JPH11297754A - Substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable evaluation and analysis of a plurality of products with the use of a single substrate by setting is advance a plurality of pitches and widths corresponding to product specifications, at the evaluating of a semiconductor product such as a tape carrier package(TCP). SOLUTION: In this substrate, test pads 102 having a plurality of pitches and widths are provided on the front and rear sides of a base substrate 101 of a printed circuit board, connected in series up to a connector insert part 106 for providing electrical signals via a connector. Patterns having different widths 103 and different pitches 104 of the test pads are formed, and the test pads 102 are connected in series by wiring lines 105. The width 103 and pitch 104 of the test pads are set in conformity with product specifications, and a plurality of patterns are formed on the base substrate 101, thus making importing of general-purpose property possible. The test pads 102 and wiring lines 105 are made of metals (solder or gold) of which electrical conduction is easy to obtain.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate for evaluating and analyzing semiconductor products.

[0002]

2. Description of the Related Art Conventionally, when evaluating and analyzing a TCP (tape carrier package) product cut into a final shape, a pitch of an input signal terminal and a pattern width are different for each product. An evaluation board was being developed.

[0003]

However, the conventional substrate has a problem in that since a substrate is manufactured for each product, a plurality of products cannot be evaluated with one substrate, and there is no general versatility. Was.

[0004]

In order to solve the above-mentioned problems, the substrate of the present invention is characterized in that a single substrate is provided with a plurality of test pads having a plurality of pitches and widths, and the pads are electrically connected. And Further, by forming a pattern on both surfaces of the substrate, double versatility can be obtained.

[0005]

When a substrate patterned as described above is manufactured, when evaluating a semiconductor product such as TCP, a plurality of pitches and widths are formed in advance according to the product specifications so that one substrate can be used. It is possible to evaluate and analyze multiple products.

[0006]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view (surface view) of the present invention, wherein 101 is a base substrate, 102 is a test pad,
3 is the width of the test pad, 104 is the pitch of the test pad, 105 is the connection between the test pads, and 106 is the connector insertion portion.

Here, the test pad 1 is mounted on the base substrate 101.
No. 02 is formed, but a pattern having a different test pad width 103 and a different test pad pitch 104 is formed, and the test pads 102 are connected 105 in series. The width 103 of the test pad and the pitch 104 of the test pad are set in accordance with the product specifications, and by patterning a plurality of patterns on the base substrate 101, versatility can be provided. The test pad 102 and the connection 105 are made of a metal (solder or gold) or the like that is easily electrically conductive, but other metals (copper) can be used.

FIG. 2 is a plan view (back view) of the present invention.
Reference numerals 201, 202, and 203 denote test pads having a different pitch and width from the front side. By patterning the back side, double versatility can be obtained.

Further, by providing the connector insertion portion 106, evaluation and analysis can be easily performed by supplying an electric signal from outside through the connector.

FIG. 3 is a plan view of the present invention (a diagram showing the state of evaluation and analysis). Reference numeral 301 denotes a TCP IC chip;
Reference numeral 2 denotes a TCP signal input terminal, and reference numeral 303 denotes a liquid crystal panel.

According to the present invention, a TCP signal input terminal 302 is provided.
Is soldered to the test pad 102 and, in the case of a liquid crystal panel driving TCP, by applying an electric signal from the connector insertion portion 106 of the present invention, the display quality of the liquid crystal panel can be confirmed.

As described above, by preliminarily patterning test pads having various pitches and widths on a printed circuit board, it is possible to evaluate and analyze a TCP product cut into a final shape, thereby improving the reliability of the TCP product. Performance can be improved.

[0014]

As described above, the substrate of the present invention has the following features.
With a simple structure in which test pads of a plurality of pitches and widths are connected in series, there is an effect that evaluation and analysis of a plurality of products can be performed on one board without manufacturing a board for each product.

Further, by making the shape of the connector insertion portion of the board the same as that standardized, it is possible to easily take in an electric signal from the outside via the connector, which is very convenient.

[Brief description of the drawings]

FIG. 1 is a plan view (surface view) of a substrate of the present invention.

FIG. 2 is a plan view (back view) of the substrate of the present invention.

FIG. 3 is a plan view (a diagram showing a state of evaluation and analysis) of the substrate of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 101 ... Base board 102 ... Test pad 103 ... Test pad width 104 ... Test pad pitch 105 ... Connection between test pads 106 ... Connector insertion part 201 ... Test pad (Pitch, width large) 202: Test pad (pitch, width medium) 203: Test pad (pitch, width small) 301: TCP IC chip 302: TCP signal input terminal 303 ..Liquid crystal panels

Claims (4)

[Claims] 1. A board characterized in that test pads having a plurality of pitches and widths are provided on a printed board, and each test pad is connected. 2. A substrate characterized in that test pads having a plurality of pitches and widths are connected in series. 3. A substrate characterized in that the test pads connected in series according to claim 2 are patterned on both front and back surfaces of the substrate. 4. A board characterized in that a connector insertion structure is provided on the test pads connected in series according to claim 2 so that an electric signal can be given from outside.