JPH11274695A - Transferring material and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of covering a conductive layer on a transferring work. SOLUTION: It comprises steps of forming a first electric-insulative mask pattern 2 on the surface of a conductive substrate 1, forming a second electric- insulative mask pattern 8 on the first mask pattern 2, forming a base conductive layer 9 higher than the height of the first mask pattern 2 on an unmasked part 3 of the substrate 1 by the electrodeposition, forming a conductive layer 4 on the base conductive layer 9 by the electrodeposition, removing the second mask pattern 8 on the substrate 2 after forming the conductive layer, forming a barrier conductive layer 7 on the conductive layer 1 after moving the second mask pattern, and forming an adhesive layer 15 on the barrier conductive layer 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a transfer member having a fine pattern and a method for manufacturing the same. In particular, the present invention relates to a transfer member having a transfer layer composed of a conductive layer or the like patterned on a conductive substrate and a method for manufacturing the same, which is suitable for manufacturing a multilayer printed wiring board and the like.

[0002]

2. Description of the Related Art Due to the dramatic development of technology in the electric field, high-density mounting techniques such as miniaturization of semiconductor packages and bare chip mounting, as typified by CSP, are rapidly advancing. Along with this, printed wiring boards are also being changed from single-sided wiring to double-sided wiring, and are becoming more multilayered and thinner and lighter.

[0003] As a method of manufacturing such a printed wiring board, a subtractive method and an additive method are generally used.

[0004] The subtractive method is typically a method of forming a conductive circuit by etching a copper clad laminate after forming an etching resist. Although this method is technically almost completed and low in cost, the formation of a fine pattern is limited due to restrictions such as the thickness of the copper foil during etching.

On the other hand, in the additive method, typically, after a catalyst nucleus is provided on a substrate, a plating resist is formed,
This is a method of forming a conductor circuit by performing electroless copper plating. This method can form a fine pattern, but requires cost reduction and further improvement in reliability.

The single-sided or double-sided printed wiring boards produced by these methods are further laminated under pressure together with a prepreg to produce a multilayer substrate. In such a multilayer substrate, the conductor circuits of each layer are usually connected by forming through-holes subjected to electroless plating or the like after the multilayering at once, but the accuracy of the through-holes is further increased. Improvement is required.

In recent years, a multilayer printed wiring board of a build-up type, which is formed by stacking circuit patterns on the surface of a core substrate via an insulating layer, has been attracting attention as satisfying the above requirements. In the multilayer printed wiring board of this build-up system, the wiring density is improved even when the wiring pitch is the same, since the wiring is not hindered by the through holes, as compared with the conventional multilayer substrate using the through holes. However, it is difficult to correct a defect in an intermediate step, and the process is complicated, which hinders a reduction in manufacturing cost.

In order to solve such a problem, there is provided a multilayer printed wiring board having a substrate and a plurality of wiring pattern layers sequentially transferred onto the substrate, wherein each wiring pattern layer comprises a conductive layer and a conductive layer. A device having an insulating resin layer fixed to a lower wiring pattern layer and a method for manufacturing the same have been proposed (Japanese Patent Application Laid-Open No. Hei 8-116172).

FIG. 1 shows a typical example of a method for manufacturing such a transfer member and a printed wiring board. First, a conductive substrate 1 is prepared as shown in FIG. 1A, and a mask pattern 2 is formed on the conductive substrate 1 as shown in FIG. 1B.
Next, patterning is performed as shown in FIG.
Further, as shown in FIG. 1D, a conductive layer 4 is formed on the non-mask portion 3 by electrolytic plating or the like. Further, as shown in FIG. 1E, an adhesive layer 5 is formed on the conductive layer pattern by an electrodeposition method or the like. The transfer member manufactured in this manner is then transferred to the transfer-receiving substrate 6 as shown in FIG. 1 (f), and a printed wiring board as shown in FIG. 1 (g) is manufactured.

However, in this method, since the conductive layer is exposed after the transfer, corrosion sometimes progresses therefrom. For this reason, the exposed portion of the conductive layer was covered with a conductive material by electroless plating or the like after the transfer to the substrate to be transferred, but damage to the product due to immersion in a high-temperature electroless plating solution was performed. There is a problem such as the occurrence of bridges in the case of fine wiring, and it is desired to enable coating on a transfer member before transfer.

[0011]

SUMMARY OF THE INVENTION The present invention is to solve the above-mentioned problems, and an object of the present invention is to provide a method for coating a conductive layer which has been performed by electroless plating or the like after transfer to a substrate to be transferred. Is performed on a transfer member.

[0012]

Means for Solving the Problems We have first and second mask patterns, formation of an underlying conductive layer and a conductive layer, and a second mask pattern.
The above-mentioned problem is solved by removing only the mask pattern and forming the barrier conductive layer in this order, or by performing the order in which the formation order of the base conductive layer and the second mask pattern is changed in this method. I found that.

That is, in the method for manufacturing a transfer member according to the present invention, an electrically insulating first mask pattern is provided on the conductive surface of at least one surface of the conductive substrate. Forming the first, and the first
Forming an electrically insulating second mask pattern on the mask pattern; and forming an underlying conductive layer on the non-mask portion of the substrate on which the first and second mask patterns are formed by the electrodeposition method. Forming a conductive layer on the underlying conductive layer by an electrodeposition method; forming the conductive layer on the underlying conductive layer by an electrodeposition method;
Removing the second mask pattern, forming a barrier conductive layer on the conductive layer by electrodeposition after removing the second mask pattern, and forming an adhesive layer on the barrier conductive layer. Forming, on the conductive substrate, at least the base conductive layer, the conductive layer completely covered by the base conductive layer and the barrier conductive layer, the barrier conductive layer, and the adhesive bonding. It is characterized in that a patterned transfer layer formed by laminating layers is formed.

According to another method of manufacturing a transfer member of the present invention, an electrically insulating first mask pattern is provided on a conductive surface of at least one surface of the substrate. Forming a base conductive layer in a non-mask portion of the substrate on the side where the first mask pattern is formed, by electrodeposition to be higher than the height of the first mask pattern; and forming the first mask Forming an electrically insulating second mask pattern on the pattern, forming a conductive layer on the underlying conductive layer by electrodeposition, and forming the second conductive pattern on the underlying conductive layer.
Removing a mask pattern, forming a barrier conductive layer on the conductive layer by electrodeposition after removing the second mask pattern, and forming an adhesive layer on the barrier conductive layer Comprising, on the conductive substrate, at least the underlying conductive layer, the conductive layer completely covered by the underlying conductive layer and the barrier conductive layer,
It is characterized in that a patterned transfer layer formed by laminating the barrier conductive layer and the adhesive layer is formed.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION A method for manufacturing a transfer member according to the present invention will be described with reference to FIG.

First, a conductive substrate 1 shown in FIG. 2A is prepared, and a first substrate is placed on the conductive substrate 1 as shown in FIG.
A mask 2 is formed. Further, as shown in FIG.
The first mask pattern 2 and the non-mask portion 3 are formed by performing patterning. Next, as shown in FIG. 2D, a second mask pattern 8 is formed on the first mask pattern 2.
Then, as shown in FIG. 2E, the underlying conductive layer 9 is formed in the non-mask portion 3 so as to be thicker than the first mask pattern.
To form Further, as shown in FIG. 2F, the conductive layer 4 is formed on the underlying conductive layer 9. Thereafter, as shown in FIG. 2 (g), the second mask pattern is removed, and as shown in FIG. 2 (h), a barrier conductive layer 7 is formed on the pattern of the conductive layer 4; ), The barrier conductive layer 7
The transfer member is manufactured by forming the adhesive layer 5 on the above pattern.

A typical example of the transfer member of the present invention is shown in FIG.
As shown in (i), a mask pattern 2 of an arbitrary pattern is provided on the surface of the conductive substrate 1, an underlying conductive layer 9, a conductive layer 4, a barrier conductive layer 7, an adhesive layer 5, and the conductive layer 4 is composed of a base conductive layer 9 and a barrier conductive layer 7.
Is completely covered by Thereafter, the transfer member of the present invention is typically pressed against the transfer substrate 6 as shown in FIG. 2 (j), and the underlying conductive layer 9, the conductive layer 4, the barrier conductive layer 7, and the adhesive layer 5 The transfer layer made of
Then, the printed wiring board shown in FIG. 2K is manufactured. Hereinafter, the method for producing a transfer member of the present invention will be described in further detail.

Formation of Second Mask Pattern The method and material for forming the electrically insulating second mask pattern used for the transfer member of the present invention can pattern an alkali-soluble or solvent-soluble insulating layer. If so, there is no particular limitation. This method includes, for example, photoresist, screen printing, and precision dispensing. Among them, it is preferable to use a photoresist that is advantageous for forming a fine pattern.

As the material of the second mask pattern, a material which can be easily removed by dipping in a chemical or spraying to remove it after forming the conductive layer is preferable. Examples of such a material include a solvent-soluble photoresist and an alkali-soluble photoresist, and particularly preferred examples include a novolak-based positive photoresist and a water-soluble colloid-based photoresist.

The second mask pattern is typically formed as follows. A mask is formed by a known method on the surface of the conductive substrate whose roughness has been adjusted. Next, the mask pattern is irradiated with ultraviolet rays through a photomask of a predetermined pattern, and is exposed and developed. Thus, a mask pattern of a predetermined pattern and a non-mask portion are formed on the surface of the conductive substrate.

The thickness of the second mask pattern is not particularly limited, but is preferably 0.1 to 3 μm, more preferably a thinner one in a sufficient range of the penetration of the agent upon removal from the viewpoint of the final shape of the wiring. Preferably it is 0.3-2 μm, particularly preferably 0.5-1 μm.

The planar shape of the second mask pattern is not limited to the same shape as the first mask pattern.
For example, even if the second mask pattern is large and the second mask pattern has a shape protruding from the first mask pattern, the conductive layer can be completely covered with the base conductive layer and the barrier conductive layer. Can be used in the method. On the other hand, even if the second mask pattern is small and the first mask pattern has a shape protruding from the second mask pattern, the conductive layer can be completely covered with the base conductive layer and the barrier conductive layer. Can be used in the method. Preferably, the first mask pattern and the second mask pattern have the same shape. In this case, it is advantageous to form a complete covering of the conductive layer.

Formation of First Mask Pattern The method and material for forming the first mask pattern used for the transfer member of the present invention are not particularly limited, as long as they can pattern an insulating layer. This method includes, for example, photoresist, screen printing,
Precision dispensing. Among them, it is preferable to use a photoresist that is advantageous for forming a fine pattern. Further, since acid resistance, solvent resistance, voltage resistance, and the like may be required in a later step, it is more preferable to use one having such characteristics. Preferred materials include thermosetting resists, and particularly preferred specific examples include cyclized rubber-based photoresists, thermosetting acrylic-based resists, melamine-based resists, and water-soluble colloid-based photoresists.

The thickness of the first mask pattern is preferably as thin as possible within the range having a withstand voltage with respect to the applied voltage at the time of forming the adhesive layer, in order to secure transferability, preferably from 0.5 to 5 mm.
μm, more preferably 0.5 to 3 μm, particularly preferably 0.5 to 1.5 μm. The first mask pattern used for the transfer member of the present invention is typically formed as follows. A mask is formed by a known method on the surface of the conductive substrate whose roughness has been adjusted. Next, the mask pattern is irradiated with ultraviolet rays through a photomask of a predetermined pattern, and is exposed and developed. Thus, a mask pattern of a predetermined pattern and a non-mask portion are formed on the surface of the conductive substrate.

Underlying Conductive Layer In the transfer member of the present invention, an underlying conductive layer is provided between the conductive substrate and the conductive layer. The material of this underlying conductive layer is
The material is not particularly limited as long as the material can be expected to have an effect of preventing corrosion of the conductive layer and having corrosion resistance. Such materials include, for example, nickel, tin, tin alloys, tin-nickel alloys, nickel-phosphorous alloys, nickel-boron alloys, and chromium. Among them, nickel is particularly preferable because it allows electrodeposition of a film having a low stress and has few pinholes. Further, the plating can be made to have a higher gloss by an additive such as a leveling agent. When the conductive layer is covered with a magnetic substance such as nickel, the high-frequency characteristics are improved.

If the thickness of the underlying conductive layer is thicker than the first mask pattern, the conductive layer can be completely covered and can be used in the present invention. Preferably, it is 0.1 to 1 μm thicker than the first mask pattern, more preferably 0.1 to 0.5 μm thicker.

From the viewpoint of covering the conductive layer, the thickness of the first mask pattern is generally 0.5 to 5 μm.
And preferably 0.5 to 1.5 μm,
This is preferable because the uniformity of the thickness of the coating composed of the base conductive layer and the barrier conductive layer is enhanced.

The underlying conductive layer is formed by an electrodeposition method. The use of the electrodeposition method is advantageous in that plating can be performed at low temperature, low corrosiveness, and in a short time, and the restrictions on the material of the transfer member are relaxed.

Formation of Conductive Layer The method of forming the conductive layer used in the transfer member of the present invention is not limited as long as it can be used for a normal printed wiring board. A typical example is a method in which a conductive layer is formed on a non-mask portion by an electrodeposition method. The formation of the conductive layer by the electrodeposition method can be performed according to a known plating method.

The material for forming the conductive layer is preferably a material from which a conductive thin film is formed by an electrodeposition method.
Silver, gold, gold alloy, nickel, chromium, zinc, tin, platinum,
Palladium and the like are mentioned, and preferably, for example, copper, silver and gold are used.

From the viewpoint of formation of fine wiring, the thickness of the conductive layer is preferably as thin as possible (typically because the resist is thin and becomes mushroom-like because the resist is thin).
Preferably, 5 to 30 μm, more preferably 5 to 20 μm
m, particularly preferably 5 to 15 μm.

Since the conductive layer is completely covered by the base conductive layer and the barrier conductive layer without any gap, a printed wiring board having high corrosion resistance and high reliability of the entire printed wiring board can be obtained even if a material which is susceptible to corrosion is used. .

Formation of Barrier Conductive Layer The barrier conductive layer used in the transfer member of the present invention covers the conductive layer together with the underlying conductive layer. In general, when a metal such as copper is used for the conductive layer in the transfer member, a phenomenon in which ions such as copper are eluted into the insulating resin, that is, a phenomenon called ion migration occurs, and the insulating layer is insulated in a high humidity environment. When the resin layer is relatively thin, about 10 μm, there is a possibility that the insulating property is adversely affected. In the transfer member of the present invention, the barrier conductive layer also has the effect of preventing such ion migration. Further, the barrier conductive layer also has an effect of improving the adhesion between the conductive layer and the adhesive layer.

As a material for forming the barrier conductive layer, preferably, a metal having a stable oxide film and hardly causing ion migration, specifically, nickel, chromium, tin, a tin alloy, a tin-nickel alloy, or the like is used. be able to. In this case, when the conductive layer is covered with a magnetic material such as nickel, the high-frequency characteristics are improved.

The thickness of the barrier conductive layer is not particularly limited. However, from the viewpoint of the uniformity of the thickness of the coating comprising the base conductive layer and the barrier conductive layer, the thickness is about the thickness of the second mask pattern, or preferably 0.1 to 3 μm. , More preferably 0.
It is 3 to 2 μm, particularly preferably 0.5 to 1 μm.

For the formation of the barrier conductive layer, an electrodeposition method is used because a thin film having good adhesion to the adhesive layer can be formed in a short time at a low temperature.

The material of the conductive substrate used in the transfer member of the conductive substrate present invention is not limited in particular as long as it has at least one surface conductive. Such materials include, for example, various metal plates and various insulators coated with metal, such as copper, nickel, stainless steel, iron, aluminum, 42 alloy, and resin films metallized with sputtering or the like. Can be. Preferably,
Copper, nickel, chromium, gold,
A material capable of depositing silver, platinum, tin, solder, and the like and capable of separating the deposited metal layer from the conductive substrate, specifically, for example, stainless steel, a titanium-based material, or the like is preferable.

Although the thickness of the conductive substrate is not particularly limited,
Generally, about 0.05 to 1.0 mm is preferable.

Formation of Adhesive Layer The adhesive layer used in the transfer member of the present invention can be typically formed on the surface of the barrier conductive layer by an electrodeposition method. The electrodeposition method is conventionally used as, for example, electrodeposition coating, and can be performed using an ionic electrodeposition liquid containing a film-forming material. Electrodeposition in the present invention can be performed according to a known electrodeposition method.

The material of the adhesive layer used in the transfer member of the present invention has an adhesive property at room temperature or by heating. The transfer member is pressed against the substrate to be transferred, and the conductive layer is adhered. There is no particular limitation as long as it can be fixed to the substrate to be transferred by the attachment layer. Preferably, the adhesive layer is an insulator in order to provide insulation between the wirings and between the transferred substrate and the wirings after the transfer. It is also preferable to use a substance that can be contained in the electrodeposition solution and electrodeposited, for example, an ionic polymer compound.

Preferred ionic polymer compounds for forming the insulating adhesive layer contained in the electrodeposition solution include, for example,
Examples include natural resins, acrylic resins, polyester resins, alkyd resins, maleated oil resins, polybutadiene resins, epoxy resins, polyamide resins, and polyimide resins. As the anionic polymer compound, those having an anionic group such as a carboxyl group,
Examples of the cationic polymer compound include those having a cationic group such as an amino group. In the present invention, an optimal ionic polymer compound can be appropriately selected according to the performance required for the adhesive layer. In addition, if necessary, a rosin-based compound,
A terpene-based or petroleum resin-based tackifier can be used.

The above polymer compound can be electrodeposited in a state of being neutralized by an alkaline substance or an acidic substance and solubilized in water, or in a state of being dispersed in water. The anionic polymer compound can be neutralized with, for example, amines such as trimethylamine, diethylamine and dimethylethanolamine, and inorganic alkalis such as ammonia and potassium hydroxide. The cationic polymer compound can be neutralized with, for example, an acid such as acetic acid, formic acid, propionic acid, and lactic acid.

The thickness of the pressure-sensitive adhesive layer is not particularly limited as long as the pressure-sensitive adhesive property and the required insulating property are satisfied, but is generally 1 to 100 μm, preferably 10 to 100 μm.
５０50 μm.

[0044]

EXAMPLE 1 A transfer member was prepared by the following steps using a thin plate (thickness: 0.1 mm) of stainless steel (SUS304CSP (H)) as a conductive substrate.

(1) Formation of First Mask Pattern A cyclized rubber-based negative photoresist (OMR85 35cP manufactured by Tokyo Ohka Kogyo Co., Ltd.) is applied on the conductive substrate for about 2 hours.
Apply to a thickness of μm and place in a clean oven at 85 ° C for 30
Pre-baked for minutes. After that, using a photomask having a predetermined pattern, exposure is performed under the following conditions, developed with a developing solution (OMR developing solution manufactured by Tokyo Ohka Kogyo Co., Ltd.), and rinsed (OMR rinsing solution manufactured by Tokyo Oka Kogyo Co., Ltd.) ). Next, this was post-baked in a clean oven at 145 ° C. for 30 minutes to form a first mask pattern having a thickness of 1 μm. Exposure condition Alignment exposure machine MAP-1200 manufactured by Dainippon Screen Mfg. Co., Ltd. Exposure time 5 seconds

(2) Formation of Second Mask Pattern On the first mask pattern, a positive photoresist made of a novolak-based material (OFP manufactured by Tokyo Ohka Kogyo Co., Ltd.)
R800) was applied to a thickness of about 2 μm, and prebaked in a clean oven at 80 ° C. for 30 minutes. Thereafter, using a photomask having a predetermined pattern, alignment exposure is performed under the following conditions, and a developing solution (manufactured by Tokyo Ohka Kogyo Co., Ltd.)
NMD-3 developer), washed with water, thickness 0.8 μm
Was formed. Exposure condition Alignment exposure machine Dainippon Screen Mfg. Co., Ltd. Exposure time 1 second

(3) Formation of Underlying Conductive Layer The conductive substrate on which the first and second mask patterns have been formed is immersed in a Watt nickel plating bath having the following composition while facing the electrolytic nickel anode. As a cathode, current was supplied for 7 minutes at a current density of 1 A / dm ² by a constant current power supply. As a result, the non-mask portion of the conductive substrate has a thickness of 1.4.
An underlying conductive layer made of a nickel plating of μm was formed. The composition of the Watts nickel plating bath (bath temperature _{50 ℃, pH4.0) NiSO 4 ·} 6H 2 O 300g / l NiCl 2 · 6H 2 O 40g / l H 3 BO 3 40g / l PC nickel A-1 (Uemura & ( Co., Ltd.) 10 ml / l PC Nickel A-2 (Uemura Industry Co., Ltd.) 1 ml / l

(4) Formation of Conductive Layer The conductive substrate was immersed in a copper sulfate plating bath having the following composition while facing the phosphorous copper anode, and the conductive substrate was used as a cathode.
It was energized for 25 minutes at a current density of ² A / dm ² by a DC power supply. As a result, a thickness of 1 on the non-mask portion of the conductive substrate.
A conductive layer made of 0 μm copper plating was formed. Composition of copper sulfate plating bath (bath temperature 25 ° C.) CuSO ₄ .5H ₂ O 75 g / l H ₂ SO ₄ 180 g / l HCl 0.15 ml / l (60 ppm as Cl ⁻ ) Cu-Board HA MU 10 ml / l (EBARA (Eugerite Co., Ltd.)

(5) Removal of Second Mask Pattern The conductive substrate after the formation of the conductive layer is immersed in acetone for 5 minutes.
The second mask pattern was dissolved and removed.

(6) Formation of Barrier Conductive Layer The conductive substrate is immersed in a nickel plating bath having the following composition facing the electrolytic nickel anode, and the conductive substrate is used as a cathode at a current of 1 A / dm ² by a constant current power supply. At a current density of 5 minutes. As a result, a barrier conductive layer made of nickel plating having a thickness of 1 μm and completely covering the conductive layer of the conductive substrate was formed. Watts composition of nickel plating bath (bath temperature _{50 ℃, pH4.0) NiSO 4 ·} 6H 2 O 300g / l NiCl 2 · 6H 2 O 40g / l H 3 BO 3 40g / l PC nickel A-1 (Uemura & ( Co., Ltd.) 10 ml / l PC Nickel A-2 (Uemura Industry Co., Ltd.) 1 ml / l

(7) Formation of adhesive layer (Preparation of anionic electrodeposition solution) (i) Production of polyimide varnish A 1-liter three-neck separable flask was equipped with a stainless steel squirrel stirrer, nitrogen introduction tube and stop. Attach a reflux condenser equipped with a cooling pipe with a ball to the trap with a cock. The separable flask was placed in a silicone bath equipped with a temperature controller and heated while flowing a nitrogen stream. The reaction temperature was indicated by bath temperature.

3,4,3'4'-benzophenonetetracarboxylic dianhydride (hereinafter referred to as BTDA) 32.2.
2 g (0.1 mol), bis (4- (3-aminophenoxy) phenyl) sulfone (m-BAPS) 21.63 g
(0.1 mol), 1.5 g of valerolactone (0.015
Mol), 2.4 g (0.03 mol) of pyridine, 200 g of N-methyl-2-pyrrolidone (hereinafter referred to as NMP) and 30 g of toluene, and stirred at room temperature for 30 minutes (200 rpm) in a silicon bath while passing nitrogen through. The temperature was raised to 180 ° C., and the reaction was carried out for 1 hour with stirring at 200 rpm. After removing 15 ml of the toluene-water distillate, the mixture was air-cooled, and 6.111 g (0.05 mol) of BTDA and 15.216 g of 3,5 diaminobenzoic acid (hereinafter referred to as DABz) were obtained.
(0.1 mol), 119 g of NMP and 30 g of toluene were added, and the mixture was stirred at room temperature for 30 minutes (200 rpm), then heated to 180 ° C. and heated and stirred to remove 15 ml of a toluene-water distillate. Thereafter, while removing the toluene-water distillate outside the system, the reaction was completed by heating at 180 ° C. and stirring for 3 hours. A polyimide varnish of 20% was obtained. Acid equivalent (The amount of polymer per COOH is 1554)
Was 70.

(Ii) Preparation of electrodeposition solution 100 g of polyimide varnish having a concentration of 20% was added to 3SN (NM).
P: tetrahydrothiophene-1,1-dioxide =
1: 3 (weight) mixed solution) 150 g, benzyl alcohol 75 g, methylmorpholine 5.0 g (neutralization ratio 200
%) And 30 g of water with stirring to prepare an aqueous electrodeposition solution.
The obtained aqueous electrodeposition solution had a polyimide content of 7.4% and a pH of 7.4.
8. It was a dark reddish brown transparent liquid.

(Electrodeposition) The conductive substrate having the conductive pattern was immersed in the above-mentioned anionic insulating electrodeposition solution while facing the stainless steel cathode (SUS430MA).
Using the conductive substrate as an anode, a DC power supply was applied for 3 minutes at a voltage of 100 V. After washing with water, it was dried on a hot plate at 80 ° C. for 3 minutes. As a result, a 10-μm-thick polyimide adhesive layer (electrodeposition coating) was formed on the barrier conductive layer of the conductive substrate.

(8) Transfer The transfer member obtained in the above steps was placed on a 50 μm-thick polyimide film (Cubton manufactured by DuPont) for 16 hours.
The conductive substrate was peeled off and transferred at 0 ° C. under a pressure of 1 kgf / cm ² . Thereafter, curing was performed at 350 ° C. for 1 hour in a nitrogen atmosphere. The thus obtained wiring board was subjected to a salt spray test under the following conditions, and the appearance was observed with an optical microscope. As a result, greenish blue due to the exposure of the copper plating layer was not observed, and good coverage was exhibited. Salt spray test conditions Spray liquid 5wt% NaCl aqueous solution Temperature 35 ° C Spray time 24hr

Example 2 In the step of forming the second mask pattern, a water-soluble colloid (PV
A) Using a negative photoresist made of a system material (FR14 manufactured by Fuji Pharmaceutical Co., Ltd.), development and rinsing are performed by immersion in pure water, and the steps of forming a base conductive layer and forming a barrier conductive layer are as follows. Using chrome plating under the conditions, and removing the second mask pattern by 3% of 80 ° C.
A printed wiring board was prepared in the same manner as in Example 1 except that the operation was performed with an aqueous sodium hydroxide solution. The obtained printed wiring board was subjected to the same salt spray test as in Example 1, and the appearance was observed with an optical microscope. As a result, greenish blue due to the exposure of the copper plating layer was not observed, and good coverage was exhibited. Chromium plating composition (50 ° C, 22Be ', 10A / dm
² for 30 seconds) Chromic anhydride 250g / l Sulfuric acid 2g / l

[0057]

According to the present invention described above, a wiring pattern in which a conductive layer is completely covered by a base conductive layer and a barrier layer on a transfer member is realized, and electroless plating after transfer is omitted. Is simplified, and damage to the transferred substrate is reduced. When the conductive layer is covered with a magnetic material such as Ni plating, the high-frequency characteristics are improved.

[Brief description of the drawings]

FIG. 1 is a schematic explanatory view of a conventional method for manufacturing a transfer member.

FIG. 2 is a schematic explanatory view showing one example of a method for manufacturing a transfer member of the present invention.

[Description of Signs] 1 conductive substrate 2 first mask pattern 3 non-mask portion 4 conductive layer 5 adhesive layer 6 substrate to be transferred 7 barrier conductive layer 8 second mask pattern 9 base conductive layer

Claims (8)

[Claims] 1. A step of forming an electrically insulating first mask pattern on the conductive surface of a conductive substrate having conductivity on at least one surface of the substrate; Forming an electrically insulating second mask pattern on the non-mask portion of the substrate on which the first and second mask patterns are formed; Forming a conductive layer on the underlying conductive layer by an electrodeposition method; removing the second mask pattern after forming the conductive layer; After removing the mask pattern, on the conductive layer,
Forming a barrier conductive layer by an electrodeposition method, and forming an adhesive layer on the barrier conductive layer; and forming at least the base conductive layer and the base conductive on the conductive substrate. Forming a patterned transfer layer formed by laminating the conductive layer completely covered by the layer and the barrier conductive layer, the barrier conductive layer and the adhesive layer, Production method. 2. A step of forming an electrically insulating first mask pattern on the conductive surface of the conductive substrate, the conductive substrate having conductive on at least one surface thereof; Forming an underlying conductive layer higher than the height of the first mask pattern by an electrodeposition method on the non-mask portion on the side where the mask pattern is formed; and forming an electrically insulating second mask on the first mask pattern. A step of forming an alignment of a pattern, a step of forming a conductive layer on the underlying conductive layer by an electrodeposition method, a step of removing the second mask pattern after the formation of the conductive layer, and a step of removing the second mask pattern. After removal, on the conductive layer,
Forming a barrier conductive layer by an electrodeposition method, and forming an adhesive layer on the barrier conductive layer; and forming at least the base conductive layer and the base conductive on the conductive substrate. Forming a patterned transfer layer formed by laminating the conductive layer completely covered by the layer and the barrier conductive layer, the barrier conductive layer and the adhesive layer, Production method. 3. The method according to claim 1, wherein the formation of the second mask pattern is performed using a solvent-soluble resist or an alkali-soluble resist. 4. The method according to claim 1, wherein the formation of the underlying conductive layer and the barrier conductive layer is performed using a method selected from nickel plating, chromium plating, tin plating, and tin alloy plating. The method described in. 5. The method according to claim 1, wherein the formation of the conductive layer is performed using a method selected from copper plating, silver plating, gold plating and gold alloy plating. 6. The method according to claim 1, wherein the formation of the adhesive layer is performed using an electrodeposition method. 7. A transfer member manufactured by using the method according to claim 1. Description: 8. A printed wiring board manufactured by using the method according to claim 1.