JPH11330186A5 - - Google Patents

Info

Publication number
JPH11330186A5
JPH11330186A5 JP1998127467A JP12746798A JPH11330186A5 JP H11330186 A5 JPH11330186 A5 JP H11330186A5 JP 1998127467 A JP1998127467 A JP 1998127467A JP 12746798 A JP12746798 A JP 12746798A JP H11330186 A5 JPH11330186 A5 JP H11330186A5
Authority
JP
Japan
Prior art keywords
wafer
stage
electron
inspection device
position information
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998127467A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11330186A (ja
JP4090567B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP12746798A priority Critical patent/JP4090567B2/ja
Priority claimed from JP12746798A external-priority patent/JP4090567B2/ja
Publication of JPH11330186A publication Critical patent/JPH11330186A/ja
Publication of JPH11330186A5 publication Critical patent/JPH11330186A5/ja
Application granted granted Critical
Publication of JP4090567B2 publication Critical patent/JP4090567B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP12746798A 1998-05-11 1998-05-11 ウエハ検査加工装置およびウエハ検査加工方法 Expired - Lifetime JP4090567B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12746798A JP4090567B2 (ja) 1998-05-11 1998-05-11 ウエハ検査加工装置およびウエハ検査加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12746798A JP4090567B2 (ja) 1998-05-11 1998-05-11 ウエハ検査加工装置およびウエハ検査加工方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2005134893A Division JP4091060B2 (ja) 2005-05-06 2005-05-06 ウエハ検査加工装置およびウエハ検査加工方法
JP2006277460A Division JP4303276B2 (ja) 2006-10-11 2006-10-11 電子線及びイオンビーム照射装置並びに試料作成方法

Publications (3)

Publication Number Publication Date
JPH11330186A JPH11330186A (ja) 1999-11-30
JPH11330186A5 true JPH11330186A5 (enrdf_load_html_response) 2005-09-29
JP4090567B2 JP4090567B2 (ja) 2008-05-28

Family

ID=14960661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12746798A Expired - Lifetime JP4090567B2 (ja) 1998-05-11 1998-05-11 ウエハ検査加工装置およびウエハ検査加工方法

Country Status (1)

Country Link
JP (1) JP4090567B2 (enrdf_load_html_response)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002090312A (ja) * 2000-09-21 2002-03-27 Hitachi Ltd 欠陥分析システム
CN100373573C (zh) * 2005-01-06 2008-03-05 中芯国际集成电路制造(上海)有限公司 深次微米半导体器件中致命缺陷的确认方法
KR20080043768A (ko) * 2005-07-30 2008-05-19 전자빔기술센터 주식회사 마이크로칼럼을 이용한 미세 패턴 및 형상 검사장치
KR101051730B1 (ko) * 2006-08-01 2011-07-25 가부시키가이샤 시마쓰세사쿠쇼 기판 검사 및 수정 장치와 기판 평가 시스템
US8357913B2 (en) 2006-10-20 2013-01-22 Fei Company Method and apparatus for sample extraction and handling
US8134124B2 (en) * 2006-10-20 2012-03-13 Fei Company Method for creating S/tem sample and sample structure
JP5321490B2 (ja) * 2010-02-08 2013-10-23 新日鐵住金株式会社 微粒子分析方法
JP2011233249A (ja) * 2010-04-23 2011-11-17 Tokyo Institute Of Technology イオンビーム照射位置決め装置
CN103965914B (zh) * 2013-01-25 2016-06-08 上海华虹宏力半导体制造有限公司 蚀刻npn掺杂区域形貌以进行失效检验的组合物及检验方法
CN109411396B (zh) * 2018-11-29 2024-06-04 天津中环领先材料技术有限公司 一种六轴机器人辅助目检硅片装置及辅助检测方法
CN110006937A (zh) * 2019-04-02 2019-07-12 深圳鸿鹏新能源科技有限公司 利用扫描电镜在极限分辨率下测试样品的方法

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