって低くなるように傾斜している。また、ノズル部７は基板Ｐの短辺長さよりも短い長さのスリット（開口）２０を有しており、ノズル支持アーム８の下端に固定されている。ノズル支持アーム８の上端部は、移動フレーム９に上下移動可能に支持されている。移動フレーム９は、移動ガイド１０に移動可能に支持されている。移動ガイド１０は、基板Ｐの長手方向（図１の左右方向；第２の方向）に沿って延びている。
【００４４】
図４に示すように、ノズル部７内部において、スリット２０の途中にはスリット２０よりも幅の広い液溜め３１が形成されている。この液溜め３１は、レジスト液供給配管１６（後述）から供給されたレジスト液をノズル部７の長手方向（図４の奥行き方向）に均一に拡散させるためのものである。
【００４５】
レジスト液圧送部２は、図１に示すように、レジスト液を貯溜したガラス瓶１２を収納し、かつ内部が気密に封止された加圧タンク１１を有している。加圧タンク１１の上部には、図示しない窒素ガス源から加圧された窒素ガスが供給される加圧配管１３が開口している。加圧配管１３の途中には、給排用三方弁１４及びレギュレータ１５が加圧タンク１１側からこの順に配置されている。なお、三方弁１４は、窒素ガスを加圧タンク１１に供給するかまたは他に排気するかを選択できる。レジスト液供給配管１６は、その一端がガラス瓶１２の底面近傍に達しており、他端がノズル部７に接続されている。レジスト液供給配管１６の途中には、レジスト液供給弁１８及びサックバックバルブ１７がガラス瓶１２側からこの順で配置されている。
【００４６】
さらに、この塗布装置は、図５に示すように、マイクロコンピュータからなる制御部２３を備えている。制御部２３には、基板保持部４、ノズル支持アーム８及び移動フレーム９の駆動部、給排用三方弁１４、レジスト液供給弁１８、サックバックバルブ１７及びモータ機構２６が接続されている。さらに、制御部２３には、ノズル支持アーム８や移動フレーム９の位置の検出を行うセンサ等の各種センサ（図示せず）、及びその他の入出力装置が接続されている。
【００４７】
塗布装置の動作を、図６及び図７に示す制御フローチャートにしたがって説明する。ステップＳ１では、塗布装置全体の初期設定を行う。次に、ステップＳ２に移行し、図示しない搬送機構が基板Ｐを塗布装置に搬入するのを待つ。基板Ｐが搬入されると、ステップＳ３に移行し、基板保持部４により基板Ｐを真空吸着する。
【００４８】
続いて、ステップＳ４でコーティング処理を行う。コーティング処理では、図７に示すように、始めにステップＳ１０でノズル部７をスタート位置に移動させる。ここでは、ノズル部７が図８に示す点線位置（すなわち基板Ｐの左端から基板Ｐ側に所定距離進入した位置）に配置される。このとき、ノズル部７の底面が基板Ｐから所定の隙間をあけて配置される。ステップＳ１１では、ノズル部７を基板Ｐの長手方向に水平移動させる。そして、ステップＳ１２において、ノズル部７を移動させながら、スリット２０からのレジスト液の吐出及び停止を所定の周期で繰り返す。これにより、レジスト液は基板Ｐに対して間欠的に供給されることになる。レジスト液の吐出動作は、三方弁１４を供給側に切り換えさらにレジスト液供給弁１８を開いて、ガラス瓶１２からレジスト液をノズル部７に供給することで行う。また、このステップＳ１２におけるレジスト液の吐出の停止は、レジスト液供給弁１８を閉じることによって行う。なお、このステップＳ１２においてレジスト液の供給を行う場合に、基板Ｐの長手方向の寸法、ノズル部７の移動速度、吐出・停止の繰り返し周期、及び吐出時間を考慮して、基板Ｐの回転中心（図８のＯ）には必ずレジスト液が供給されるように制御する。
【００４９】
このような処理を実行することによって、図８に示すように、基板Ｐの短辺方向に長い塗布領域Ｃが基板Ｐの長手方向に間欠的に形成される。すなわち、基板Ｐの回転中心Ｏを含む間欠領域にレジスト液が供給される。
【００５０】
ステップＳ１３では、ノズル部７が図８に矢印で示すように移動して基板Ｐの予め設定された塗布領域の右端に到達するのを待つ。ノズル部７が基板Ｐの右端に到達するとステップＳ１４に移行し、三方弁１４を排気側に切り換えるとともにレジスト液供給弁１８を閉じてレジスト液の供給を完全に停止する。ステップＳ１５では、ノズル部７の移動を停止させる。そしてステップＳ１６で、図３に示すように、ノズル部７を基板Ｐの右端斜め上方の退避位置に退避させる。
【００５１】
次に、ステップＳ１７においてモータ機構２６を駆動し、図３に示す状態で基板保持部４を所定の回転速度で回転させる。ステップＳ１８では所定の回転処理時間が経過するのを待つ。この間、基板Ｐの間欠領域に供給されたレジスト液は遠心力によって外周方向に移動し、その結果基板Ｐの表面全域にレジスト液が行き渡り、間欠領域以外の領域にもレジスト液が拡散される。次にステップＳ１８からステップＳ１９に移行し、モータ機構２６の回転を停止して図６のメインルーチンに戻る。
【００５２】
図６のステップＳ５では、基板保持部４による基板Ｐの吸着を解除する。ステップＳ６では、図示しない搬送機構が基板Ｐを次の処理のために排出するのを待つ。基板Ｐが搬出されれば、ステップＳ２に戻り、次の基板Ｐが搬入されるのを待つ。なお、本実施形態において、サックバックバルブ１７によるレジスト液の引き戻し動作は、ステップＳ１２における周期的な吐出の停止毎に行ってもよいし、ステップＳ１２では行わずにステップＳ１４での吐出停止時にのみ行うようにしてもよい。
【００５３】
〔変形例〕
（ａ）図７のステップＳ１２におけるレジスト液の吐出・停止の繰り返し周期を、基板Ｐの位置によって変えてもよい。
【００５４】
図９に示す例では、基板Ｐの中央部における塗布領域Ｃ０の幅を、周辺部に比較して大きくしている。すなわち、中央部分に比較的多量のレジスト液を供給しても、遠心力によって基板外部に飛散する量が少ない。しかし、周辺部分に供給されたレジスト液は基板の外部に飛散しやすい。そこで、この図９に示す例では、レジスト液の供給量を、中央部は多く、周辺部に行くほど少なくしている。したがって、各塗布領域の幅は、塗布領域Ｃ０＞塗布領域Ｃ１＞塗布領域Ｃ２＞塗布領域Ｃ３となっている。
【００５５】
このような例では、レジスト液をより効率的に基板Ｐ全体に塗布することができ、レジスト液の消費量をより抑えることができる。
【００５６】
（ｂ）前記例では、ノズル部７に、基板の短辺方向に延びるスリット２０を形成したが、図１０（ａ）に示すように、スリットに代えて、基板の短辺方向に沿って近接して配置された複数の小孔４１を有するノズル部４０を用いてもよい。また、図１０（ｂ）に示すように、基板の短辺方向中央部にスリット２０を、その両側に複数の小孔４１を有するノズル部４０としてもよい。なお、図１０（ａ）（ｂ）は、ノズル部４０を底面から見た図であり、矢印Ｍはノズル部４１の移動方向を示している。
【００５７】
［第２実施形態］
図１１に本発明の第２実施形態による塗布装置に適用されるノズル部５０を示す。この例では、ノズル部５０はその延びる方向（基板の短辺方向）に沿って複数のスリット５１を有している。ここでは、各スリット５１の長さはいずれも同じである。
【００５８】
このようなノズル部５０を用いてレジスト液を供給することにより、図１２に示すように、基板Ｐの長手方向に長い塗布領域Ｃを短辺方向に間欠的に形成することができる。図１１及び１２における矢印Ｍはノズル部５０の移動方向を示している。なお、このようなノズル部５０を用いる場合は、先の例における図７のステップＳ１２において、レジスト液を連続して吐出する。他の処理は先の例と同じである。もちろん、この例においても、基板Ｐの回転中心Ｏにはレジスト液が必ず供給されるようにスリット５１を配置する。
【００５９】
〔変形例〕
（ａ）この第２実施形態の変形例として、ノズル部５０の各スリットの長さを変えて、前述のように、中央部の塗布領域の幅が周辺部の塗布領域の幅に比較して大きくなるようにしてもよい。
【００６０】
（ｂ）図１２に示すような間欠領域にレジスト液を塗布する場合、図１３（ａ）に示すように、それぞれが前述のようなスリット５１を有する複数のノズル部６０ａ，６０ｂ，６０ｃ，６０ｄ，６０ｅを、基板の短辺方向に並べて配置してもよい。この場合、中央部のノズル部６０ｃにレジスト液供給弁６１を連結し、中間部の１対のノズル部６０ｂ，６０ｄにレジスト液供給弁６２を連結し、最も外側の１対のノズル部６０ａ，６０ｅにレジスト液供給弁６３を連結して、各ノズル部６０ａ〜６０ｅに供給するレジスト液の量を個別に制御できるようにするのが望ましい。もちろん、各ノズル部のそれぞれにレジスト液供給弁を連結して、すべてのノズル部に対するレジスト液供給量を個別に制御できるようにしてもよい。
【００６１】
（ｃ）図１３（ｂ）に示すように、中央部にスリット５１を有するノズル部６０ｆと、両端側に複数の小孔４１を有するノズル部６０ｇとを組み合わせて用いてもよい。
【００６２】
（ｄ）この第２実施形態のノズル部５０，６０を用いて、第１実施形態と同様にレジスト液の吐出及び停止を周期的に繰り返すことによって、第１の方向と第２の方向の両方向に間欠的な塗布領域を形成することができる。また、ノズル部６０ｆ，６０ｇを用いて、その両方又はいずれか一方を、吐出及び停止を周期的に繰り返すようにしてもよい。
【００６３】
［第３実施形態］
前記第１及び第２実施形態では、一方向の長い塗布領域を他方向に間欠的に形成したが、この実施形態では、同心の環状領域を間欠的に形成している。
【００６４】
この場合のノズル部の構成を図１４に示す。この図に示されたノズル部７０は、基板Ｐの回転中心Ｏを中心に回転自在となっており、半径方向に長く延びている。そして、その底部には複数のスリット７１ａ，７１ｂ，７１ｃ，７１ｄがノズル部７０の延びる方向に沿って配置されている。スリット７１ａは回転中心Ｏを含むように配置されており、また、各スリットの長さは、周辺部にいくに従って短くなっている。すなわち、スリットの長さは、スリット７１ａ＞スリット７１ｂ＞スリット７１ｃ＞スリット７１ｄとなっている。なお、ノズル部７０は、基板Ｐの搬送等に妨げとならないように、基板Ｐの上方から退避した位置と、図１４に示す位置とを取り得るように移動自在である。
【００６５】
このようなノズル部７０を回転させて得られる間欠塗布領域を図１５に示す。塗布領域Ｃ０はスリット７１ａによって、塗布領域Ｃ１はスリット７１ｂによって、塗布領域Ｃ２はスリット７１ｃによって、塗布領域Ｃ３はスリット７１ｄによってレジスト液が供給されて形成されたものである。なお、領域Ｃ３を形成するスリット７１ｄは基板の長辺部分で基板の表面上から外れてしまうが、その間はスリット７１ｄからのレジスト液の供給のみ停止できるように弁等を設けることが望ましい。
【００６６】
このような実施形態では、複数の環状の塗布領域が同心に形成されるので、回転によって各塗布領域のレジスト液が拡散しやすく、少ないレジスト液でより均一に塗布を行うことができる。
【００６７】
〔変形例〕
（ａ）図１６に示すように、２つのノズル部７５，７６を用いて複数の環状の塗布領域を同心に形成することもできる。この例では、第１ノズル部７５は、基板Ｐの短辺方向に延びるように形成されており、基板Ｐ上方で基板Ｐの長手方向に移動可能である。また、第２ノズル部７６は、基板Ｐの長手方向に延びるように形成されており、基板Ｐ上方で基板Ｐの短辺方向に移動可能である。そして、第１ノズル部７５は基板Ｐの短辺方向に沿って配置された複数のスリット７５ａ〜７５ｃを有している。中央部のスリット７５ａは最も長さが長く、それに隣接する中間部の１対のスリット７５ｂはこれに次いで長く、最も周辺部の１対のスリット７５ｃは最も短くなっている。すなわち、各スリットの長さは、スリット７５ａ＞１対のスリット７５ｂ＞１対のスリット７５ｃとなっている。また、第２ノズル部７６は基板Ｐの長手方向に沿って配置されたそれぞれ１対のスリット７６ｂ，７６ｃを有しており、中央側のスリット７６ｂの長さは第１ノズル部７５のスリット７５ｂの長さと同じで、外側のスリット７６ｃの長さは第１ノズル部７５のスリット７５ｃの長さと同じになっている。
【００６８】
そして、各スリットには、個別にレジスト液供給弁（図示せず）が連結されており、それぞれのスリットからのレジスト液の供給タイミングを制御できるようになっている。
【００６９】
このようなノズル部によって環状の塗布領域を形成する場合は、まず図１７（ａ）に示すように、第１ノズル部７５を基板Ｐの長手方向に移動させながら各スリットからのレジスト液の供給タイミングを制御して、基板の長手方向に長い塗布領域を短辺方向に間欠的に形成する。この場合、最も外側の塗布領域を最も長く、中間部の塗布領域をその次に長く、中央部の塗布領域を最も短くする。次に、図１７（ｂ）に示すように、第２ノズル部７６を基板Ｐの短辺方向に移動させながら各スリットからのレジスト液の供給タイミングを制御して、基板Ｐの短辺方向に長い塗布領域を基板Ｐの長手方向に間欠的に形成する。これらの塗布領域によって、中央部の塗布領域Ｃ０と、中間部の環状の塗布領域Ｃ１と、外周部の環状の塗布領域Ｃ２とが同心に形成される。そして、各塗布領域は、外側にいくに従ってその幅が狭くなっている。
【００７０】
（ｂ）図１７（ｂ）に示すような環状の間欠塗布領域は、１つのノズル部によっても形成できる。すなわち、まず、図１８（ａ）に示すように、ノズル部７５を基板Ｐの長手方向に移動させながら各スリット７５ａ〜７５ｃからのレジスト液の供給タイミングを制御して、基板Ｐの長手方向に長い塗布領域を基板Ｐの短辺方向に間欠的に形成する。次に、基板Ｐを９０゜回転する。この状態を図１８（ｂ）に示している。次に、先とは逆方向にノズル部７５を移動させながらレジスト液の供給タイミングを制御して、先に形成された塗布領域を連結するように塗布領域を形成する。これにより、図１７の例とほぼ同様の複数の環状の塗布領域を同心に形成できる。
【００７１】
（ｃ）また、図１９に示すように、基板上方でＸ，Ｙ方向に移動可能でかつ所定の幅のスリット８１を有するノズル部８０を用いて、複数の環状の塗布領域を同心に形成することもできる。すなわち、ノズル部８０を図の矢印に沿って描画するように移動させることにより、基板の回転中心Ｏを含む塗布領域Ｃ０と、その周囲の塗布領域Ｃ１と、外周部の塗布領域Ｃ２とを、同心に形成することができる。
【００７２】
（ｄ）また、第２実施形態における図１１に示したノズル部５０を、基板Ｐの回転中心Ｏの上方を通る位置に停止させて設け、ノズル部５０から液を吐出しつつ基板Ｐを１８０゜回転させることによっても、塗布領域を同心に形成することができる。さらに、図１１に示したノズル部５０を半分の長さのものとし、基板Ｐの回転中心Ｏの上方を通る位置に停止させ、基板Ｐを３６０゜回転させることによっても塗布領域を同心に形成できる。
【００７３】
［第４実施形態］
図２０に第４実施形態を示す。この例では、基板Ｐの長手方向に並ぶ２つのノズル部８３，８４を有している。第１ノズル部８３は基板Ｐの短辺方向に沿って２つのスリット８３ａ，８３ｂを有しており、第２ノズル部８４は基板Ｐの短辺方向に沿って３つのスリット８４ａ，８４ｂ，８４ｃを有している。スリット８３ａとスリット８４ａとは基板の長手方向において一部が重なるがずれて配置されている。また、スリット８３ｂとスリット８４ｃとの関係も同様である。また、スリット８４ｂは基板Ｐの短辺方向の中央部に形成されている。そして、各スリットの幅（長さ）寸法は、スリット８４ｂ＞スリット８４ａ＝８４ｃ＞スリット８３ａ＝８３ｂとなっている。
【００７４】
このような実施形態では、まず第１及び第２ノズル部８３，８４を基板の長手方向（図２０の矢印Ｍ方向）に移動させながら、第１ノズル部８３のみを用いて基板Ｐの長手方向に長い塗布領域を基板Ｐの短辺方向に間欠的に形成する。次に、基板Ｐを９０゜回転させ、前記両ノズル部８３，８４を先とは逆方向（図２１の矢印方向）に移動させながら第２ノズル部８４のみを用いて基板の短辺方向に長い塗布領域を基板Ｐの長手方向に間欠的に形成する。
【００７５】
このようにして形成される間欠塗布領域を図２１に示す。図において、実線で示す領域は第１ノズル部８３によって形成された塗布領域であり、一点鎖線で示す領域は第２ノズル部８４によって形成されるべき塗布領域である。
【００７６】
この場合は、基板Ｐにおける長手方向の塗布領域と短辺方向の塗布領域の幅や位置をノズル部のスリットを変えることによって個別に制御することができる。
【００７７】
［第５実施形態］
前記各実施形態では、基板Ｐにレジスト液を塗布する工程と基板Ｐを回転させてレジスト液を拡散させる工程とを１つのステージで行うようにしたが、これらを別々のステージで行うようにしてもよい。
【００７８】
この例を図２２に示す。図に示す装置は、塗布処理ステージ８５と、回転拡散ステージ８６とを有している。そして、これらの各ステージ間で基板を搬送するための搬送ロボット（図示せず）が設けられている。
【００７９】
塗布処理ステージ８５は、例えば前記第１実施形態で示したようなノズル部７と、基板保持装置９０とを有している。ここでの基板保持装置９０は回転しない。ノズル部７は、基板保持装置９０の表面に沿って図の矢印方向に移動可能である。またこのノズル部７には、前述したような、レジスト液をノズル部７に供給するための各装置が連結されている。
【００８０】
また、回転拡散ステージ８６は、基板を保持して回転可能な基板回転装置９１を有している。この基板回転装置９１は、図示しないモータ等の回転機構によって回転させられるようになっている。
【００８１】
このような装置では、塗布処理ステージ８５において、前述したような間欠領域にレジスト液が塗布される。そして、この間欠領域にレジスト液が塗布された基板が回転拡散ステージ８６に搬送され、このステージにおいて基板が回転されて、間欠領域に塗布されたレジスト液が基板表面の全体に拡散される。
【００８２】
ここでは、１つのステージで塗布及び回転を行う場合に比較して、各ステージでの処理時間が短くなる。したがって、装置のスループットが向上し、全体の処理時間が短縮される。
【００８３】
【発明の効果】
以上のように、本発明によれば、従来の装置に比較して塗布液の消費量を抑えることができる。
【図面の簡単な説明】
【図１】本発明の第１の実施形態による塗布装置のブロック模式図。
【図２】塗布処理時のノズル部の部分斜視図。
【図３】塗布処理時の一状態を示す概略正面図。
【図４】図２のIV−IV断面図。
【図５】塗布装置の制御構成を示すブロック模式図。
【図６】塗布装置の制御フローチャート。
【図７】塗布装置の制御フローチャート。
【図８】塗布処理時の一状態を示す平面図。
【図９】第１実施形態の変形例による塗布状態を示す基板の平面図。
【図１０】本発明の第１実施形態の他の変形例によるノズル部の底面図。
【図１１】本発明の第２実施形態によるノズル部の底面図。
【図１２】前記第２実施形態による塗布状態を示す基板の平面図。
【図１３】前記第２実施形態の変形例によるノズル部の模式図。
【図１４】本発明の第３実施形態によるノズル部の平面図。
【図１５】前記第３実施形態による塗布状態を示す基板の平面図。
【図１６】前記第３実施形態の変形例によるノズル部の平面図。
【図１７】前記第３実施形態の変形例による塗布状態を示す基板の平面図。
【図１８】前記第３実施形態の別の変形例によるノズル部及び塗布状態を示す平面図。
【図１９】前記第３実施形態のさらに別の変形例によるノズル部及び塗布状態を示す平面図。
【図２０】本発明の第４実施形態によるノズル部及び基板の平面図。
【図２１】前記第４実施形態による塗布状態の平面図。
【図２２】本発明の第５実施形態による塗布装置の正面模式図。
【符号の説明】
１処理部
４基板保持部
５レジスト液供給部
７，４０，５０，６０ａ〜６０ｅ，７０，７５，７６，８０，８３，８４ノズル部
１８，６１，６２，６３レジスト液供給弁
２０，５１，７１ａ〜７１ｄ，７５ａ〜７５ｃ，７６ｂ，７６ｃ，８０ａ，８３ａ，８３ｂ，８４ａ〜８４ｃスリット
２３制御部
９０基板保持装置
９１基板回転装置[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a coating apparatus, and more particularly to a coating apparatus that coats a coating liquid such as a photoresist on the surface of a substrate.
[0002]
[Prior art]
  As an apparatus for applying a coating solution to a substrate surface, spin coaters disclosed in Japanese Patent Laid-Open Nos. 4-61955 and 1-135565 are known. In this spin coater, the substrate is held on a rotatable spin chuck, and the processing liquid is dropped from the nozzle onto the center of the substrate. Thereafter, the substrate is rotated together with the spin chuck so that the coating solution at the center of the substrate surface is diffused over the entire substrate surface by centrifugal force, and an excess coating solution is applied so that the coating solution film on the substrate has a desired thickness. Shake out. Thereby, a coating liquid is apply | coated to the whole substrate surface. In addition, the coating liquid shaken off from the center of the substrate by centrifugal force is scattered around and collected after the coating process is completed.
[0003]
  In such a conventional spin coater, since the coating liquid is scattered around the substrate, it is necessary to supply the coating liquid more than the amount of the coating liquid necessary for forming a film on the substrate surface. As a result, the consumption of the coating liquid increases.
[0004]
  Therefore, as shown in JP-A-7-284715, the coating liquid is supplied relatively thinly to a predetermined range slightly smaller than the entire area of the substrate surface by scanning the substrate surface with a slit nozzle or the like, and then There is also provided a technique of rotating the substrate and diffusing the coating solution over the entire surface of the substrate.
[0005]
[Problems to be solved by the invention]
  According to the technique as described above, since the coating liquid is supplied to a relatively wide area in advance, it is not necessary to spread the coating liquid on the substrate surface by rotating the substrate. And consumption of the coating solution can be suppressed. However, even with such a technique, the amount of the coating solution scattered around the substrate by centrifugal force is not small, and further reduction of consumption is required.
[0006]
  An object of the present invention is to further suppress the consumption of the coating liquid as compared with a conventional apparatus while supplying the coating liquid uniformly to the substrate surface.
[0007]
[Means for Solving the Problems]
  The coating apparatus according to claim 1 is a coating apparatus for rotating the substrate to apply the coating liquid onto the surface of the substrate, the coating liquid supplying means, the moving means, the intermittent area coating means, and the rotating means. It has. The coating liquid supply means is a means capable of discharging the coating liquid at a predetermined interval or continuously in a region long in the first direction. The moving means is means for moving the coating liquid supply means relative to the substrate surface in a second direction intersecting the first direction. The intermittent area applying means is means for applying the coating liquid to the intermittent area including the center of rotation of the substrate while moving the coating liquid supply means relative to the substrate surface. The rotating means is means for rotating the substrate coated with the coating liquid in the intermittent region and diffusing the coating liquid coated in the intermittent region over the entire surface of the substrate.The coating solution supply means supplies the coating solution to a continuous region that is long in the first direction. In addition, the intermittent area application unit repeatedly discharges and stops the application liquid during the movement of the application liquid supply unit, and intermittently forms an application area that is long in the first direction in the second direction.
[0008]
  In this apparatus, the coating liquid is supplied by a coating liquid supply means at a predetermined interval or continuously in a region long in the first direction on the substrate surface. Then, the coating liquid supply means is moved relative to the substrate in a second direction that intersects the first direction. At this time, in the case where the coating liquid is supplied with an interval in the first direction, by continuously supplying the coating liquid at the time of relative movement, the coating area long in the second direction is in the first direction. Formed intermittently. In addition, when the coating liquid is continuously supplied in the first direction, the coating area that is long in the first direction is intermittent in the second direction by supplying the coating liquid intermittently during the relative movement. Formed. In either case, the coating liquid is supplied to the center of rotation of the substrate when the substrate is rotated by the rotating means.
[0009]
  In this way, the substrate on which the coating liquid is applied to the intermittent region is rotated, and the coating liquid is uniformly diffused over the entire surface of the substrate. Here, since the coating liquid is supplied to the intermittent region, the consumption of the coating liquid is further reduced as compared with the case described in the above publication in which the coating liquid is supplied to the entire range slightly smaller than the entire area of the substrate surface. Is possible. In addition, the coating solution supplied onto the substrate is spread evenly on the unsupplied region on the substrate by the rotation of the substrate, and is applied evenly..
[0010]
ContractClaim2The coating apparatus according to claim1In this apparatus, the coating solution supply means has a nozzle having a continuous slit-like opening that is long in the first direction. In this case, since the coating liquid is supplied by the nozzle having the continuous slit-like opening, the variation in the supply amount of the coating liquid in the first direction can be reduced, and the coating liquid can be supplied uniformly to the substrate surface.
[0011]
  Claim3The coating apparatus according to claim1In this apparatus, the coating liquid supply means has a nozzle having a large number of small holes arranged close to each other in the first direction. In this case, the consumption of the coating liquid can be further suppressed as compared with a continuous slit-shaped opening..
[0012]
The coating apparatus according to claim 4 is a coating apparatus for rotating the substrate to apply the coating liquid onto the substrate surface, the same as the apparatus of claim 1, a coating liquid supply means, a moving means, Intermittent area application means and rotation means are provided. The coating liquid supply means supplies the coating liquid at a predetermined interval in a long area along the first direction, and the intermittent area coating means is configured to apply the coating liquid while the coating liquid supply means is moving. Discharging and stopping are repeated to form intermittent application regions in both the first and second directions.
[0013]
In this case, in addition to the operation similar to that of the apparatus of claim 1, since the application region is intermittently formed in both the first and second directions, it can be uniformly applied to the surface of the substrate and the amount of application liquid consumed. Can be further suppressed.
[0014]
  The coating apparatus according to claim 5 is a coating apparatus for rotating the substrate to apply the coating liquid onto the substrate surface.PaintedA cloth liquid supply means, a moving means, an intermittent area applying means, and a rotating means are provided.The coating liquid supply means can discharge the coating liquid at a predetermined interval in a region long in the first direction. The moving means moves the coating liquid supply means relative to the substrate surface in a second direction that intersects the first direction. The intermittent area coating means applies the coating liquid to the intermittent area including the center of rotation of the substrate while moving the coating liquid supply means relative to the substrate surface. The rotating means rotates the substrate on which the coating solution is applied to the intermittent region, and diffuses the coating solution applied to the intermittent region over the entire surface of the substrate.And,whileThe missing area coating means continuously supplies the coating liquid during the movement of the coating liquid supply means to intermittently form a coating area long in the second direction in the first direction. Has a nozzle having a plurality of slit-like openings formed intermittently in the first direction.
[0015]
In this case, in addition to the operation similar to that of the apparatus of claim 1, since a plurality of slit-shaped openings are provided in one nozzle, the coating liquid can be easily supplied at intervals, and the supply from each opening The amount can be made uniform easily.
[0016]
  The coating apparatus according to claim 6 is a coating apparatus for rotating the substrate to apply the coating liquid onto the substrate surface.PaintedA cloth liquid supply means, a moving means, an intermittent area applying means, and a rotating means are provided.The coating liquid supply means can discharge the coating liquid at a predetermined interval in a region long in the first direction. The moving means moves the coating liquid supply means relative to the substrate surface in a second direction that intersects the first direction. The intermittent area coating means applies the coating liquid to the intermittent area including the center of rotation of the substrate while moving the coating liquid supply means relative to the substrate surface. The rotating means rotates the substrate on which the coating solution is applied to the intermittent region, and diffuses the coating solution applied to the intermittent region over the entire surface of the substrate.And,whileThe missing area coating means continuously supplies the coating liquid during the movement of the coating liquid supply means to intermittently form a coating area long in the second direction in the first direction. Has a plurality of nozzles arranged side by side in the first direction and each having a slit-like opening of a predetermined length.
[0017]
In this case, in addition to the operation similar to that of the apparatus of the first aspect, by adjusting the shape or the like of the opening of each nozzle, for example, the supply amount in the vicinity of the center is increased as compared with the peripheral portion. The supply amount of the coating liquid in the direction can be easily controlled.
[0018]
  The coating apparatus according to claim 7 is the claim4In this apparatus, the coating liquid supply means has a nozzle having a plurality of slit-like openings formed intermittently in the first direction. In this case, since a plurality of slit-shaped openings are provided in one nozzle, it is possible to easily supply the coating liquid at intervals, and to easily make the supply amount from each opening uniform.
[0019]
  The coating apparatus according to claim 8 is the claim4In this apparatus, the coating liquid supply means has a plurality of nozzles arranged side by side in the first direction and having slit-shaped openings each having a predetermined length. In this case, the supply amount of the coating liquid in the first direction can be easily controlled by adjusting the shape and the like of the opening of each nozzle, for example, by increasing the supply amount near the center compared to the peripheral portion. .
[0020]
  The coating apparatus according to claim 9 is the claim6 or 8In this apparatus, the coating liquid supply means further includes a discharge amount control means for controlling the coating liquid discharge amounts from the plurality of nozzles. In this case, the supply amount can be controlled even if the shape of the opening of each nozzle is the same.
[0021]
The coating apparatus according to claim 10 is a coating apparatus for rotating the substrate to apply the coating liquid on the surface of the substrate, the same as the apparatus of claim 1, a coating liquid supply means, a moving means, Intermittent area application means and rotation means are provided. The coating liquid supply means has a first nozzle and a second nozzle, each having a plurality of slit-like openings formed intermittently in the first direction and arranged side by side in the second direction. Further, the intermittent area coating means intermittently forms a continuous coating area long in the second direction on the substrate by the first nozzle in the first direction, and then rotates the substrate by 90 ° to rotate the substrate by the second nozzle. A continuous coating region long in the second direction is intermittently formed on the substrate in the first direction.
[0022]
In this case, in addition to the operation similar to that of the apparatus of the first aspect, the length of the opening of the first nozzle and the length of the opening of the second nozzle can be adjusted, and the width of the coating area of the substrate is changed vertically and horizontally. be able to.
[0023]
  The coating apparatus according to claim 11 is the apparatus according to claim 10.The substrate has a rectangular shape,Intermittent area application means is substrateAre formed by a region including the center of rotation, a region along a pair of sides of the substrate, and a region along a pair of other sides of the substrate.Apply the coating solution to the intermittent area.
[0024]
  In this case, when the coating liquid is diffused by rotating the substrate in the subsequent process, the coating liquid can be more easily diffused uniformly.
[0025]
  Claim12The coating apparatus according to claim 1 is from11In any of these apparatuses, the coating liquid supply means is disposed so as to be opposed to the rotating means.
[0026]
  In this case, the substrate can be held by the rotating means and the coating solution can be applied to the intermittent region, and the intermittent region can be applied and diffused by rotation in one stage, thereby reducing the space of the entire apparatus.
[0027]
  The coating apparatus according to claim 13 is for rotating the substrate to apply the coating liquid onto the substrate surface. The coating apparatus includes a coating liquid supply unit, a moving unit, an intermittent region coating unit, and a rotating unit, similar to the apparatus of claim 1. In addition, a first substrate holding unit that can be opposed to the coating solution supply unit and holds the substrate, and a second substrate holding unit that holds and rotates the substrate coated with the coating solution by the intermittent region coating unit. .
[0028]
In this case, in addition to the same operation as in the first aspect, the application of the intermittent region and the diffusion by the rotation are performed in different places, that is, the application to the substrate is performed by two stages. Processing time is shortened and overall throughput is improved.
[0029]
A coating apparatus according to a fourteenth aspect is the apparatus according to the thirteenth aspect, wherein the coating liquid supply means supplies the coating liquid to a continuous area long in the first direction, and the intermittent area coating means is a coating liquid. By repeatedly discharging and stopping the coating liquid during the movement of the supply means, a coating region that is long in the first direction is intermittently formed in the second direction.
[0030]
Also in this case, as described above, it is possible to further reduce the consumption of the coating liquid as compared with the case where the coating liquid is supplied to the entire range smaller than the entire area of the substrate surface.
[0031]
The coating apparatus according to claim 15 is the apparatus according to claim 13, wherein the coating liquid supply means supplies the coating liquid at a predetermined interval in a long region along the first direction. The intermittent area application means continuously supplies the application liquid during the movement of the application liquid supply means to intermittently form an application area that is long in the second direction in the first direction.
[0032]
In this case, the coating liquid is applied to the intermittent region in the reverse direction to that of the first aspect, but similarly, the consumption of the coating liquid can be suppressed.
[0033]
The coating apparatus according to claim 16 is the apparatus according to claim 13, wherein the coating liquid supply means supplies the coating liquid at a predetermined interval in a long region along the first direction. The intermittent area application unit repeatedly discharges and stops the application liquid during the movement of the application liquid supply unit to form intermittent application areas in both the first and second directions.
[0034]
In this case, since the application region is intermittently formed in both the first and second directions, it can be applied more uniformly on the surface of the substrate, and the consumption of the application liquid can be further suppressed.
[0035]
According to a seventeenth aspect of the present invention, in the apparatus of the thirteenth aspect, the intermittent region applying means applies the coating liquid to a plurality of concentric annular intermittent regions on the substrate surface.
[0036]
In this case, when the coating liquid is diffused by rotating the substrate in the subsequent process, the coating liquid can be more easily diffused uniformly.
[0037]
  The coating apparatus according to claim 18 is the apparatus according to claim 13,The coating liquid supply means can discharge the coating liquid at a predetermined interval in a long area in the second direction, and a first nozzle part capable of discharging the coating liquid at a predetermined distance in a long area in the first direction. And a second nozzle portion. AndTransportation means1st nozzle partAgainst the substrate surfaceFirstMove in the direction of 2And moving the second nozzle portion relative to the substrate surface in the first direction.Is.
[0038]
In this case, the coating region can be formed so as to draw by moving the coating solution supply means relative to the substrate. Therefore, it is possible to freely apply the coating liquid to a plurality of concentric annular intermittent regions.
[0039]
The coating apparatus according to claim 19 is the coating apparatus according to claim 13, wherein the coating liquid supply means has a plurality of slit-like openings formed intermittently in the first direction, and is arranged in the second direction. The first nozzle and the second nozzle are provided. Moreover, the intermittent area | region application means formed the continuous application area | region long in the 2nd direction on the board | substrate intermittently in the 1st direction with the 1st nozzle. Thereafter, the substrate is rotated by 90 °, and a continuous coating region long in the second direction is intermittently formed in the first direction on the substrate by the second nozzle.
[0040]
Here, the length of the opening of the first nozzle and the length of the opening of the second nozzle can be adjusted, and the width of the coating region of the substrate can be changed vertically and horizontally.
[0041]
Embodiment
  [First Embodiment]
  In FIG. 1, the coating apparatus in which the first embodiment of the present invention is employed mainly includes a processing unit 1, a resist solution pressure feeding unit 2, and a motor mechanism 26. In this coating apparatus, a photoresist (hereinafter simply referred to as a resist solution) is applied to a rectangular glass substrate P as shown in FIG. 2, and a coating process is performed.
[0042]
  The processing unit 1 includes a substrate holding unit 4 that can vacuum-suck the substrate P and hold it horizontally, and a resist solution supply unit 5 that supplies a resist solution to the substrate P held by the substrate holding unit 4. . The substrate holder 4 is rotatable and can be rotated horizontally by the motor mechanism 26. Around the substrate holding part 4, a cup 6 for preventing scattering of the resist solution during rotation is arranged.
[0043]
  As shown in FIGS. 2 and 3, the resist solution supply unit 5 has a nozzle portion 7 that extends in the short side direction (the depth direction in FIG. 1; the first direction) of the substrate P along the upper surface of the substrate P. ing. As shown in FIG. 4, the nozzle portion 7 is an inverted house type member in cross section. The bottom surface of the nozzle portion 7 is inclined so as to become lower from both longitudinal ends of the substrate P toward the center. The nozzle portion 7 has a slit (opening) 20 having a length shorter than the short side length of the substrate P, and is fixed to the lower end of the nozzle support arm 8. The upper end portion of the nozzle support arm 8 is supported by the moving frame 9 so as to be vertically movable. The moving frame 9 is movably supported by the moving guide 10. The movement guide 10 extends along the longitudinal direction of the substrate P (left-right direction in FIG. 1; second direction).
[0044]
  As shown in FIG. 4, a liquid reservoir 31 wider than the slit 20 is formed in the middle of the slit 20 inside the nozzle portion 7. The liquid reservoir 31 is for uniformly diffusing the resist solution supplied from the resist solution supply pipe 16 (described later) in the longitudinal direction of the nozzle portion 7 (depth direction in FIG. 4).
[0045]
  As shown in FIG. 1, the resist solution pumping unit 2 has a pressurized tank 11 that houses a glass bottle 12 that stores a resist solution and is hermetically sealed. In the upper part of the pressurizing tank 11, a pressurizing pipe 13 to which pressurized nitrogen gas is supplied from a nitrogen gas source (not shown) is opened. A supply / discharge three-way valve 14 and a regulator 15 are arranged in this order from the pressurized tank 11 side in the middle of the pressurized pipe 13. The three-way valve 14 can select whether nitrogen gas is supplied to the pressurized tank 11 or exhausted elsewhere. One end of the resist solution supply pipe 16 reaches the vicinity of the bottom surface of the glass bottle 12, and the other end is connected to the nozzle portion 7. In the middle of the resist solution supply pipe 16, a resist solution supply valve 18 and a suck back valve 17 are arranged in this order from the glass bottle 12 side.
[0046]
  Further, as shown in FIG. 5, the coating apparatus includes a control unit 23 composed of a microcomputer. The control unit 23 is connected to the substrate holding unit 4, the nozzle support arm 8, the moving frame 9 drive unit, the supply / discharge three-way valve 14, the resist solution supply valve 18, the suck back valve 17, and the motor mechanism 26. Further, various sensors (not shown) such as sensors for detecting the positions of the nozzle support arm 8 and the moving frame 9 and other input / output devices are connected to the control unit 23.
[0047]
  The operation of the coating apparatus will be described with reference to the control flowcharts shown in FIGS. In step S1, initial setting of the entire coating apparatus is performed. Next, the process proceeds to step S2 and waits for a transport mechanism (not shown) to transport the substrate P into the coating apparatus. When the substrate P is carried in, the process proceeds to step S3, where the substrate holding part 4 vacuum-sucks the substrate P.
[0048]
  Subsequently, a coating process is performed in step S4. In the coating process, as shown in FIG. 7, the nozzle unit 7 is first moved to the start position in step S10. Here, the nozzle portion 7 is arranged at a dotted line position shown in FIG. 8 (that is, a position that enters a predetermined distance from the left end of the substrate P toward the substrate P). At this time, the bottom surface of the nozzle portion 7 is disposed with a predetermined gap from the substrate P. In step S <b> 11, the nozzle unit 7 is moved horizontally in the longitudinal direction of the substrate P. In step S12, the discharge and stop of the resist solution from the slit 20 are repeated at a predetermined cycle while moving the nozzle unit 7. As a result, the resist solution is intermittently supplied to the substrate P. The resist solution is discharged by switching the three-way valve 14 to the supply side and opening the resist solution supply valve 18 to supply the resist solution from the glass bottle 12 to the nozzle unit 7. Further, the discharge of the resist solution in step S12 is stopped by closing the resist solution supply valve 18. When the resist solution is supplied in step S12, the center of rotation of the substrate P is taken into consideration in consideration of the longitudinal dimension of the substrate P, the moving speed of the nozzle unit 7, the repetition period of discharge / stop, and the discharge time. Control is performed so that the resist solution is always supplied to (O in FIG. 8).
[0049]
  By performing such processing, a coating region C that is long in the short side direction of the substrate P is intermittently formed in the long direction of the substrate P as shown in FIG. That is, the resist solution is supplied to the intermittent region including the rotation center O of the substrate P.
[0050]
  In step S13, it waits for the nozzle part 7 to move as shown by the arrow in FIG. 8 and to reach the right end of the preset application region of the substrate P. When the nozzle unit 7 reaches the right end of the substrate P, the process proceeds to step S14, the three-way valve 14 is switched to the exhaust side, and the resist solution supply valve 18 is closed to completely stop the supply of the resist solution. In step S15, the movement of the nozzle unit 7 is stopped. In step S16, as shown in FIG. 3, the nozzle portion 7 is retracted to the retract position obliquely above the right end of the substrate P.
[0051]
  Next, in step S17, the motor mechanism 26 is driven to rotate the substrate holder 4 at a predetermined rotational speed in the state shown in FIG. In step S18, the process waits for a predetermined rotation processing time to elapse. During this time, the resist solution supplied to the intermittent region of the substrate P moves in the outer peripheral direction by centrifugal force. As a result, the resist solution spreads over the entire surface of the substrate P, and the resist solution is diffused to regions other than the intermittent region. Next, the process proceeds from step S18 to step S19, the rotation of the motor mechanism 26 is stopped, and the process returns to the main routine of FIG.
[0052]
  In step S5 in FIG. 6, the adsorption of the substrate P by the substrate holding unit 4 is released. In step S6, it waits for a transport mechanism (not shown) to discharge the substrate P for the next processing. If the board | substrate P is carried out, it will return to step S2 and will wait for the next board | substrate P to be carried in. In this embodiment, the resist solution pull-back operation by the suck back valve 17 may be performed every time periodic discharge is stopped in step S12, or not performed in step S12 but only when discharge is stopped in step S14. You may make it perform.
[0053]
  [Modification]
  (A) The repetition cycle of discharging and stopping the resist solution in step S <b> 12 of FIG. 7 may be changed depending on the position of the substrate P.
[0054]
  In the example shown in FIG. 9, the width of the coating region C0 in the central portion of the substrate P is made larger than that in the peripheral portion. That is, even if a relatively large amount of resist solution is supplied to the central portion, the amount that is scattered outside the substrate by centrifugal force is small. However, the resist solution supplied to the peripheral portion is likely to be scattered outside the substrate. Therefore, in the example shown in FIG. 9, the supply amount of the resist solution is increased in the central portion and decreased toward the peripheral portion. Therefore, the width of each application region is such that application region C0> application region C1> application region C2> application region C3.
[0055]
  In such an example, the resist solution can be more efficiently applied to the entire substrate P, and the consumption of the resist solution can be further suppressed.
[0056]
  (B) In the above example, the slits 20 extending in the short side direction of the substrate are formed in the nozzle portion 7, but as shown in FIG. 10A, the slits are close to each other along the short side direction of the substrate. Alternatively, the nozzle unit 40 having a plurality of small holes 41 may be used. Moreover, as shown in FIG.10 (b), it is good also as the nozzle part 40 which has the slit 20 in the short side direction center part of a board | substrate, and the some small hole 41 in the both sides. 10A and 10B are views of the nozzle portion 40 as viewed from the bottom, and an arrow M indicates the moving direction of the nozzle portion 41. FIG.
[0057]
  [Second Embodiment]
  FIG. 11 shows a nozzle unit 50 applied to the coating apparatus according to the second embodiment of the present invention. In this example, the nozzle portion 50 has a plurality of slits 51 along the extending direction (the short side direction of the substrate). Here, the length of each slit 51 is the same.
[0058]
  By supplying the resist solution using such a nozzle unit 50, as shown in FIG. 12, a coating region C that is long in the longitudinal direction of the substrate P can be intermittently formed in the short side direction. An arrow M in FIGS. 11 and 12 indicates the moving direction of the nozzle unit 50. When such a nozzle unit 50 is used, the resist solution is continuously discharged in step S12 of FIG. 7 in the previous example. Other processing is the same as the previous example. Of course, also in this example, the slit 51 is arranged at the rotation center O of the substrate P so that the resist solution is always supplied.
[0059]
  [Modification]
  (A) As a modification of the second embodiment, the length of each slit of the nozzle unit 50 is changed, and as described above, the width of the central application region is compared with the width of the peripheral application region. It may be made larger.
[0060]
  (B) When the resist solution is applied to the intermittent region as shown in FIG. 12, a plurality of nozzle portions 60a, 60b, 60c, and 60d each having the slit 51 as described above, as shown in FIG. 13 (a). , 60e may be arranged side by side in the short side direction of the substrate. In this case, the resist solution supply valve 61 is connected to the central nozzle portion 60c, the resist solution supply valve 62 is connected to the pair of intermediate nozzle portions 60b and 60d, and the outermost pair of nozzle portions 60a, It is desirable to connect the resist solution supply valve 63 to 60e so that the amount of the resist solution supplied to the nozzle portions 60a to 60e can be individually controlled. Of course, a resist solution supply valve may be connected to each of the nozzle portions so that the resist solution supply amounts for all the nozzle portions can be individually controlled.
[0061]
  (C) As shown in FIG. 13B, a nozzle portion 60f having a slit 51 at the center and a nozzle portion 60g having a plurality of small holes 41 at both ends may be used in combination.
[0062]
  (D) Using the nozzle portions 50 and 60 of the second embodiment, the resist solution is discharged and stopped periodically in the same manner as in the first embodiment, whereby both directions of the first direction and the second direction are performed. An intermittent application region can be formed. Moreover, you may make it repeat discharge and a stop periodically, using both the nozzle parts 60f and 60g or one of them.
[0063]
  [Third Embodiment]
  In the first and second embodiments, a long coating region in one direction is intermittently formed in the other direction. In this embodiment, concentric annular regions are intermittently formed.
[0064]
  FIG. 14 shows the configuration of the nozzle portion in this case. The nozzle portion 70 shown in this figure is rotatable about the rotation center O of the substrate P and extends long in the radial direction. A plurality of slits 71 a, 71 b, 71 c, 71 d are arranged at the bottom along the direction in which the nozzle part 70 extends. The slit 71a is arranged so as to include the rotation center O, and the length of each slit becomes shorter toward the periphery. That is, the length of the slit is slit 71a> slit 71b> slit 71c> slit 71d. The nozzle unit 70 is movable so as to be able to take a position retracted from above the substrate P and a position shown in FIG. 14 so as not to hinder the conveyance of the substrate P or the like.
[0065]
  FIG. 15 shows an intermittent application region obtained by rotating such a nozzle unit 70. The coating region C0 is formed by supplying a resist solution by a slit 71a, the coating region C1 by a slit 71b, the coating region C2 by a slit 71c, and the coating region C3 by a slit 71d. Note that the slit 71d forming the region C3 is detached from the surface of the substrate at the long side portion of the substrate, but it is desirable to provide a valve or the like so that only the supply of the resist solution from the slit 71d can be stopped in the meantime.
[0066]
  In such an embodiment, since a plurality of annular application regions are formed concentrically, the resist solution in each application region is easily diffused by rotation, and more uniform application can be performed with a small amount of resist solution.
[0067]
  [Modification]
  (A) As shown in FIG. 16, a plurality of annular application regions can be formed concentrically using two nozzle portions 75 and 76. In this example, the first nozzle portion 75 is formed so as to extend in the short side direction of the substrate P, and is movable in the longitudinal direction of the substrate P above the substrate P. Further, the second nozzle portion 76 is formed so as to extend in the longitudinal direction of the substrate P, and is movable in the short side direction of the substrate P above the substrate P. The first nozzle portion 75 has a plurality of slits 75 a to 75 c arranged along the short side direction of the substrate P. The central slit 75a is the longest, the pair of intermediate slits 75b adjacent to the slit 75a is the next longest, and the pair of slits 75c at the most peripheral part is the shortest. That is, the length of each slit is slit 75a> one pair of slits 75b> one pair of slits 75c. The second nozzle portion 76 has a pair of slits 76b and 76c arranged along the longitudinal direction of the substrate P, and the length of the central slit 76b is the slit 75b of the first nozzle portion 75. The length of the outer slit 76 c is the same as the length of the slit 75 c of the first nozzle portion 75.
[0068]
  Each slit is individually connected with a resist solution supply valve (not shown) so that the supply timing of the resist solution from each slit can be controlled.
[0069]
  When an annular coating region is formed by such a nozzle portion, first, as shown in FIG. 17A, the resist solution is supplied from each slit while moving the first nozzle portion 75 in the longitudinal direction of the substrate P. By controlling the timing, an application region long in the longitudinal direction of the substrate is intermittently formed in the short side direction. In this case, the outermost application area is the longest, the intermediate application area is the next longest, and the central application area is the shortest. Next, as shown in FIG. 17B, the supply timing of the resist solution from each slit is controlled while moving the second nozzle portion 76 in the short side direction of the substrate P, and in the short side direction of the substrate P. Long coating areas are intermittently formed in the longitudinal direction of the substrate P. By these application regions, a central application region C0, an intermediate annular application region C1, and an outer peripheral annular application region C2 are formed concentrically. And the width | variety of each application area | region becomes narrow as it goes outside.
[0070]
  (B) An annular intermittent application region as shown in FIG. 17B can also be formed by one nozzle portion. That is, first, as shown in FIG. 18 (a), the supply timing of the resist solution from each of the slits 75a to 75c is controlled while moving the nozzle portion 75 in the longitudinal direction of the substrate P. Long coating areas are intermittently formed in the short side direction of the substrate P. Next, the substrate P is rotated by 90 °. This state is shown in FIG. Next, the application area is formed so as to connect the previously formed application areas by controlling the supply timing of the resist solution while moving the nozzle portion 75 in the direction opposite to the previous direction. Thereby, a plurality of annular application regions similar to the example of FIG. 17 can be formed concentrically.
[0071]
  (C) Further, as shown in FIG. 19, a plurality of annular application regions are formed concentrically using a nozzle portion 80 that is movable in the X and Y directions above the substrate and has a slit 81 having a predetermined width. You can also. That is, by moving the nozzle portion 80 so as to draw along the arrow in the figure, the coating region C0 including the rotation center O of the substrate, the coating region C1 around it, and the coating region C2 on the outer peripheral portion, Can be formed concentrically.
[0072]
  (D) Further, the nozzle unit 50 shown in FIG. 11 in the second embodiment is stopped at a position passing above the rotation center O of the substrate P, and the substrate P is rotated 180 while discharging the liquid from the nozzle unit 50. The application region can also be formed concentrically by rotating the angle. Furthermore, the nozzle part 50 shown in FIG. 11 has a half length, is stopped at a position passing over the rotation center O of the substrate P, and the substrate P is rotated 360 ° to form the coating region concentrically. it can.
[0073]
  [Fourth Embodiment]
  FIG. 20 shows a fourth embodiment. In this example, two nozzle parts 83 and 84 are arranged in the longitudinal direction of the substrate P. The first nozzle portion 83 has two slits 83a and 83b along the short side direction of the substrate P, and the second nozzle portion 84 has three slits 84a, 84b and 84c along the short side direction of the substrate P. have. The slit 83a and the slit 84a are arranged so as to be offset from each other in the longitudinal direction of the substrate. The relationship between the slit 83b and the slit 84c is also the same. The slit 84b is formed at the center of the substrate P in the short side direction. And the width (length) dimension of each slit is, SuLit 84b> Slit 84a = 84c> Slit 83a = 83bIt has become.
[0074]
  In such an embodiment, first, the first and second nozzle portions 83 and 84 are moved in the longitudinal direction of the substrate (in the direction of arrow M in FIG. 20), and only the first nozzle portion 83 is used in the longitudinal direction of the substrate P. A long coating region is intermittently formed in the short side direction of the substrate P. Next, the substrate P is rotated by 90 °, and both the nozzle portions 83 and 84 are moved in the opposite direction (arrow direction in FIG. 21) while using only the second nozzle portion 84 in the short side direction of the substrate. Long coating areas are intermittently formed in the longitudinal direction of the substrate P.
[0075]
  The intermittent application region formed in this way is shown in FIG. In the figure, a region indicated by a solid line is a coating region formed by the first nozzle portion 83, and a region indicated by a one-dot chain line is a coating region to be formed by the second nozzle portion 84.
[0076]
  In this case, the width and position of the coating region in the longitudinal direction and the coating region in the short side direction on the substrate P can be individually controlled by changing the slit of the nozzle portion.
[0077]
  [Fifth Embodiment]
  In each of the above embodiments, the step of applying the resist solution to the substrate P and the step of rotating the substrate P to diffuse the resist solution are performed in one stage. However, these steps are performed in separate stages. Also good.
[0078]
  An example of this is shown in FIG. The apparatus shown in the figure has a coating processing stage 85 and a rotary diffusion stage 86. A transport robot (not shown) for transporting the substrate between these stages is provided.
[0079]
  The coating processing stage 85 includes, for example, the nozzle unit 7 and the substrate holding device 90 as shown in the first embodiment. The substrate holding device 90 here does not rotate. The nozzle part 7 is movable in the direction of the arrow in the figure along the surface of the substrate holding device 90. The nozzle unit 7 is connected to each device for supplying the resist solution to the nozzle unit 7 as described above.
[0080]
  The rotary diffusion stage 86 has a substrate rotating device 91 that can rotate while holding the substrate. The substrate rotation device 91 is rotated by a rotation mechanism such as a motor (not shown).
[0081]
  In such an apparatus, the resist solution is applied to the intermittent region as described above in the application processing stage 85. Then, the substrate coated with the resist solution in the intermittent region is conveyed to the rotary diffusion stage 86, where the substrate is rotated, and the resist solution coated in the intermittent region is diffused over the entire substrate surface.
[0082]
  Here, the processing time in each stage is shorter than in the case where the application and rotation are performed in one stage. Therefore, the throughput of the apparatus is improved and the overall processing time is shortened.
[0083]
【The invention's effect】
  As described above, according to the present invention, the consumption of the coating liquid can be suppressed as compared with the conventional apparatus.
[Brief description of the drawings]
FIG. 1 is a block schematic diagram of a coating apparatus according to a first embodiment of the present invention.
FIG. 2 is a partial perspective view of a nozzle portion during a coating process.
FIG. 3 is a schematic front view showing one state during a coating process.
4 is a cross-sectional view taken along the line IV-IV in FIG.
FIG. 5 is a block schematic diagram showing a control configuration of the coating apparatus.
FIG. 6 is a control flowchart of the coating apparatus.
FIG. 7 is a control flowchart of the coating apparatus.
FIG. 8 is a plan view showing one state during a coating process.
FIG. 9 is a plan view of a substrate showing a coating state according to a modification of the first embodiment.
FIG. 10 is a bottom view of a nozzle portion according to another modification of the first embodiment of the present invention.
FIG. 11 is a bottom view of a nozzle unit according to a second embodiment of the present invention.
FIG. 12 is a plan view of a substrate showing a coating state according to the second embodiment.
FIG. 13 is a schematic diagram of a nozzle portion according to a modification of the second embodiment.
FIG. 14 is a plan view of a nozzle unit according to a third embodiment of the present invention.
FIG. 15 is a plan view of a substrate showing a coating state according to the third embodiment.
FIG. 16 is a plan view of a nozzle unit according to a modification of the third embodiment.
FIG. 17 is a plan view of a substrate showing a coating state according to a modification of the third embodiment.
FIG. 18 is a plan view showing a nozzle portion and a coating state according to another modification of the third embodiment.
FIG. 19 is a plan view showing a nozzle portion and a coating state according to still another modification of the third embodiment.
FIG. 20 is a plan view of a nozzle portion and a substrate according to a fourth embodiment of the present invention.
FIG. 21 is a plan view of a coating state according to the fourth embodiment.
FIG. 22 is a schematic front view of a coating apparatus according to a fifth embodiment of the present invention.
[Explanation of symbols]
1 processing section
4 Substrate holder
5 Resist solution supply section
7, 40, 50, 60a to 60e, 70, 75, 76, 80, 83, 84 Nozzle part
18, 61, 62, 63 Resist solution supply valve
20, 51, 71a to 71d, 75a to 75c, 76b, 76c, 80a, 83a, 83b, 84a to 84c Slit
23 Control unit
90 Substrate holding device
91 Substrate rotating device

Claims

A coating apparatus for applying a coating liquid on a substrate surface by rotating the substrate,
A coating liquid supply means capable of discharging the coating liquid at a predetermined interval or continuously in a region long in the first direction;
Moving means for moving the coating liquid supply means relative to the substrate surface in a second direction intersecting the first direction;
Intermittent region coating means for applying the coating liquid to the intermittent region including the center of rotation of the substrate while moving the coating liquid supply unit relative to the substrate surface;
Rotating means for rotating the substrate coated with the coating liquid in the intermittent area and diffusing the coating liquid coated in the intermittent area over the entire surface of the substrate,
The coating liquid supply means supplies the coating liquid to a continuous area long in the first direction,
The intermittent region application unit repeatedly discharges and stops the coating solution during the movement of the coating solution supply unit, and intermittently forms a coating region that is long in the first direction in the second direction.
Coating device.

The coating apparatus according to claim 1, wherein the coating liquid supply unit includes a nozzle having a continuous slit-like opening that is long in the first direction.

The coating apparatus according to claim 1, wherein the coating liquid supply unit includes a nozzle having a large number of small holes arranged close to each other along the first direction.

A coating apparatus for applying a coating liquid on a substrate surface by rotating the substrate,
A coating liquid supply means capable of discharging the coating liquid at a predetermined interval or continuously in a region long in the first direction;
Moving means for moving the coating liquid supply means relative to the substrate surface in a second direction intersecting the first direction;
Intermittent region coating means for applying the coating liquid to the intermittent region including the center of rotation of the substrate while moving the coating liquid supply unit relative to the substrate surface;
Rotating means for rotating the substrate coated with the coating liquid in the intermittent area and diffusing the coating liquid coated in the intermittent area over the entire surface of the substrate,
The coating liquid supply means supplies the coating liquid at a predetermined interval in a long region along the first direction,
The intermittent area application unit repeats discharge and stop of the application liquid during the movement of the application liquid supply unit to form intermittent application areas in both the first and second directions.
Coating device.

A coating apparatus for applying a coating liquid on a substrate surface by rotating the substrate,
And can eject the coating liquid supplying means a coating coating solution at predetermined intervals in the long region in a first direction,
Moving means for moving the coating liquid supply means relative to the substrate surface in a second direction intersecting the first direction;
Intermittent region coating means for applying the coating liquid to the intermittent region including the center of rotation of the substrate while moving the coating liquid supply unit relative to the substrate surface;
Rotating means for rotating the substrate coated with the coating liquid in the intermittent area and diffusing the coating liquid coated in the intermittent area over the entire surface of the substrate,
The coating liquid supply means supplies the coating liquid at a predetermined interval in a long region along the first direction,
The intermittent area application means supplies the application liquid continuously during the movement of the application liquid supply means to intermittently form an application area that is long in the second direction in the first direction. ,
The coating liquid supply means has a nozzle having a plurality of slit-like openings formed intermittently in the first direction.
Coating device.

A coating apparatus for applying a coating liquid on a substrate surface by rotating the substrate,
And can eject the coating liquid supplying means a coating coating solution at predetermined intervals in the long region in a first direction,
Moving means for moving the coating liquid supply means relative to the substrate surface in a second direction intersecting the first direction;
Intermittent region coating means for applying the coating liquid to the intermittent region including the center of rotation of the substrate while moving the coating liquid supply unit relative to the substrate surface;
Rotating means for rotating the substrate coated with the coating liquid in the intermittent area and diffusing the coating liquid coated in the intermittent area over the entire surface of the substrate,
The coating liquid supply means supplies the coating liquid at a predetermined interval in a long region along the first direction,
The intermittent area application means supplies the application liquid continuously during the movement of the application liquid supply means to intermittently form an application area that is long in the second direction in the first direction. ,
The coating liquid supply means has a plurality of nozzles arranged side by side in the first direction and having slit-shaped openings each having a predetermined length.
Coating device.

The coating apparatus according to claim 4, wherein the coating liquid supply unit includes a nozzle having a plurality of slit-like openings formed intermittently in the first direction.

The coating apparatus according to claim 4, wherein the coating liquid supply unit includes a plurality of nozzles arranged side by side in the first direction and each having a slit-shaped opening having a predetermined length.

The coating apparatus according to claim 6, wherein the coating liquid supply unit further includes a discharge amount control unit for controlling a coating liquid discharge amount from each of the plurality of nozzles.

A coating apparatus for applying a coating liquid on a substrate surface by rotating the substrate,
A coating liquid supply means capable of discharging the coating liquid at a predetermined interval or continuously in a region long in the first direction;
Moving means for moving the coating liquid supply means relative to the substrate surface in a second direction intersecting the first direction;
Intermittent region coating means for applying the coating liquid to the intermittent region including the center of rotation of the substrate while moving the coating liquid supply unit relative to the substrate surface;
Rotating means for rotating the substrate coated with the coating liquid in the intermittent area and diffusing the coating liquid coated in the intermittent area over the entire surface of the substrate,
The coating solution supply means has a plurality of slit-like openings formed intermittently in the first direction, and has a first nozzle and a second nozzle arranged side by side in the second direction,
The intermittent area coating means intermittently forms a continuous coating area long in the second direction on the substrate by the first nozzle in the first direction, and then rotates the substrate by 90 ° to Forming a continuous coating region long in the second direction on the substrate by the second nozzle intermittently in the first direction;
Coating device.

The substrate has a rectangular shape;
The intermittent region application means is applied to an intermittent region formed by a region including the rotation center of the substrate, a region along a pair of sides of the substrate, and a region along a pair of other sides of the substrate. The coating apparatus of Claim 10 which apply | coats a liquid.

The coating apparatus according to claim 1, wherein the coating liquid supply unit is disposed so as to face the rotating unit.

A coating apparatus for applying a coating liquid on a substrate surface by rotating the substrate,
A coating liquid supply means capable of discharging the coating liquid at a predetermined interval or continuously in a region long in the first direction;
Moving means for moving the coating liquid supply means relative to the substrate surface in a second direction intersecting the first direction;
Intermittent region coating means for applying the coating liquid to the intermittent region including the center of rotation of the substrate while moving the coating liquid supply unit relative to the substrate surface;
Rotating means for rotating the substrate coated with the coating liquid in the intermittent region and diffusing the coating liquid coated in the intermittent region over the entire surface of the substrate;
A first substrate holding part that can be opposed to the coating liquid supply means and holds the substrate;
A second substrate holding unit that holds and rotates the substrate coated with the coating liquid by the intermittent region coating unit;
A coating apparatus comprising:

The coating liquid supply means supplies the coating liquid to a continuous area long in the first direction,
The intermittent region application unit repeatedly discharges and stops the coating solution during the movement of the coating solution supply unit, and intermittently forms a coating region that is long in the first direction in the second direction.
The coating device according to claim 13.

The coating liquid supply means supplies the coating liquid at a predetermined interval in a long region along the first direction,
The intermittent area application means continuously supplies the application liquid during the movement of the application liquid supply means to intermittently form an application area long in the second direction in the first direction.
The coating device according to claim 13.

The coating liquid supply means supplies the coating liquid at a predetermined interval in a long region along the first direction,
The intermittent area application unit repeats discharge and stop of the application liquid during the movement of the application liquid supply unit to form intermittent application areas in both the first and second directions.
The coating device according to claim 13.

The coating apparatus according to claim 13, wherein the intermittent region application unit applies a coating liquid to a plurality of concentric annular intermittent regions on the surface of the substrate.

The coating liquid supply means includes a first nozzle portion capable of discharging a coating liquid at a predetermined interval in a long region in the first direction, and a coating liquid at a predetermined interval in a long region in the second direction. A second nozzle part capable of discharging
Said moving means Ru are relatively moved in the first direction are relatively moved in front Stories second direction relative to the substrate surface the first nozzle portion and the second nozzle portion with respect to the substrate surface The coating device according to claim 13, which is a device.

The coating solution supply means has a plurality of slit-like openings formed intermittently in the first direction, and has a first nozzle and a second nozzle arranged side by side in the second direction,
The intermittent area coating means intermittently forms a continuous coating area long in the second direction on the substrate by the first nozzle in the first direction, and then rotates the substrate by 90 ° to Forming a continuous coating region long in the second direction on the substrate by the second nozzle intermittently in the first direction;
The coating device according to claim 13.